STMicroelectronics LD56100DPU28R

Overview

LD56100DPU28R from STMicroelectronics is a 1 A ultra-low-noise, low-dropout linear voltage regulator delivering 2.8 V output with ±1% accuracy across –40 °C to +85 °C, 120 mV typical dropout at 1 A (V_OUT = 3.3 V), and 13 µV_RMS noise (10 Hz–100 kHz). It operates from 1.8–5.5 V input, features logic-controlled shutdown (<0.1 µA standby), internal soft-start, and optional output discharge - optimized for camera modules and battery-powered mobile systems.

For engineers reviewing the LD56100DPU28R datasheet, LD56100DPU28R pinout, LD56100DPU28R application, or LD56100DPU28R equivalent, key selection criteria include dropout performance at 1 A load, ultra-low noise in imaging power rails, thermal foldback behavior under short-circuit, and DFN8 (1.2 × 1.6 mm) PCB footprint compatibility with ceramic output capacitors ≥1 µF.

Technical Context

The LD56100DPU28R implements a bandgap-referenced error amplifier with internal current-limit foldback and thermal shutdown (170 °C trip, 20 °C hysteresis). Its LCON pin selects between 1 A (LCON = VIN/floating) and 0.5 A (LCON = GND) current limit thresholds, enabling configurable fault protection without external components.

It integrates an EN-controlled startup sequence with 60 µs turn-on time (to 95% V_OUT) and an optional NMOS discharge switch (enabled in DPU variants) that pulls VOUT to GND when EN is low - critical for fast power sequencing in multi-rail camera subsystems.

Key Specifications

Pinout & Package

LD56100DPU28R is housed in a thermally enhanced DFN8 package (1.2 mm × 1.6 mm, 0.4 mm pitch), with exposed thermal pad connected to GND on PCB for efficient heat dissipation in space-constrained camera modules.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar LDO regulator applications.

Compared with XC6210B282MR-G and ADP165ACBZ-2.8-R7, LD56100DPU28R uniquely combines configurable current limiting (via LCON), integrated discharge, and DFN8 footprint - making it optimal for compact, multi-function camera modules requiring robust fault handling and precise power sequencing.

Availability

LD56100DPU28R is available at Aetrix Electronics and suitable for mobile phones, tablets, and battery-powered systems requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant DFN packaging.

Supply support for LD56100DPU28R includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, specializing in power management, microcontrollers, and analog ICs for industrial, automotive, and consumer markets.

LD56100 belongs to ST's ultra-low-noise LDO portfolio designed specifically for imaging, sensor, and portable RF applications where PSRR, dropout, and quiescent current directly impact signal integrity and battery longevity.

FAQ

What is the minimum input voltage required for stable 2.8 V output at 1 A load?

The LD56100DPU28R requires VIN ≥ V_OUT + V_DROP. With 130 mV typical dropout at 1 A and 2.8 V output, minimum input is 2.93 V. Absolute minimum specified is 1.8 V, but full 1 A capability is only guaranteed above 2.93 V per electrical characteristics table.

Can the LD56100DPU28R be used with a 0.47 µF output capacitor?

No. The device requires ≥1 µF ceramic output capacitance (X5R/X7R) for loop stability, as confirmed in Section 6.4 of DS12423. Using 0.47 µF risks oscillation or poor transient response due to insufficient phase margin.

How does the LCON pin affect short-circuit protection behavior?

When LCON = GND, short-circuit current folds back to 180 mA (vs. 400 mA when LCON = VIN), and current limit drops to 600–800 mA. This allows safer operation under partial shorts while preserving thermal margin in confined PCB layouts.

Is the thermal pad (Pin 8) electrically isolated or must it be connected to GND?

Pin 8 is the exposed thermal pad and must be soldered to a GND copper pour on the PCB, as explicitly stated in Table 1 ("Thermal pad GND Connect to GND on the PCB"). Leaving it floating compromises thermal performance and violates absolute maximum ratings for junction temperature.