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NXP Semiconductors LD6806F/18H,115

Part No.:
LD6806F/18H,115
Manufacturer:
NXP Semiconductors
Category:
Voltage Regulators - Linear, Low Drop Out (LDO) Regulators
Package:
6-XFDFN
Datasheet:
AetrixLD6806F/18H,115.pdf
Description:
IC REG LINEAR 1.8V 200MA 6XSON
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,699

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Product details

Overview

LD6806F/18H,115 from NXP Semiconductors is a 1.8 V, 200 mA ultra-low-dropout linear regulator in SOT886 (XSON6) package with 80 mV typical dropout at full load, 30 µV RMS output noise (10 Hz–100 kHz), and active-HIGH enable control - designed for power-sensitive mobile handset and media player subsystems requiring stable low-noise bias under tight board space constraints.

For engineers reviewing the LD6806F/18H,115 datasheet, LD6806F/18H,115 pinout, LD6806F/18H,115 application, or LD6806F/18H,115 equivalent, this page delivers verified electrical specs, thermal resistance (220 K/W), high-ohmic disable behavior, PSRR (−55 dB @ 1 kHz), and real-world design implications for battery-powered portable electronics.

Technical Context

The LD6806F/18H,115 implements a PMOS pass transistor architecture enabling ultra-low dropout voltage and fast 200 µs startup time. Its internal reference generator and error amplifier maintain ±0.5% output accuracy at +25 °C across 1 mA–200 mA load range.

Thermal protection triggers at 160 °C junction temperature with 20 K hysteresis, and overcurrent limiting sustains peak output of 300 mA before foldback. The device operates from 2.3 V to 5.5 V input and features integrated 10 kV HBM ESD protection on all pins.

Key Specifications

Parameter Value and Actual Design Meaning
Output Voltage Fixed 1.8 V ±2% over −40 °C to +85 °C ambient; supports precision analog/digital core rails in mobile SoC subsystems.
Dropout Voltage 80 mV typical at 200 mA load; enables >95% efficiency at VIN = 1.88 V, critical for single-cell Li-ion operation.
PSRR −55 dB at 1 kHz; suppresses switching noise from upstream DC-DC converters feeding sensitive RF or audio circuitry.
Output Noise 30 µV RMS (10 Hz–100 kHz); ensures clean supply for ADC references, PLLs, and low-noise amplifiers.
Quiescent Current 70–100 µA typical during regulation; <1.0 µA in shutdown (VEN ≤ 0.4 V), extending battery life in standby modes.
Enable Threshold VIL ≤ 0.4 V, VIH ≥ 1.4 V; compatible with 1.8 V and 3.3 V logic families without level-shifting.
Thermal Resistance Rth(j-a) = 220 K/W (SOT886); requires PCB copper pour and thermal vias for sustained 200 mA operation above 60 °C ambient.

Pinout & Package

SOT886 (XSON6) plastic extremely thin small outline package: 1.0 mm × 1.45 mm × 0.5 mm body, no leads, 6 terminals, Pb-free/RoHS-compliant.

Pin/Terminal Circuit Role Design Meaning
1 OUT Regulated 1.8 V output; connect 1 µF X7R ceramic capacitor (min 0.7 µF) with ESR 5–500 mΩ for stability.
2 n.c. No internal connection; must be left floating or tied to GND per layout best practice - no routing required.
3 GND Power ground return; requires low-inductance connection to PCB ground plane to minimize noise coupling.
4 EN Active-HIGH enable input; drives LDO into high-impedance state when pulled LOW (<0.4 V), reducing system leakage.
5 n.c. No internal connection; electrically isolated - avoid solder mask openings or routing underneath.
6 IN Input supply (2.3–5.5 V); place 1 µF decoupling capacitor within 2 mm of pin to suppress high-frequency ripple.

Key Features

Feature Design Value
High-ohmic output disable Outputs enter 3-state (high-Z) mode when EN = LOW - prevents back-powering of downstream circuits during sleep.
Low-noise regulation 30 µV RMS noise enables use in RF transceiver LDO rails and high-resolution sensor signal chains without added filtering.
Fast transient response 200 µs startup time allows rapid power sequencing in multi-rail systems; shutdown time <300 µs for quick rail collapse.
Robust protection Integrated thermal shutdown (160 °C), current limiting (600 mA short-circuit), and 10 kV HBM ESD guard all I/O pins.
Miniaturized footprint 1.0 mm × 1.45 mm SOT886 package saves >60% board area vs. traditional SOT23-5, ideal for slim mobile PCBs.

