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Home > Products > Integrated Circuits (ICs) > Power Management (PMIC) > Voltage Regulators - Linear, Low Drop Out (LDO) Regulators

NXP Semiconductors LD6806F/33P,115

Name: LD6806F/33P,115
Brand: NXP Semiconductors
SKU: LD6806F/33P,115
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: LD6806F/33P,115

Manufacturer:: NXP Semiconductors

Category:: Voltage Regulators - Linear, Low Drop Out (LDO) Regulators

Package:: 6-XFDFN

Datasheet:: LD6806F/33P,115.pdf

Description:: IC REG LINEAR 3.3V 200MA 6XSON

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Product details

Overview

LD6806F/33P,115 from NXP Semiconductors is a 3.3 V, 200 mA ultra-low-dropout linear regulator in SOT886 (XSON6) package with 80 mV dropout at full load, 30 µV_RMS output noise (10 Hz–100 kHz), and active-high enable pin. It features low-ohmic pull-down during disable, thermal shutdown, overcurrent protection, and operates from 2.3 V to 5.5 V input-designed for power-sensitive mobile handset core logic rails.

For engineers reviewing the LD6806F/33P,115 datasheet, LD6806F/33P,115 pinout, LD6806F/33P,115 application, or LD6806F/33P,115 equivalent, key selection criteria include its 3.3 V fixed output, 220 K/W junction-to-ambient thermal resistance, 1.0 µA shutdown quiescent current, 55 dB PSRR at 1 kHz, and compatibility with 1 µF X7R ceramic output capacitors per NXP's stability requirements.

Technical Context

The LD6806F/33P,115 implements a PMOS pass transistor architecture enabling ultra-low dropout voltage and high PSRR. Its internal reference generator feeds an error amplifier controlling the pass device, while dedicated thermal and overcurrent protection circuits trigger shutdown at 160 °C and limit peak output current to 300 mA.

Unlike the H-suffix variants, the P-suffix provides an integrated pull-down transistor (R_pd = 100 Ω typical) that actively discharges the output node during disable, eliminating external discharge circuitry. The enable threshold is defined by V_IL ≤ 0.4 V and V_IH ≥ 1.4 V, independent of input voltage.

Key Specifications

Parameter	Value and Actual Design Meaning
Output Voltage	Fixed 3.3 V ±2% over −40 °C to +85 °C ambient; ensures stable core supply for 3.3 V I/O interfaces.
Dropout Voltage	80 mV typical at 200 mA; enables operation with VIN as low as 3.38 V, maximizing battery runtime in portable systems.
Quiescent Current	155 µA typical at 200 mA load; 0.1 µA typical in shutdown; critical for always-on subsystems.
Output Noise	30 µV_RMS (10 Hz–100 kHz); supports noise-sensitive analog circuits like ADC references or RF bias rails.
PSRR	−55 dB at 1 kHz; suppresses switching noise from upstream DC-DC converters feeding the LDO input.
Enable Threshold	V_IH ≥ 1.4 V, V_IL ≤ 0.4 V; compatible with 1.8 V and 3.3 V GPIO logic without level-shifting.
Thermal Resistance	R_th(j-a) = 220 K/W; requires PCB copper pour and vias to ground plane for safe 200 mA continuous operation at +85 °C.

Pinout & Package

SOT886 (XSON6) plastic extremely thin small outline package, no leads, 6-terminal, body size 1.0 mm × 1.45 mm × 0.5 mm, Pb-free and RoHS compliant.

Pin/Terminal	Circuit Role	Design Meaning
OUT	Regulator output voltage	Delivers regulated 3.3 V; must be decoupled with ≥1.0 µF X7R ceramic capacitor per NXP stability guidelines.
n.c.	Not connected	No internal connection; leave unconnected on PCB; no routing or soldering required.
GND	Supply ground	Main return path for load current and internal bias; requires low-impedance connection to PCB ground plane.
EN	Device enable input; active HIGH	Drives internal pass transistor; asserts when ≥1.4 V applied; pulls OUT low via 100 Ω internal FET when deasserted.
n.c.	Not connected	No internal connection; leave unconnected on PCB; no routing or soldering required.
IN	Supply voltage input	Accepts 2.3 V–5.5 V; requires local 1 µF input capacitor to suppress source impedance effects.

Key Features

Feature	Design Value
Low-ohmic output stage on disable	Integrated 100 Ω pull-down transistor actively discharges output capacitance, preventing floating or unintended wake-up in sleep modes.
Ultra-low-noise regulation	30 µV_RMS output noise enables clean power for precision analog blocks without external filtering.
Fast start-up time	200 µs to reach 95% of 3.3 V output enables rapid system wake-up from deep sleep states.
Robust ESD protection	10 kV HBM rating protects against handling damage during assembly and field operation.
Thermal and overcurrent protection	Shuts down at 160 °C junction temperature with 20 K hysteresis; limits peak output to 300 mA to prevent latch-up.

