STMicroelectronics LD59030DTPU18R

Overview

LD59030DTPU18R from STMicroelectronics is a 300 mA ultra-low-dropout linear voltage regulator delivering 1.8 V output with ±1 % accuracy at 25 °C, 135 mV typical dropout at 300 mA, and 28 µA quiescent current at no load - designed for space-constrained, battery-powered systems requiring stable low-noise power in automotive and industrial edge nodes.

For engineers reviewing the LD59030DTPU18R datasheet, LD59030DTPU18R pinout, LD59030DTPU18R application, or LD59030DTPU18R equivalent, key selection criteria include guaranteed 300 mA output under 1.5–5.5 V input, logic-controlled shutdown (<0.03 µA standby), ceramic-capacitor compatibility (≥0.47 µF), thermal protection, and DFN4 1×1 package integration.

Technical Context

The LD59030DTPU18R integrates a bandgap reference, error amplifier, and internal PMOS pass transistor in a feedback loop optimized for stability with low-ESR ceramic capacitors. Its architecture supports ultra-low dropout via adaptive gate drive and includes fold-back current limiting to prevent thermal runaway during overload.

It features an internal soft-start circuit (145 µs turn-on time) and optional output discharge MOSFET activated by EN low - both implemented without external components. The enable logic interface (EN pin) directly controls active/shutdown states with defined VIH/VIL thresholds across –40 °C to 125 °C.

Key Specifications

Pinout & Package

LD59030DTPU18R uses the DFN4 1×1 mm package with exposed thermal pad tied to GND for enhanced thermal dissipation (R_thJA = 140 °C/W). Pin 1 (OUT) and Pin 4 (IN) are positioned diagonally to minimize trace inductance; thermal pad must be soldered to a GND plane for optimal thermal performance.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar LDO regulator applications.

Compared with XC6210B182MR-G and BD3572EFJ-ME2, LD59030DTPU18R uniquely combines 300 mA capability, sub-0.03 µA shutdown, integrated soft-start, and output discharge in a 1 mm² footprint - making it optimal for compact, battery-critical, and thermally constrained designs where rail sequencing and fast wake-up are required.

Availability

LD59030DTPU18R is available at Aetrix Electronics and suitable for wearable health monitors, automotive cabin sensor nodes, industrial wireless gateways, and smart meter RTC rails requiring stable component supply, long-lifecycle assurance, and consistent parametric performance.

Supply support for LD59030DTPU18R includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing silicon solutions for automotive, industrial, and consumer markets since 1987.

The LD59030 belongs to ST's high-accuracy, ultra-low-I_Q LDO family targeting battery-powered and thermally constrained applications - engineered to replace legacy regulators in space- and efficiency-critical designs without redesign.

FAQ

What is the minimum input voltage required for regulation at 300 mA load?

The LD59030DTPU18R requires VIN ≥ VOUT + VDROP to maintain regulation. With 1.8 V output and 200 mV max dropout at 300 mA (–40 °C to 85 °C), minimum input is 2.0 V. At 25 °C, 135 mV typical dropout allows regulation down to 1.935 V - verified per Table 6 and electrical characteristics.

Can the LD59030DTPU18R operate with a 0.22 µF output capacitor?

No. The datasheet specifies a minimum 0.47 µF ceramic capacitor (X5R/X7R) for stability across temperature and load (Figure 15). Using 0.22 µF risks oscillation or poor transient response, especially at high temperatures or light loads - confirmed by stability-area analysis in Section 6.4.

Is the thermal pad electrically isolated or connected internally?

The thermal pad is internally connected to GND, as stated in Table 1 ("Thermal pad – Connect to GND") and Note in Table 4. It must be soldered to a PCB GND plane for both thermal dissipation and electrical reference integrity - not left floating or connected to other nets.

Does the output discharge feature activate automatically during shutdown?

Yes. When EN is driven low, the internal discharge MOSFET turns on and actively pulls VOUT to GND through a 120 Ω path (RON spec in Table 5), discharging external COUT. This behavior is inherent to the "D" suffix (e.g., LD59030DTPU18R) and requires no external components - detailed in Section 6.2.