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NXP Semiconductors LD6806F/36P,115
- Part No.:
- LD6806F/36P,115
- Manufacturer:
- NXP Semiconductors
- Package:
- 6-XFDFN
- Datasheet:
-
LD6806F/36P,115.pdf
- Description:
- IC REG LINEAR 3.6V 200MA 6XSON
- Quantity:
- Payment:
- Shipping:
Inventory:5,000
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Product details
Overview
LD6806F/36P,115 from NXP Semiconductors is a 3.6 V, 200 mA ultra-low-dropout linear regulator in SOT886 (XSON6) package with 80 mV dropout at full load, 30 µV RMS output noise (10 Hz–100 kHz), and active-HIGH enable pin. It delivers stable low-noise power for RF and analog circuitry in space-constrained mobile devices.
For engineers reviewing the LD6806F/36P,115 datasheet, LD6806F/36P,115 pinout, LD6806F/36P,115 application, or LD6806F/36P,115 equivalent, key selection criteria include its low-ohmic pull-down output stage during disable, thermal shutdown at 160 °C, ±0.5 % output voltage accuracy at +25 °C, and compatibility with 1 µF X7R ceramic output capacitors.
Technical Context
The LD6806F/36P,115 uses a PMOS pass transistor architecture enabling 80 mV dropout at 200 mA, supporting operation down to VIN = VO(nom) + 0.2 V. Its internal bandgap reference and error amplifier maintain tight regulation across −40 °C to +85 °C ambient.
It integrates thermal protection with 20 K hysteresis, overcurrent limiting, and 10 kV HBM ESD protection. The active-HIGH EN pin controls a low-ohmic pull-down switch (Rpd = 100 Ω), ensuring rapid discharge of output capacitance during shutdown.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Output voltage | 3.6 V nominal; ±0.5 % tolerance at +25 °C ensures precision biasing for 3.3 V–3.6 V logic and RF ICs |
| Dropout voltage | 80 mV typical at 200 mA; enables >95 % efficiency when VIN ≥ 3.68 V, critical for battery-powered systems |
| PSRR | −55 dB at 1 kHz; suppresses switching noise from upstream DC-DC converters feeding sensitive analog circuits |
| Output noise | 30 µV RMS (10 Hz–100 kHz); supports low-phase-noise clock generation and high-resolution ADC/DAC supplies |
| Quiescent current | 155 µA typical at 200 mA load; balances low-noise performance with power efficiency in always-on subsystems |
| Enable threshold | VIL ≤ 0.4 V, VIH ≥ 1.4 V; compatible with 1.8 V and 3.3 V GPIO without level-shifting |
| Shutdown current | 0.1 µA typical; minimizes battery drain in deep-sleep modes of portable electronics |
Pinout & Package
SOT886 (XSON6) plastic extremely thin small outline package, no leads, 6-terminal, body size 1.0 mm × 1.45 mm × 0.5 mm, Pb-free and RoHS compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| OUT (Pin 1) | Regulated output voltage | Delivers 3.6 V to load; low-ohmic pull-down active when EN = LOW, discharging external capacitor rapidly |
| n.c. (Pin 2) | No connection | Internally unconnected; must be left floating or tied to GND per layout best practice |
| GND (Pin 3) | Power ground reference | Primary return path for load current and internal regulator circuitry; requires solid copper pour for thermal and noise control |
| EN (Pin 4) | Enable input (active HIGH) | Logic-controlled on/off; transitions within 200 µs startup time; VIH ≥ 1.4 V ensures robustness against noise |
| n.c. (Pin 5) | No connection | Internally unconnected; must be left floating or tied to GND per layout best practice |
| IN (Pin 6) | Input supply voltage | Accepts 2.3 V–5.5 V; requires local 1 µF ceramic decoupling close to pin for stability and PSRR optimization |
Key Features
| Feature | Design Value |
|---|---|
| Low-ohmic pull-down output | 100 Ω Rpd ensures <300 µs output discharge during disable-critical for sequencing and fault recovery in multi-rail systems |
| Ultra-low noise regulation | 30 µV RMS noise enables direct powering of PLLs, VCOs, and audio codecs without additional filtering |
| Fast startup time | 200 µs to reach 95 % of 3.6 V allows rapid wake-up from sleep states in real-time communication subsystems |
