STMicroelectronics LD59030DTPU28R

Overview

LD59030DTPU28R from STMicroelectronics is a 2.8 V, 300 mA ultra-low-dropout linear voltage regulator in DFN4 1×1 mm package, featuring 135 mV typical dropout at full load, ±1% output accuracy at 25°C, and 28 µA typical quiescent current at no load. It integrates logic-controlled shutdown, internal soft-start, thermal protection, and optional output discharge-designed for space-constrained, battery-powered systems requiring stable low-noise power.

For engineers reviewing the LD59030DTPU28R datasheet, LD59030DTPU28R pinout, LD59030DTPU28R application, or LD59030DTPU28R equivalent, key selection criteria include dropout performance at 300 mA, 0.47 µF ceramic capacitor compatibility, EN pin logic thresholds, thermal resistance (140 °C/W), and auto-discharge functionality enabled by the "D" suffix.

Technical Context

The LD59030DTPU28R employs a bandgap-referenced op-amp control loop with internal bias generator and thermal foldback protection. Its architecture supports stable operation with 0.47–22 µF ceramic output capacitors and maintains regulation across -40°C to +125°C junction temperature.

Enable functionality uses TTL-compatible logic levels (VEN(H) ≥ 1 V, VEN(L) ≤ 0.4 V), triggering <0.03 µA standby current in shutdown. The integrated output discharge MOSFET (enabled in "D" variants like this part) actively pulls VOUT to GND when EN is low, eliminating external discharge circuitry.

Key Specifications

Pinout & Package

LD59030DTPU28R is housed in a thermally enhanced DFN4 1×1 mm package with exposed thermal pad tied to GND. The 4-pin layout supports high-density PCB placement and efficient heat dissipation (R_thJA = 140 °C/W).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar LDO regulator applications.

Compared with XC6210B282MR-G and RT9013-28GB, LD59030DTPU28R uniquely combines 300 mA capability, 155 mV dropout, integrated discharge, and DFN4 thermal efficiency-making it optimal for compact, high-reliability battery systems demanding full-feature LDO control.

Availability

LD59030DTPU28R is available at Aetrix Electronics and suitable for wearable electronics, automotive body electronics, industrial wireless sensors, and portable medical devices requiring stable component supply with guaranteed long-term availability.

Supply support for LD59030DTPU28R includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing silicon solutions for automotive, industrial, and consumer markets since 1987.

The LD59030 belongs to ST's high-accuracy, ultra-low-IQ LDO family targeting space- and power-constrained battery-operated applications-emphasizing minimal dropout, ceramic capacitor compatibility, and integrated protection features.

FAQ

What is the minimum input voltage required for stable 2.8 V output at 300 mA?

The LD59030DTPU28R requires VIN ≥ VOUT + VDROP. With a maximum dropout of 230 mV at 300 mA and -40°C to +85°C, the minimum input is 2.8 V + 0.23 V = 3.03 V. At 25°C, typical dropout is 155 mV, so 2.955 V suffices. Input below 3.03 V risks dropout and regulation loss under worst-case conditions.

Does LD59030DTPU28R require an external discharge resistor?

No. The "D" in the part number indicates the integrated output discharge MOSFET is enabled. When EN is pulled low, this internal FET actively discharges the output capacitor to GND-eliminating the need for external resistors or FETs and reducing BOM count and PCB footprint.

Can LD59030DTPU28R operate with a 0.22 µF ceramic output capacitor?

No. The datasheet specifies a minimum COUT of 0.47 µF for stability across temperature, load, and input voltage variations. Using 0.22 µF risks oscillation or poor transient response, especially with X5R/X7R dielectrics. Always adhere to the 0.47–22 µF range shown in Figure 15 (Stability Area vs. COUT/ESR).

Is the thermal pad electrically isolated or connected internally?

The thermal pad is internally connected to the substrate and must be soldered to the PCB's GND plane. It serves both thermal dissipation (reducing R_thJA) and ESD robustness (rated for 1000 V HBM). Leaving it floating or connecting it to a non-GND net violates the design and compromises safety and thermal performance.