NXP Semiconductors LD6806CX4/12H,315

Overview

LD6806CX4/12H from NXP Semiconductors is a 1.2 V, 200 mA ultra-low-dropout linear regulator in WLCSP4 package with 60 mV dropout at full load, 30 µV RMS output noise (10 Hz–100 kHz), and 55 dB PSRR at 1 kHz-designed for power-sensitive mobile handset baseband and RF subsystems.

For engineers reviewing the LD6806CX4/12H datasheet, LD6806CX4/12H pinout, LD6806CX4/12H application, or LD6806CX4/12H equivalent, this page delivers verified electrical specs, thermal behavior, enable threshold validation, shutdown timing, and package-specific layout guidance for high-density portable designs.

Technical Context

The LD6806CX4/12H uses a PMOS pass transistor architecture enabling 60 mV dropout at 200 mA while maintaining stability with only 1 µF ceramic output capacitance. Its internal voltage reference and error amplifier deliver ±0.5% output accuracy at +25°C and ±3% over −40°C to +85°C ambient.

It integrates active-high enable logic with VIH = 1.4 V min and VIL = 0.4 V max, thermal shutdown at 160°C with 20 K hysteresis, and current limiting that sustains 300 mA peak output before foldback-critical for transient load handling in battery-powered SoC rails.

Key Specifications

Pinout & Package

LD6806CX4/12H is housed in a 0.76 mm × 0.76 mm × 0.47 mm wafer-level chip-scale package (WLCSP4) with 0.4 mm pitch and four solder bumps. The package is Pb-free, RoHS-compliant, and halogen-free.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar LDO regulator applications.

Compared with TPS7A0512PDBVR and MCP1700T-1202E/TT, LD6806CX4/12H offers the smallest footprint, lowest dropout, and integrated enable + thermal + current protection-making it optimal for space-constrained, battery-critical, and robustly managed power domains.

Availability

LD6806CX4/12H is available at Aetrix Electronics and suitable for mobile handset power management, wearable sensor hubs, Bluetooth LE SoC core supplies, and RF front-end biasing requiring stable component supply across high-volume production cycles.

Supply support for LD6806CX4/12H includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and mobile markets.

The LD6806 series was designed specifically for ultra-miniaturized, low-noise, high-efficiency power regulation in portable consumer electronics-emphasizing WLCSP integration, battery longevity, and RF coexistence.

FAQ

What is the minimum input voltage required for LD6806CX4/12H to regulate 1.2 V output at 200 mA?

The LD6806CX4/12H requires a minimum input voltage of 1.26 V to maintain regulation at 200 mA load, based on its typical 60 mV dropout voltage. At lower input voltages, the device enters dropout mode and VOUT drops linearly with VIN. This enables operation from partially discharged single-cell Li-ion batteries down to ~3.0 V system input after upstream DC-DC conversion.

Does LD6806CX4/12H require an external output capacitor, and what type is recommended?

Yes, LD6806CX4/12H requires a minimum 1.0 µF X7R ceramic capacitor at the OUT pin for stability, with ESR between 5 mΩ and 500 mΩ. The datasheet specifies ±30% tolerance over −40°C to +125°C, and recommends X7R dielectric to meet full temperature range performance. Smaller values (≥0.7 µF) may work but reduce phase margin and increase startup/shutdown time.

How does the high-ohmic output state function when LD6806CX4/12H is disabled?

When LD6806CX4/12H is disabled via the EN pin (VEN < 0.4 V), the OUT pin enters a high-impedance (3-state) condition-neither sourcing nor sinking significant current. This prevents backfeeding into the LDO from downstream circuitry and enables safe OR-ing with other power sources. It differs from P-suffix variants, which actively pull OUT to GND via an internal transistor.

What is the thermal resistance (R_th(j-a)) of LD6806CX4/12H, and how does PCB layout affect it?

The LD6806CX4/12H has a typical junction-to-ambient thermal resistance of 130 K/W on a two-layer PCB. Layout significantly impacts this value: connecting all four bumps to large copper areas (especially GND and IN) and using multiple vias to inner ground/power planes reduces effective R_th(j-a). Avoid solder mask over the die area, and ensure thermal relief is minimized on GND connections to sustain 200 mA continuous operation at +85°C ambient.

Can LD6806CX4/12H be used with a 1.8 V input supply, and what is its PSRR performance at that voltage?

Yes, LD6806CX4/12H operates with input voltages from 2.3 V to 5.5 V, so 1.8 V is below its specified minimum and not supported. At its valid minimum VIN of 2.3 V, PSRR remains −55 dB at 1 kHz per datasheet testing conditions (VIN = VO(nom) + 1 V). PSRR degrades slightly at lower VIN due to reduced headroom for error amplifier operation, but maintains >−45 dB up to 10 kHz across the full input range.