| Thermal protection with hysteresis | 160 °C shutdown with 20 K hysteresis prevents thermal cycling damage and supports safe continuous operation under transient loads |
| Robust ESD immunity | 10 kV HBM rating eliminates need for external TVS diodes in handheld device front-end power rails |
Applications
| Mobile Phone RF Front-End | Wearable Sensor Hub Power |
|---|---|
Use Scenario: Supplying LNA, mixer, and PA bias in LTE/5G handset transceivers where supply ripple directly impacts EVM and ACLR. IC Role / Device Role / Timing Role: Low-noise, fast-response post-regulator after buck converter; provides clean 3.6 V rail with minimal PSRR degradation at RF frequencies. Use Value: 30 µV RMS noise and −55 dB PSRR at 1 kHz reduce adjacent-channel interference by >3 dB compared to standard LDOs, improving receiver sensitivity. | Use Scenario: Powering MEMS accelerometers, gyroscopes, and Bluetooth LE SoCs in compact fitness trackers with strict size and leakage constraints. IC Role / Device Role / Timing Role: Primary 3.6 V system rail with enable-controlled power gating; coordinates with host MCU sleep/wake cycles via EN pin. Use Value: 0.1 µA shutdown current extends battery life beyond 6 months in always-on motion-detection mode, while 200 µs startup meets BLE connection latency requirements. |
| Portable Media Player Audio Codec | Industrial Handheld Terminal Display Backlight |
Use Scenario: Delivering ultra-clean analog supply to stereo DAC and headphone amplifier in MP3 players where audible noise must be eliminated. IC Role / Device Role / Timing Role: Dedicated low-noise LDO for audio signal chain; decoupled from noisy digital domains using separate IN/GND routing. Use Value: 30 µV RMS noise floor ensures SNR > 105 dB, eliminating hiss and enabling Hi-Res Audio certification compliance. | Use Scenario: Biasing white LED strings in ruggedized barcode scanners requiring reliable dimming control and thermal safety. IC Role / Device Role / Timing Role: Constant-voltage source with thermal foldback; EN pin synchronized to display brightness commands from microcontroller. Use Value: Integrated 160 °C thermal shutdown prevents LED driver overheating during extended use, eliminating need for discrete thermal sensors. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar LDO regulator applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Torex XC6219B362MR-G | 3.6 V, 200 mA, SOT-25; 120 mV dropout at 200 mA; no integrated pull-down; 50 µV RMS noise | Lacks active discharge; higher noise limits use in RF/analog; suitable only where fast shutdown is not required | Select when cost is primary constraint and thermal/sequencing requirements are relaxed |
| Richtek RT9013-36GB | 3.6 V, 300 mA, SOT-25; 250 mV dropout at 300 mA; 45 µV RMS noise; 1.5 µA quiescent current in shutdown | Higher dropout and noise; larger package footprint; no thermal hysteresis specification | Choose only if higher output current headroom is needed and board area permits SOT-25 |
Compared with XC6219B362MR-G and RT9013-36GB, LD6806F/36P,115 uniquely combines low-ohmic pull-down, 30 µV noise, and 80 mV dropout in a 1.0 mm × 1.45 mm footprint-enabling smaller, quieter, and more thermally robust designs in space-constrained portable electronics.
Availability
LD6806F/36P,115 is available at Aetrix Electronics and suitable for mobile phone RF modules, wearable sensor hubs, portable media player audio subsystems, and industrial handheld terminal displays requiring stable component supply with consistent parametric performance and long-term lifecycle support.
Supply support for LD6806F/36P,115 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and consumer markets.
The LD6806 series was designed specifically for miniaturized portable electronics requiring ultra-low-noise, fast-transient, and thermally robust power regulation in sub-2 mm² footprints.
FAQ
What is the maximum input voltage rating for LD6806F/36P,115?