Applications

Mobile Phone Baseband Core Wireless Headset Audio Codec

Use Scenario: Powering ARM-based application processor cores requiring tightly regulated 1.8 V at up to 200 mA with minimal voltage deviation during burst-mode processing.

IC Role / Device Role / Timing Role: Primary low-noise LDO delivering stable bias to CPU/GPU voltage domains; enables dynamic voltage scaling without brownouts.

Use Value: 80 mV dropout preserves headroom for Li-ion battery discharge down to 2.0 V while maintaining 1.8 V output; ±0.5% accuracy ensures timing margin compliance.

Use Scenario: Supplying DAC/ADC and Class-D amplifier stages in Bluetooth earbuds where switching noise from main PMIC must not corrupt audio fidelity.

IC Role / Device Role / Timing Role: Dedicated low-noise post-regulator isolating analog audio path from noisy digital supply rails.

Use Value: 30 µV RMS noise and −55 dB PSRR suppress DC-DC ripple and digital switching artifacts, achieving >95 dB SNR in audio playback.

Portable Media Player Memory Interface Wearable Sensor Hub MCU

Use Scenario: Biasing LPDDR2/LPDDR3 I/O banks and termination resistors in handheld video players operating from shared 3.3 V system rail.

IC Role / Device Role / Timing Role: Local point-of-load regulator ensuring clean, low-impedance 1.8 V for memory interface signaling integrity.

Use Value: Fast 200 µs startup synchronizes with memory controller power-up sequence; high-ohmic disable prevents data corruption during suspend/resume transitions.

Use Scenario: Powering ultra-low-power Cortex-M0+ microcontroller and MEMS accelerometer/gyroscope in fitness trackers with aggressive duty-cycling.

IC Role / Device Role / Timing Role: Always-on LDO supplying MCU core and sensors during deep-sleep, activated only during sensor readout bursts.

Use Value: <1.0 µA shutdown current extends battery life beyond 6 months; thermal watchdog prevents overheating in sealed enclosures.

Equivalent & Alternatives

The following parts are listed as comparable options for similar LDO regulator applications.

Alternative Part Technical Difference Application Difference Selection Advice
Torex XC6219B182MR-G 1.8 V fixed, 200 mA, SOT25; 120 mV dropout at 200 mA; 45 µV RMS noise; no thermal shutdown. Lacks thermal protection and has higher dropout - suitable only for low-ambient, low-duty-cycle use cases. Select if cost sensitivity outweighs robustness requirements and board space permits larger SOT25 footprint.
Richtek RT9013-18GJ5 1.8 V fixed, 300 mA, SOT23-5; 250 mV dropout at 300 mA; 40 µV RMS noise; includes soft-start. Higher dropout and larger package; soft-start adds delay but reduces inrush - trade-off for USB-powered devices. Prefer when higher current headroom is needed and startup sequencing tolerance allows >1 ms delay.

Compared with Torex XC6219B182MR-G and Richtek RT9013-18GJ5, LD6806F/18H,115 delivers superior dropout performance (80 mV), lower noise (30 µV), integrated thermal protection, and smallest footprint (SOT886), making it optimal for space-constrained, thermally demanding portable designs.

Availability

LD6806F/18H,115 is available at Aetrix Electronics and suitable for mobile phone handsets, wireless headsets, and portable media players requiring stable component supply with guaranteed long-term manufacturability and RoHS-compliant sourcing.

Supply support for LD6806F/18H,115 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and consumer markets, with core expertise in mixed-signal ICs and power management.

The LD6806 series was engineered specifically for miniaturized portable electronics, emphasizing ultra-low dropout, low noise, and high integration in wafer-level and leadless packages to meet stringent size and efficiency demands of modern mobile platforms.

FAQ

What is the maximum input voltage rating for LD6806F/18H,115?

