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NXP Semiconductors LD6806CX4/33H,315
- Part No.:
- LD6806CX4/33H,315
- Manufacturer:
- NXP Semiconductors
- Package:
- 4-XFBGA, WLCSP
- Datasheet:
-
LD6806CX4/33H,315.pdf
- Description:
- IC REG LINEAR 3.3V 200MA 4WLCSP
- Quantity:
- Payment:
- Shipping:
Inventory:2,394
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Product details
Overview
LD6806CX4/33H,315 from NXP Semiconductors is a 3.3 V, 200 mA ultra-low-dropout linear regulator in WLCSP4 package with 60 mV dropout at full load, 30 µVRMS output noise (10 Hz–100 kHz), and active-HIGH enable control-designed for power-sensitive mobile handset and media player subsystems requiring stable low-noise bias.
For engineers reviewing the LD6806CX4/33H,315 datasheet, LD6806CX4/33H,315 pinout, LD6806CX4/33H,315 application, or LD6806CX4/33H,315 equivalent, this page delivers verified package mapping (WLCSP4, 0.76 mm × 0.76 mm), thermal resistance (130 K/W), shutdown temperature (160 °C), PSRR (−55 dB @ 1 kHz), and high-ohmic output state during disable-critical for battery-powered portable designs with tight PCB area constraints.
Technical Context
The LD6806CX4/33H,315 implements a PMOS pass transistor architecture enabling 60 mV dropout at 200 mA, supporting input voltages from 2.3 V to 5.5 V while maintaining 3.3 V ±2% output accuracy across −40 °C to +85 °C ambient. Its internal reference generator and feedback loop ensure <0.01%/mA load regulation error and 0.1%/V line regulation error.
Thermal protection triggers at 160 °C junction temperature with 20 K hysteresis, and overcurrent limiting sustains safe operation up to 600 mA short-circuit current. The device enters ultra-low-quiescent mode (<1.0 µA) when EN is pulled LOW, and features integrated 10 kV HBM ESD protection on all pins.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Output voltage | 3.3 V nominal, ±2% tolerance over temperature and load-ensures stable core/bias rail for 3.3 V logic and analog interfaces |
| Dropout voltage | 60 mV typical at 200 mA-enables >97% efficiency at VIN = 3.36 V, critical for single-cell Li-ion systems |
| PSRR | −55 dB at 1 kHz-suppresses switching noise from upstream DC-DC converters feeding the LDO input |
| Output noise | 30 µVRMS (10 Hz–100 kHz)-meets low-noise requirements for RF front-end and ADC reference supplies |
| Enable threshold | VIH = 1.4 V min, VIL = 0.4 V max-compatible with 1.8 V and 3.3 V GPIO without level-shifting |
| Quiescent current | 70–250 µA active, ≤1.0 µA shutdown-extends battery life in always-on sensor and standby circuits |
| Thermal resistance | Rth(j-a) = 130 K/W-requires minimal copper pour for thermal management in compact mobile PCBs |
Pinout & Package
LD6806CX4/33H,315 uses a 0.76 mm × 0.76 mm × 0.47 mm wafer-level chip-scale package (WLCSP4) with 0.4 mm pitch and four solder bumps arranged in a 2×2 grid. Package is Pb-free, RoHS-compliant, and halogen-free.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A1 | GND | Primary ground reference; must connect to solid internal ground plane for optimal noise and thermal performance |
| A2 | EN | Active-HIGH enable input; drives internal pass transistor; requires ≥1.4 V to activate regulator |
| B1 | OUT | Regulated 3.3 V output; high-ohmic (3-state) when disabled-prevents backfeeding into downstream circuitry |
| B2 | IN | Input supply (2.3–5.5 V); requires ≥1 µF ceramic capacitor with 5–500 mΩ ESR for stability |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low dropout | 60 mV at 200 mA enables operation with minimal headroom-ideal for single-cell battery systems where VIN may dip near VOUT |
| Low-noise regulation | 30 µVRMS output noise supports sensitive analog blocks like audio codecs and RF synthesizers without additional filtering |
| Fast start-up | 200 µs turn-on time allows rapid power sequencing in multi-rail mobile SoC platforms |
| High-ohmic disable state | Outputs enter high-impedance mode when EN = LOW-eliminates leakage paths and prevents unintended loading of shared rails |