The absolute maximum input voltage for LD6806F/36P,115 is +6.0 V for 4 ms transients, with recommended operating range of 2.3 V to 5.5 V. Exceeding 6.0 V-even briefly-risks permanent damage to the internal PMOS pass device and reference circuitry. Designers must ensure upstream DC-DC output tolerances and transient spikes remain within this limit.
Does LD6806F/36P,115 require an external output capacitor, and what value is recommended?
Yes, LD6806F/36P,115 requires an external output capacitor for stability. The datasheet specifies a minimum of 1.0 µF X7R ceramic capacitor with ESR between 5 mΩ and 500 mΩ. Using less than 1.0 µF risks oscillation; exceeding 500 mΩ ESR degrades transient response and PSRR performance. The 1.0 µF value also optimizes the 200 µs startup time and 300 µs shutdown time.
How does the low-ohmic pull-down feature of LD6806F/36P,115 function during disable?
When the EN pin is driven LOW, LD6806F/36P,115 activates an internal 100 Ω NMOS switch between OUT and GND. This provides a controlled discharge path for external output capacitance, reducing VOUT to 10 % of nominal in ≤300 µs. This behavior prevents floating outputs and ensures predictable power sequencing in multi-rail systems-unlike high-ohmic variants that leave OUT floating.
What is the thermal resistance (Rth(j-a)) of LD6806F/36P,115, and how does PCB layout affect it?
The typical junction-to-ambient thermal resistance of LD6806F/36P,115 is 220 K/W under standard two-layer PCB conditions. Layout significantly impacts this value: connecting all pins-especially GND and OUT-to large copper pours, adding thermal vias beneath the package, and using inner-layer heat spreaders can reduce Rth(j-a) by up to 40 %. Failure to implement these practices may cause premature thermal shutdown at <150 mA load current.
Is LD6806F/36P,115 compatible with lead-free reflow soldering processes?
Yes, LD6806F/36P,115 is qualified for lead-free reflow soldering per J-STD-020C. Its SOT886 package has a volume <350 mm³ and thickness <1.6 mm, requiring a peak temperature of 260 °C. The datasheet mandates strict adherence to moisture sensitivity level (MSL) handling-exposure time before reflow must not exceed the specified floor life, and baking may be required if MSL limits are exceeded.
LD6806F/36P,115 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 6-XFDFN
- Packaging:
- Bulk
- Product Status:
- Obsolete
- Output Configuration:
- Positive
- Output Type:
- Fixed
- Number of Regulators:
- 1
- Voltage - Input (Max):
- 5.5V
- Voltage - Output (Min/Fixed):
- 3.6V
- Voltage - Output (Max):
- -
- Voltage Dropout (Max):
- 0.13V @ 200mA
- Current - Output:
- 200mA
- Current - Quiescent (Iq):
- 100 µA
- Current - Supply (Max):
- 250 µA
- PSRR:
- 55dB (1kHz)
- Control Features:
- Enable
- Protection Features:
- Over Current, Over Temperature
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 6-XSON, SOT886 (1.45x1)
LD6806F/36P,115 FAQ
1.How can I place an order for LD6806F/36P,115 through Aetrix?
Please submit a Request for Quotation (RFQ) for LD6806F/36P,115 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LD6806F/36P,115 reliable?
The price and inventory of LD6806F/36P,115 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LD6806F/36P,115 is usually 5 days.
3.What payment methods are accepted for LD6806F/36P,115?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LD6806F/36P,115 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LD6806F/36P,115?
LD6806F/36P,115 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LD6806F/36P,115 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LD6806F/36P,115?
For technical support, including LD6806F/36P,115 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LD6806F/36P,115 requirements.
6.How does Aetrix verify that LD6806F/36P,115 is sourced from the original manufacturer or authorized distributors?
All LD6806F/36P,115 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LD6806F/36P,115 meets industry standards.
7.What is the process for return or replacement of LD6806F/36P,115?
All LD6806F/36P,115 units undergo pre-shipment inspection (PSI). If there is an issue with LD6806F/36P,115, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LD6806F/36P,115 part is unused and in its original packaging.
Return procedure for LD6806F/36P,115:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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