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Home > Products > Integrated Circuits (ICs) > Power Management (PMIC) > Power Distribution Switches, Load Drivers

STMicroelectronics L9733XP

Name: L9733XP
Brand: STMicroelectronics
SKU: L9733XP
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: L9733XP

Manufacturer:: STMicroelectronics

Category:: Power Distribution Switches, Load Drivers

Package:: 28-SSOP (0.295", 7.50mm Width) Exposed Pad

Datasheet:: L9733XP.pdf

Description:: IC PWR DRVR N-CHAN 1:8 PWRSSO28

Quantity:: RFQ Add To RFQ list

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Product details

Overview

L9733XP from STMicroelectronics is an AEC-Q100 qualified automotive octal self-configuring low/high-side driver IC in PowerSSO-28 package. It integrates eight independently configurable MOSFET drivers with R_ON(max) = 0.7 Ω @ 25 °C, 1 A minimum current limit per channel, and integrated 50 V low-side / –14 V high-side voltage clamping. It supports SPI-controlled operation and PWM control on outputs 6–8 for body electronics load switching.

For engineers reviewing the L9733XP datasheet, L9733XP pinout, L9733XP application, or L9733XP equivalent, key selection considerations include self-configuring topology across all eight channels, thermal shutdown per output, open-load/short-circuit diagnostics in latched or unlatched mode, and compatibility with 4.5–18 V battery supply under automotive transients including jump-start (up to 27 V/1 min).

Technical Context

The L9733XP implements a monolithic medium-current driver architecture with internal charge pump eliminating external capacitors, enabling robust high-side drive without bootstrap complexity. Each of the eight outputs autonomously detects load configuration (low- or high-side) via internal sensing and adapts gate drive accordingly.

It features 16-bit SPI interface supporting daisy-chaining, real-time fault reporting (open load, short-to-GND/Vbat, overcurrent), and independent thermal shutdown per channel. Outputs 6–8 accept external PWM signals (IN6–IN8) for dynamic duty-cycle control while retaining full diagnostic coverage.

Key Specifications

Parameter	Value and Actual Design Meaning
Supply range	4.5 V to 18 V V_BAT; supports automotive cold-crank (down to 3.5 V) and jump-start (up to 27 V/1 min)
R_ON (max)	0.7 Ω @ T_j = 25 °C; ensures <1.4 W conduction loss at 1.5 A per channel
Current limit	1 A minimum per channel; enables reliable driving of solenoids, valves, and lamps up to 12 W
Clamp voltage	Min. 50 V (low-side), max. –14 V (high-side); protects against inductive kickback and reverse-battery events
Operating temp	–40 °C to +150 °C junction; validated for under-hood and powertrain applications
Fault modes	Open load, short-to-GND, short-to-V_BAT, overcurrent - each with latched/unlatched reporting via SPI
Interface	16-bit SPI (CS/SCLK/DI/DO); supports multi-device daisy-chain for reduced MCU I/O count

Pinout & Package

Package: PowerSSO-28 (exposed pad), thermally enhanced with exposed slug soldered to PCB ground plane for optimal thermal dissipation (R_th(j-case) = 3 °C/W).

Pin/Terminal	Circuit Role	Design Meaning
1 VDD	5 V logic supply input	Powers internal logic and SPI interface; decoupling required near pin
2 SCLK	SPI clock input	Accepts up to 5 MHz clock; synchronous command/data transfer
3 CS	SPI chip select (active low)	Enables SPI communication; supports daisy-chained configurations
4–5, 6–7, 8–9, 10–11, 18–19, 20–21, 22–23, 24–25 SRCx/DRNx	Source/drain terminals for outputs 1–8	Self-configuring pair per channel; no external configuration needed for low/high-side use
12–13, 16 IN6–IN8	PWM enable inputs	Direct analog PWM control for outputs 6–8; bypasses SPI for fast modulation
14 VBAT	Main battery supply	Input for high-side drive path and internal charge pump; rated to 40 V abs max
15 GND	Analog ground reference	Common return for logic and driver sections; connected to exposed slug
17 RES	Active-low reset input	Hardware reset of SPI registers and fault latches; asynchronous assertion
26 DI	SPI data input	Receives 16-bit command register (output states + configuration bits)
27 DO	SPI data output	Reports 16-bit fault register (per-channel status flags)
28 VDO	Logic interface supply	Sets input threshold levels (0.3V_DO/0.7V_DO) for all digital pins

Key Features

Feature	Design Value
Self-configuring topology	Each of 8 outputs auto-detects low/high-side load connection and adapts drive polarity and protection behavior
Integrated charge pump	Eliminates need for external bootstrap capacitor; enables true high-side drive from single V_BAT rail
Dual-control flexibility	SPI command + dedicated PWM inputs (IN6–IN8) allow mixed static/dynamic control strategies
Per-channel diagnostics	Independent open-load, short-circuit, and overcurrent detection with selectable latch behavior per output
Automotive transient resilience	Validated operation across jump-start (27 V/1 min), load dump (40 V), and cold-crank (3.5 V)

Applications

Body Control Module (BCM)

HVAC Actuator Control

Use Scenario: Driving multiple solenoid valves and relays in door lock, lighting, and window lift subsystems.

IC Role / Device Role / Timing Role: Octal driver providing independent ON/OFF control and real-time fault feedback to MCU via SPI.

Use Value: Reduces BOM count by replacing eight discrete drivers; eliminates manual configuration errors through self-sensing topology.

Use Scenario: Controlling blend door actuators, blower motors, and heater element relays in automotive HVAC systems.