| Integrated protection | Thermal shutdown (160 °C), current limiting (600 mA), and 10 kV HBM ESD protect against real-world board-level stress events |
Applications
| Mobile Phone Baseband Power | Media Player Audio Codec Supply |
|---|---|
Use Scenario: Powers baseband processor I/O and memory interface rails in slim smartphone designs where board space and thermal dissipation are constrained. IC Role / Device Role / Timing Role: Low-noise, fast-response LDO delivering clean 3.3 V bias to high-speed digital interfaces with tight voltage tolerance. Use Value: Enables reliable operation under dynamic load transients while minimizing PCB footprint via 0.76 mm × 0.76 mm WLCSP4 package. | Use Scenario: Supplies analog front-end and DAC sections in portable music players requiring ultra-low noise to preserve SNR. IC Role / Device Role / Timing Role: Precision voltage regulator providing ripple-free 3.3 V reference for audio signal chain components. Use Value: 30 µVRMS noise ensures >100 dB SNR in 24-bit audio playback without external LC filtering. |
| Wireless Headset Bluetooth SoC Core | IoT Sensor Hub Bias Rail |
Use Scenario: Powers Bluetooth radio and MCU core in compact wireless earbuds where battery life and thermal envelope are critical. IC Role / Device Role / Timing Role: Enable-controlled LDO delivering regulated 3.3 V with sub-1 µA shutdown current during sleep modes. Use Value: 1.0 µA quiescent current in disable state extends shelf life and reduces average power draw in duty-cycled BLE applications. | Use Scenario: Provides stable 3.3 V supply to MEMS accelerometers, environmental sensors, and low-power microcontrollers in battery-operated IoT nodes. IC Role / Device Role / Timing Role: High-PSRR LDO rejecting noise from shared switching regulators powering multiple subsystems. Use Value: −55 dB PSRR at 1 kHz prevents coupling of DC-DC ripple into precision sensor measurements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar LDO regulator applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Torex XC6219B332MR-G | 300 mA rated, 150 mV dropout at 200 mA, SOT-25 package (2.9 mm × 2.8 mm) | Larger footprint and higher dropout reduce suitability for space-constrained mobile designs | Select when higher output current margin or legacy SMT assembly compatibility is required over miniaturization |
| Ricoh RP114K331D-TR-F | 200 mA rated, 120 mV dropout at 200 mA, DFN1006-4 package (1.0 mm × 0.6 mm) | Higher dropout increases power loss; lacks thermal shutdown hysteresis and 10 kV HBM rating | Choose only if cost sensitivity outweighs thermal robustness and noise performance requirements |
Compared with XC6219B332MR-G and RP114K331D-TR-F, LD6806CX4/33H,315 delivers superior miniaturization (0.76 mm² vs ≥1.2 mm²), lower dropout (60 mV vs ≥120 mV), and stronger system-level protection-making it optimal for next-generation portable electronics demanding both size and reliability.
Availability
LD6806CX4/33H,315 is available at Aetrix Electronics and suitable for mobile phone handsets, cordless telephones, and personal digital devices requiring stable component supply with guaranteed long-term sourcing and consistent parametric performance.
Supply support for LD6806CX4/33H,315 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and consumer markets.
The LD6806 series belongs to NXP's ultra-low-noise, miniaturized LDO portfolio-designed specifically for power management in space-constrained portable electronics where low dropout, fast transient response, and high PSRR are mandatory.
FAQ
What is the maximum input voltage rating for LD6806CX4/33H,315?
The LD6806CX4/33H,315 supports an absolute maximum input voltage of +6.0 V for transient conditions up to 4 ms, with recommended operating range from 2.3 V to 5.5 V. Exceeding 6.0 V risks permanent damage per the Absolute Maximum Ratings table in the NXP datasheet. For continuous operation, keep VIN within the 2.3–5.5 V window to ensure specified dropout, noise, and regulation performance of LD6806CX4/33H,315.
