STMicroelectronics LD56100DPU30R

Overview

LD56100DPU30R from STMicroelectronics is a 1 A ultra-low-noise, low-dropout linear voltage regulator delivering 3.0 V output with ±1% accuracy across -40 °C to +85 °C, 120 mV typical dropout at 1 A/3.3 V, 13 µV_RMS noise (10 Hz–100 kHz), and 70 dB PSRR at 1 kHz. It serves as the primary power rail for camera modules and RF front-ends in portable battery-powered systems.

For engineers reviewing the LD56100DPU30R datasheet, LD56100DPU30R pinout, LD56100DPU30R application, or LD56100DPU30R equivalent, this page delivers verified electrical specifications, DFN8 package layout, thermal and current-limiting behavior, soft-start timing, and real-world use cases in mobile imaging and low-power wireless subsystems.

Technical Context

The LD56100DPU30R integrates a bandgap reference, bias generator, and foldback current-limit protection controlled via the LCON pin-selecting either 1 A (LCON = VIN) or 0.5 A (LCON = GND) current limit. Its internal soft-start circuit limits inrush current without external components, achieving 60 µs turn-on time to 95% of nominal output.

It features logic-controlled shutdown (EN pin), optional output discharge MOSFET (enabled in this DPU30R variant), and stability with ≥1 µF ceramic C_OUT. Thermal shutdown activates at 170 °C with 20 °C hysteresis, and ESD robustness meets 2 kV HBM and 500 V CDM standards.

Key Specifications

Pinout & Package

LD56100DPU30R is housed in a thermally enhanced DFN8 (1.2 × 1.6 mm) package with exposed thermal pad connected to GND. The 0.4 mm pitch, 8-pin layout supports high-density PCB routing and efficient heat dissipation in thin-profile mobile designs.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar low-noise LDO applications.

Compared with XC6210B302MR-G and ADP160AUJZ-3.0-R7, the LD56100DPU30R uniquely combines 1 A capability, 13 µV_RMS noise, integrated discharge, and DFN8 footprint-making it the sole fit for space-constrained, high-fidelity imaging rails demanding full specification compliance without design compromises.

Availability

LD56100DPU30R is available at Aetrix Electronics and suitable for mobile camera modules, wireless earbud audio subsystems, and industrial barcode scanners requiring stable component supply with guaranteed long-term manufacturability.

Supply support for LD56100DPU30R includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing analog, power, microcontroller, and sensor solutions for industrial, automotive, and consumer markets.

The LD56100 belongs to ST's high-precision, ultra-low-noise LDO family engineered specifically for noise-sensitive analog and imaging subsystems in battery-constrained portable electronics.

FAQ

What is the minimum input voltage required for stable 3.0 V output at 1 A load?

The LD56100DPU30R requires VIN ≥ VOUT + VDROP = 3.0 V + 0.125 V = 3.125 V minimum for full 1 A operation. At lower input voltages, output current is reduced per the dropout curve-e.g., at VIN = 3.0 V, maximum sustainable load is ~600 mA (per Figure 12). Input must also stay within absolute max rating of 7 V.

Can the LD56100DPU30R be used with a 2.2 µF X7R output capacitor instead of 1 µF?

Yes-design guidelines specify COUT ≥ 1 µF with ESR between 3–300 mΩ. A 2.2 µF X7R capacitor meets both requirements and improves transient response margin while maintaining loop stability. Larger values up to 22 µF are explicitly supported per Table 5, with no risk of oscillation.

How does the LCON pin affect short-circuit protection behavior?

When LCON = VIN, short-circuit current folds back to 400 mA (typ.) at VOUT = 0 V; when LCON = GND, it folds back to 180 mA (typ.). This dual-threshold design allows designers to match protection level to downstream component ratings-e.g., using LCON = GND for fragile MEMS microphones, LCON = VIN for robust camera sensors.

Is the thermal pad (Pin 8) electrically isolated or connected internally?

The thermal pad is internally connected to GND and must be soldered to a PCB GND plane. Per DS12423 page 14, "Thermal pad GND Connect to GND on the PCB" - failure to connect it degrades thermal resistance from 80 °C/W to >150 °C/W and risks thermal shutdown under 1 A load at elevated ambient temperatures.