IC Role / Device Role / Timing Role: High-side/low-side configurable driver with PWM-capable outputs 6–8 for variable-speed actuator control.

Use Value: Enables precise position control of stepper/servo actuators using PWM-modulated high-side drive without external gate drivers.

Powertrain Auxiliary Loads

Chassis Electronics

Use Scenario: Switching fuel pump relays, purge valves, and EGR solenoids in engine management systems.

IC Role / Device Role / Timing Role: Fault-tolerant driver with clamped outputs and thermal shutdown per channel for safety-critical loads.

Use Value: Meets ASIL-B readiness via per-output diagnostics and latchable fault reporting-reducing software validation burden.

Use Scenario: Managing suspension damping valves, steering column locks, and brake light relays in chassis control units.

IC Role / Device Role / Timing Role: Self-configuring driver handling mixed high-side (valves) and low-side (LEDs) loads within same footprint.

Use Value: Simplifies PCB layout by removing external configuration resistors and enabling unified driver placement across diverse load types.

Equivalent & Alternatives

The following parts are listed as comparable options for similar octal automotive driver applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
TLE9201SE	Fixed high-side only; no self-configuration; requires external bootstrap for high-side drive	Lacks low-side capability and autonomous topology detection; limited to pure high-side loads	Select when only high-side driving is needed and board space allows external bootstrap components
VNQ7E100AJ	Eight fixed low-side drivers only; no high-side support; higher R_ON (1.3 Ω max)	Cannot drive high-side loads like fuel pumps or heated mirrors without external circuitry	Prefer for cost-sensitive BCM designs where all loads are grounded-switched and thermal margin is sufficient

Compared with TLE9201SE and VNQ7E100AJ, the L9733XP uniquely delivers per-channel self-configuration, integrated charge pump, and dual-mode (SPI + PWM) control-enabling fewer external components, broader load compatibility, and simplified firmware across mixed high/low-side architectures.

Availability

L9733XP is available at Aetrix Electronics and suitable for automotive body control modules, HVAC actuator systems, and powertrain auxiliary load switching requiring stable component supply, AEC-Q100 compliance, and long-term production continuity.

Supply support for L9733XP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader specializing in automotive, industrial, and power management solutions, with broad portfolio certification to AEC-Q100 and ISO 26262 standards.

The L9733XP belongs to ST's automotive smart-power driver family, designed specifically for centralized load management in body electronics and chassis control units where mixed high/low-side topology, diagnostic depth, and transient resilience are critical.

FAQ

What is the maximum continuous output current per channel?

The L9733XP guarantees a minimum current limit of 1 A per channel across temperature (–40 °C to +125 °C ambient). At 25 °C junction, it supports up to 2.5 A in current-limit mode before triggering overcurrent protection, with thermal shutdown activating above 151 °C junction temperature to prevent damage.

Does the L9733XP require external components for high-side operation?

No external bootstrap capacitor is required. The L9733XP integrates an internal charge pump that generates the gate-drive voltage needed for high-side MOSFET operation directly from the V_BAT rail, simplifying design and reducing bill-of-materials count compared to discrete high-side drivers.

How does self-configuration work across outputs 1–8?

Each output pair (SRCx/DRNx) autonomously senses load connection topology during power-up and initial SPI command. If the load is connected between DRNx and ground, it configures as low-side; if between V_BAT and SRCx, it configures as high-side-automatically adjusting gate drive, clamping, and fault detection logic without MCU intervention.

Can multiple L9733XP devices be controlled with a single SPI bus?

Yes. The L9733XP supports daisy-chained SPI configuration: the DO (data out) of one device connects to the DI (data in) of the next, with shared SCLK and CS lines. A 16-bit command shifts through the chain, and fault data is read back in reverse order, enabling scalable multi-driver control with minimal MCU pin usage.

L9733XP Specifications

Product attributes: Attribute value

Manufacturer:: STMicroelectronics

Package/Case:: 28-SSOP (0.295", 7.50mm Width) Exposed Pad

Series:: -

Packaging:: Tube

Product Status:: Active

Switch Type:: General Purpose

Number of Outputs:: 8

Ratio - Input:Output:: 1:8

Output Configuration:: High Side or Low Side

Output Type:: N-Channel

Interface:: SPI

Voltage - Load:: 4.5V ~ 18V

Voltage - Supply (Vcc/Vdd):: 4.5V ~ 5.5V

Current - Output (Max):: 1A

Rds On (Typ):: 700mOhm (Max)

Input Type:: Non-Inverting

Features:: PWM Input

Fault Protection:: Open Load Detect, Over Temperature

Operating Temperature:: -40°C ~ 125°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: PowerSSO-28 Exposed Pad

L9733XP FAQ

1.How can I place an order for L9733XP through Aetrix?

Please submit a Request for Quotation (RFQ) for L9733XP on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for L9733XP reliable?

The price and inventory of L9733XP are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for L9733XP is usually 5 days.

3.What payment methods are accepted for L9733XP?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for L9733XP transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for L9733XP?

L9733XP orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your L9733XP order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for L9733XP?

For technical support, including L9733XP datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your L9733XP requirements.

6.How does Aetrix verify that L9733XP is sourced from the original manufacturer or authorized distributors?

All L9733XP products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that L9733XP meets industry standards.

7.What is the process for return or replacement of L9733XP?

All L9733XP units undergo pre-shipment inspection (PSI). If there is an issue with L9733XP, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The L9733XP part is unused and in its original packaging.

Return procedure for L9733XP:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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