Does LD6806CX4/33H,315 require an external output capacitor, and what value is recommended?
Yes, LD6806CX4/33H,315 requires an external output capacitor for stability. The datasheet specifies a minimum of 1.0 µF ceramic capacitor with ESR between 5 mΩ and 500 mΩ; X7R dielectric is recommended to maintain capacitance across −40 °C to +125 °C. Using less than 1.0 µF risks oscillation or poor transient response. The LD6806CX4/33H,315 application diagram confirms 1 µF as the standard value for both input and output decoupling.
What is the thermal shutdown behavior of LD6806CX4/33H,315?
LD6806CX4/33H,315 activates thermal shutdown at 160 °C junction temperature and remains latched off until junction temperature drops by 20 K (to ≤140 °C) due to its built-in hysteresis. This prevents cycling during thermal overload. Recovery is automatic upon cooling-no external reset is needed. The 130 K/W junction-to-ambient thermal resistance means proper PCB copper layout is essential to avoid premature shutdown under 200 mA load in enclosed environments.
How does the high-ohmic output state function in LD6806CX4/33H,315 when disabled?
When the EN pin of LD6806CX4/33H,315 is driven LOW, the output enters a true high-impedance (3-state) condition-neither sourcing nor sinking significant current. This prevents backfeeding into the output node and eliminates leakage paths in multi-rail systems. Unlike P-type alternatives with pull-down transistors, LD6806CX4/33H,315's H-suffix variant maintains open-circuit behavior, making it ideal for isolated power domains in portable devices.
Is LD6806CX4/33H,315 compatible with lead-free reflow processes?
Yes, LD6806CX4/33H,315 is fully compatible with lead-free reflow soldering. As a WLCSP4 package with thickness <1.6 mm and volume <350 mm³, it follows J-STD-020C Class 3 peak temperature profile (260 °C). NXP confirms all WLCSP packages are lead-free and specifies reflow profiles in AN10439. Moisture sensitivity level (MSL) must be observed per packaging label to prevent popcorning during reflow-LD6806CX4/33H,315 requires baking if exposed beyond MSL limits before assembly.
LD6806CX4/33H,315 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 4-XFBGA, WLCSP
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Output Configuration:
- Positive
- Output Type:
- Fixed
- Number of Regulators:
- 1
- Voltage - Input (Max):
- 5.5V
- Voltage - Output (Min/Fixed):
- 3.3V
- Voltage - Output (Max):
- -
- Voltage Dropout (Max):
- 0.1V @ 200mA
- Current - Output:
- 200mA
- Current - Quiescent (Iq):
- 100 µA
- Current - Supply (Max):
- 250 µA
- PSRR:
- 55dB (1kHz)
- Control Features:
- Enable
- Protection Features:
- Over Current, Over Temperature
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 4-WLCSP (0.76x0.76)
LD6806CX4/33H,315 FAQ
1.How can I place an order for LD6806CX4/33H,315 through Aetrix?
Please submit a Request for Quotation (RFQ) for LD6806CX4/33H,315 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LD6806CX4/33H,315 reliable?
The price and inventory of LD6806CX4/33H,315 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LD6806CX4/33H,315 is usually 5 days.
3.What payment methods are accepted for LD6806CX4/33H,315?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LD6806CX4/33H,315 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LD6806CX4/33H,315?
LD6806CX4/33H,315 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LD6806CX4/33H,315 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LD6806CX4/33H,315?
For technical support, including LD6806CX4/33H,315 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LD6806CX4/33H,315 requirements.
6.How does Aetrix verify that LD6806CX4/33H,315 is sourced from the original manufacturer or authorized distributors?
All LD6806CX4/33H,315 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LD6806CX4/33H,315 meets industry standards.
7.What is the process for return or replacement of LD6806CX4/33H,315?
All LD6806CX4/33H,315 units undergo pre-shipment inspection (PSI). If there is an issue with LD6806CX4/33H,315, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LD6806CX4/33H,315 part is unused and in its original packaging.
Return procedure for LD6806CX4/33H,315:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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