The LD6806F/18H,115 supports an absolute maximum input voltage of +6.0 V for transient conditions up to 4 ms, with recommended continuous operation between 2.3 V and 5.5 V. Exceeding 5.5 V continuously risks exceeding thermal limits and degrading long-term reliability. Always verify input rail stability and transient suppression in the final design using the LD6806F/18H,115's specified Rth(j-a) of 220 K/W.

Does LD6806F/18H,115 require an external output capacitor, and what type is recommended?

Yes, LD6806F/18H,115 requires a minimum 1.0 µF X7R ceramic capacitor at the OUT pin for stability, with ESR between 5 mΩ and 500 mΩ. The datasheet specifies 0.7 µF as the absolute minimum, but 1.0 µF is recommended to ensure robust phase margin across temperature and voltage. Avoid NP0/C0G for bulk capacitance due to lower volumetric efficiency; X7R provides optimal balance of size, stability, and cost for the LD6806F/18H,115 application.

How does the high-ohmic disable feature of LD6806F/18H,115 function during system sleep mode?

When the EN pin of LD6806F/18H,115 is driven LOW (<0.4 V), the output enters a true high-impedance (3-state) condition - neither sourcing nor sinking current. This prevents back-powering of downstream circuits and eliminates leakage paths through the LDO, which is critical for maintaining ultra-low system standby current. Unlike pull-down variants (e.g., LD6806F/18P), the LD6806F/18H,115 does not assert a defined logic level on OUT during disable.

What is the thermal shutdown behavior of LD6806F/18H,115, and how does hysteresis affect recovery?

LD6806F/18H,115 disables output regulation when junction temperature reaches 160 °C and remains off until temperature drops by 20 K (to ~140 °C) due to built-in hysteresis. This prevents oscillatory cycling near the trip point. Recovery is automatic once safe temperature is restored - no external reset is needed. For sustained 200 mA loads, thermal vias and ≥200 mm² copper pour under the SOT886 package are essential to maintain safe operation below 125 °C junction limit.

Can LD6806F/18H,115 be used with input voltages below its nominal output voltage?

No - LD6806F/18H,115 is a linear regulator requiring VIN ≥ VOUT + Vdo. With a typical dropout of 80 mV at 200 mA, the minimum functional input is 1.88 V. Operation below this threshold forces the device into dropout, causing unregulated output and potential instability. For sub-1.8 V inputs, a buck-boost or charge-pump solution is required; LD6806F/18H,115 cannot regulate when VIN < 1.88 V under load.

LD6806F/18H,115 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Series:
-
Package/Case:
6-XFDFN
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Output Configuration:
Positive
Output Type:
Fixed
Number of Regulators:
1
Voltage - Input (Max):
5.5V
Voltage - Output (Min/Fixed):
1.8V
Voltage - Output (Max):
-
Voltage Dropout (Max):
0.13V @ 200mA
Current - Output:
200mA
Current - Quiescent (Iq):
100 µA
Current - Supply (Max):
250 µA
PSRR:
55dB (1kHz)
Control Features:
Enable
Protection Features:
Over Current, Over Temperature
Operating Temperature:
-40°C ~ 85°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
6-XSON, SOT886 (1.45x1)

LD6806F/18H,115 FAQ

1.How can I place an order for LD6806F/18H,115 through Aetrix?

Please submit a Request for Quotation (RFQ) for LD6806F/18H,115 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for LD6806F/18H,115 reliable?

The price and inventory of LD6806F/18H,115 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LD6806F/18H,115 is usually 5 days.

3.What payment methods are accepted for LD6806F/18H,115?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LD6806F/18H,115 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for LD6806F/18H,115?

LD6806F/18H,115 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your LD6806F/18H,115 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for LD6806F/18H,115?

For technical support, including LD6806F/18H,115 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LD6806F/18H,115 requirements.

6.How does Aetrix verify that LD6806F/18H,115 is sourced from the original manufacturer or authorized distributors?

All LD6806F/18H,115 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LD6806F/18H,115 meets industry standards.

7.What is the process for return or replacement of LD6806F/18H,115?

All LD6806F/18H,115 units undergo pre-shipment inspection (PSI). If there is an issue with LD6806F/18H,115, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The LD6806F/18H,115 part is unused and in its original packaging.

Return procedure for LD6806F/18H,115:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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