Applications

Mobile Phone Baseband Core Supply	Wireless Headset Audio Codec Bias
Use Scenario: Powering ARM-based baseband processor cores requiring tightly regulated 3.3 V at up to 200 mA with minimal voltage droop during burst transmission. IC Role / Device Role / Timing Role: Primary low-noise, low-dropout post-regulator delivering stable 3.3 V from a shared 4.2 V Li-ion battery rail. Use Value: 80 mV dropout extends usable battery range by ~150 mV; 55 dB PSRR rejects noise from adjacent RF power amplifiers.	Use Scenario: Providing clean bias voltage to stereo audio codec ICs in Bluetooth headsets where EMI immunity and low standby current are critical. IC Role / Device Role / Timing Role: Low-noise LDO supplying analog VDDA and digital VDDD rails for 24-bit audio conversion. Use Value: 30 µV_RMS noise prevents audible hiss; 1.0 µA shutdown current preserves battery life during multi-day idle periods.
Portable Media Player SD Card Interface	Wearable Fitness Tracker Sensor Hub
Use Scenario: Regulating 3.3 V for SDIO interface logic in compact media players where board space limits use of larger packages. IC Role / Device Role / Timing Role: Fixed-output LDO powering SD card controller I/O pins with fast enable/disable control synchronized to host access cycles. Use Value: SOT886 footprint (1.0 × 1.45 mm) saves >60% area vs. SOT23; 200 µs start-up aligns with SD command latency budgets.	Use Scenario: Supplying 3.3 V to MEMS accelerometer, gyroscope, and BLE radio subsystems in wrist-worn trackers with aggressive power cycling. IC Role / Device Role / Timing Role: Enable-controlled LDO managing power domains for sensor fusion algorithms running on ultra-low-power MCU. Use Value: Active pull-down on disable prevents back-powering of sensors; 0.1 µA shutdown current enables multi-week battery life.

Mobile Phone Baseband Core Supply

Wireless Headset Audio Codec Bias

Use Scenario: Powering ARM-based baseband processor cores requiring tightly regulated 3.3 V at up to 200 mA with minimal voltage droop during burst transmission.

IC Role / Device Role / Timing Role: Primary low-noise, low-dropout post-regulator delivering stable 3.3 V from a shared 4.2 V Li-ion battery rail.

Use Value: 80 mV dropout extends usable battery range by ~150 mV; 55 dB PSRR rejects noise from adjacent RF power amplifiers.

Use Scenario: Providing clean bias voltage to stereo audio codec ICs in Bluetooth headsets where EMI immunity and low standby current are critical.

IC Role / Device Role / Timing Role: Low-noise LDO supplying analog VDDA and digital VDDD rails for 24-bit audio conversion.

Use Value: 30 µV_RMS noise prevents audible hiss; 1.0 µA shutdown current preserves battery life during multi-day idle periods.

Portable Media Player SD Card Interface

Wearable Fitness Tracker Sensor Hub

Use Scenario: Regulating 3.3 V for SDIO interface logic in compact media players where board space limits use of larger packages.

IC Role / Device Role / Timing Role: Fixed-output LDO powering SD card controller I/O pins with fast enable/disable control synchronized to host access cycles.

Use Value: SOT886 footprint (1.0 × 1.45 mm) saves >60% area vs. SOT23; 200 µs start-up aligns with SD command latency budgets.

Use Scenario: Supplying 3.3 V to MEMS accelerometer, gyroscope, and BLE radio subsystems in wrist-worn trackers with aggressive power cycling.

IC Role / Device Role / Timing Role: Enable-controlled LDO managing power domains for sensor fusion algorithms running on ultra-low-power MCU.

Use Value: Active pull-down on disable prevents back-powering of sensors; 0.1 µA shutdown current enables multi-week battery life.

Equivalent & Alternatives

The following parts are listed as comparable options for similar LDO regulator applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
Torex XC6206P332MR-G	3.3 V fixed, 150 mA, SOT-25; 150 mV dropout at 150 mA; no enable pin; no pull-down.	Lacks EN control and active discharge; suitable only for always-on rails.	Select when enable functionality and output discharge are not required and load current ≤150 mA.
Richtek RT9193-33GB	3.3 V fixed, 300 mA, SOT-23-5; 200 mV dropout at 300 mA; active-high EN; no integrated pull-down.	Higher dropout and no internal discharge; requires external 10 kΩ pull-down resistor for same function.	Select when higher output current is needed and board space allows SOT-23-5; add external resistor for discharge.

