STMicroelectronics L9362013TR

Overview

L9362013TR from STMicroelectronics is a quad low-side power switch IC for automotive body control modules, featuring four independent 3A-rated N-channel DMOS output stages with integrated Zener clamping, current feedback (1.45–1.65 mA/A), SPI diagnostic interface, and comprehensive protection including short-circuit-to-GND (SCG), open-load (OL), overtemperature (TOFF = 155–190°C), and undervoltage lockout (VCCmin = 3.0 V).

For engineers reviewing the L9362013TR datasheet, L9362013TR pinout, L9362013TR application, or L9362013TR equivalent, this device supports high-reliability load driving in 12V/24V automotive systems requiring real-time fault reporting, EMI-controlled switching (dV/dt ≤ 2.25 V/μs), parallel output configuration, and precise current monitoring via CFB pins.

Technical Context

The L9362013TR implements four identical low-side driver channels, each controlled by an inverted CMOS-compatible input (NON1–NON4) with Schmitt-trigger thresholds (VINH ≥ 0.7×VCC, VINL ≤ 0.2×VCC) and internal pull-ups. Each channel integrates a Zener clamp (VCLPA = 45–60 V), dV/dt-controlled turn-on/off (OVRp1/OVRn), and thermal shutdown with independent junction temperature sensing.

Diagnostic functionality is implemented via a dedicated 8-bit failure register accessible through a 3 MHz SPI interface (SDI/SDO/CLK/NCS), supporting priority-based failure storage (SCB > SCG > OL), automatic FR_RESET on first CLK rising edge, and tristate SDO output synchronized to NCS. Current feedback is analog and linear (CURlin1 ≤ ±0.2% at 0.4–1.0 A), referenced to VCC and stable across –40°C to +150°C.

Key Specifications

Pinout & Package

Package: PowerSO-36 (exposed thermal pad soldered to PGND frame). Dimensions: 16.0 × 14.5 × 1.1 mm (L × W × H), RoHS-compliant, AEC-Q100 qualified for automotive use.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar quad low-side driver applications.

Compared with TPIC2101QPWPRQ1 and BD82001FV-M, the L9362013TR delivers higher integration (quad + CFB + SPI FR + dV/dt control in one PowerSO-36 package), superior diagnostic granularity, and automotive-grade thermal robustness - making it optimal for centralized body electronics requiring compact, data-rich load management.

Availability

L9362013TR is available at Aetrix Electronics and suitable for automotive body control modules, seat actuation systems, headlight leveling mechanisms, and engine cooling fan control requiring stable component supply, AEC-Q100 qualification, and long-term production continuity.

Supply support for L9362013TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing automotive-grade ICs, microcontrollers, power devices, and sensors for industrial, automotive, and consumer markets.

The L9362013TR belongs to ST's "Automotive Power Switches" product line, engineered specifically for intelligent, protected low-side driving in 12V/24V vehicle networks - emphasizing functional safety readiness, EMI resilience, and diagnostic transparency.

FAQ

What is the maximum continuous current per channel, and how is it thermally sustained?

Each channel supports 3.0 A continuous current at TJ ≤ 125°C with proper PCB copper area (≥6 cm² heatsink reduces Rthja to 35 °C/W). The 250–500 mΩ RDS(on) at 150°C ensures minimal conduction loss, and the 155–190°C overtemperature shutdown prevents thermal runaway under overload conditions.

How does the current feedback (CFB) output interface with a microcontroller ADC?

The CFB pin sinks current (IOUT × 1.45–1.65 mA/A) - connect a precision shunt resistor (e.g., 1 kΩ) from CFB to VCC to generate 1.45–1.65 V per ampere. This voltage is ratiometric to VCC and stable across temperature, enabling direct ADC measurement without calibration drift.

Can multiple L9362013TR outputs be paralleled, and what design considerations apply?

Yes - OUT1/OUT2/OUT3/OUT4 pairs can be paralleled per channel to increase current capacity. Match CFB resistors and ensure symmetrical PCB layout. Do not mix channels across devices; paralleling requires shared NONx, CFBx, and PGND connections to maintain balanced current sharing and fault detection integrity.

What failure types are reported via SPI, and how is priority enforced in the Failure Register?

The 8-bit register reports SCB (short-to-battery/overtemp), SCG (short-to-ground), and OL (open-load) per channel. Priority is hardwired: SCB bits overwrite SCG bits, which overwrite OL bits. A rising edge on NONx triggers static OL reporting; sporadic OL faults update FR immediately, ensuring no critical event is masked by lower-priority entries.