Compared with XC6206P332MR-G and RT9193-33GB, the LD6806F/33P,115 delivers lower dropout (80 mV vs. ≥150 mV), integrated pull-down (eliminating BOM cost and layout area), and tighter output tolerance (±2% vs. ±3%), making it optimal for space-constrained, enable-driven portable systems.

Availability

LD6806F/33P,115 is available at Aetrix Electronics and suitable for mobile handset power management, wireless audio subsystems, and wearable sensor hub designs requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.

Supply support for LD6806F/33P,115 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and consumer markets.

The LD6806 series belongs to NXP's ultra-low-noise, low-dropout regulator product line, engineered specifically for miniaturized portable electronics demanding high PSRR, fast transient response, and active output discharge in sub-2 mm² packages.

FAQ

What is the maximum continuous output current for LD6806F/33P,115?

The LD6806F/33P,115 supports a maximum continuous output current of 200 mA under recommended operating conditions (T_amb ≤ +85 °C, proper PCB thermal design). Peak output current is specified at 300 mA for short durations, but sustained operation above 200 mA requires derating based on thermal resistance (R_th(j-a) = 220 K/W) and ambient temperature to avoid thermal shutdown.

Does LD6806F/33P,115 require an external pull-down resistor on the output pin?

No, LD6806F/33P,115 does not require an external pull-down resistor. It integrates a low-ohmic (100 Ω typical) pull-down transistor activated when the EN pin is driven LOW, ensuring rapid and controlled discharge of the output capacitor during disable-eliminating the need for external components.

What is the minimum input voltage required for LD6806F/33P,115 to maintain regulation at 200 mA load?

To maintain regulation at 200 mA, LD6806F/33P,115 requires an input voltage of at least 3.38 V (3.3 V nominal output + 80 mV typical dropout). Under worst-case conditions (max dropout of 130 mV), VIN must be ≥3.43 V. Input voltage must remain within the absolute maximum range of −0.5 V to +6.0 V.

Can LD6806F/33P,115 be used with ceramic output capacitors smaller than 1 µF?

No-NXP specifies a minimum external load capacitance of 1.0 µF (X7R dielectric) for stable operation of LD6806F/33P,115. Using capacitors below this value risks oscillation or poor transient response. The datasheet further recommends ±30% tolerance over −40 °C to +125 °C and warns against undershooting the 0.7 µF absolute minimum.

What is the thermal shutdown behavior of LD6806F/33P,115?

LD6806F/33P,115 activates thermal shutdown at a junction temperature of 160 °C (T_sd) and remains disabled until junction temperature drops by 20 K (T_sd(hys)). During shutdown, the output is pulled low via the internal 100 Ω pull-down transistor. This behavior protects the device and downstream circuitry during sustained overload or inadequate PCB cooling.

LD6806F/33P,115 Specifications

Product attributes: Attribute value

Manufacturer:: NXP Semiconductors

Series:: -

Package/Case:: 6-XFDFN

Packaging:: Bulk

Product Status:: Obsolete

Output Configuration:: Positive

Output Type:: Fixed

Number of Regulators:: 1

Voltage - Input (Max):: 5.5V

Voltage - Output (Min/Fixed):: 3.3V

Voltage - Output (Max):: -

Voltage Dropout (Max):: 0.13V @ 200mA

Current - Output:: 200mA

Current - Quiescent (Iq):: 100 µA

Current - Supply (Max):: 250 µA

PSRR:: 55dB (1kHz)

Control Features:: Enable

Protection Features:: Over Current, Over Temperature

Operating Temperature:: -40°C ~ 85°C

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 6-XSON, SOT886 (1.45x1)

LD6806F/33P,115 FAQ

1.How can I place an order for LD6806F/33P,115 through Aetrix?

Please submit a Request for Quotation (RFQ) for LD6806F/33P,115 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for LD6806F/33P,115 reliable?

The price and inventory of LD6806F/33P,115 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LD6806F/33P,115 is usually 5 days.

3.What payment methods are accepted for LD6806F/33P,115?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LD6806F/33P,115 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for LD6806F/33P,115?

LD6806F/33P,115 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your LD6806F/33P,115 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for LD6806F/33P,115?

For technical support, including LD6806F/33P,115 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LD6806F/33P,115 requirements.

6.How does Aetrix verify that LD6806F/33P,115 is sourced from the original manufacturer or authorized distributors?

All LD6806F/33P,115 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LD6806F/33P,115 meets industry standards.

7.What is the process for return or replacement of LD6806F/33P,115?

All LD6806F/33P,115 units undergo pre-shipment inspection (PSI). If there is an issue with LD6806F/33P,115, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The LD6806F/33P,115 part is unused and in its original packaging.

Return procedure for LD6806F/33P,115:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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