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NXP Semiconductors LD6816CX4/12P,315
- Part No.:
- LD6816CX4/12P,315
- Manufacturer:
- NXP Semiconductors
- Package:
- 4-XFBGA, WLCSP
- Datasheet:
-
LD6816CX4/12P,315.pdf
- Description:
- IC REG LINEAR 1.2V 150MA 4WLCSP
- Quantity:
- Payment:
- Shipping:
Inventory:18,000
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Product details
Overview
LD6816CX4/12P,315 from NXP Semiconductors is a 1.2 V fixed-output, 150 mA ultra-low-dropout linear regulator in WLCSP4 package with auto-discharge (pull-down) functionality. It delivers 45 mV dropout at full load, 30 µVRMS output noise (10 Hz–100 kHz), and 55 dB PSRR at 1 kHz, enabling stable power for noise-sensitive analog/digital interfaces in space-constrained portable devices.
For engineers reviewing the LD6816CX4/12P,315 datasheet, LD6816CX4/12P,315 pinout, LD6816CX4/12P,315 application, or LD6816CX4/12P,315 equivalent, key selection criteria include its 1.2 V output accuracy (±0.5% at +25°C), sub-150 µs startup time, 0.1 µA shutdown quiescent current, and integrated thermal/overcurrent protection - all critical for battery-powered mobile IC supply rails.
Technical Context
The LD6816CX4/12P,315 implements a PMOS pass transistor architecture enabling ultra-low dropout and high PSRR across 1 kHz–100 kHz. Its enable input (active HIGH) controls both regulation and the integrated pull-down switch, ensuring rapid output discharge during disable - a requirement for multi-rail sequencing in smartphones and portable media players.
Designed for operation from 2.3 V to 5.5 V input, it maintains ±3% output voltage tolerance over −40°C to +85°C ambient and supports 0.7–1.0 µF X7R ceramic output capacitors with 5–500 mΩ ESR. The WLCSP4 package (0.76 mm × 0.76 mm × 0.47 mm, 0.4 mm pitch) places strict layout constraints on thermal vias and ground plane coupling to achieve Rth(j-a) = 130 K/W.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Output Voltage | Fixed 1.2 V ±0.5% at +25°C; ±4% over −40°C to +85°C - ensures stable core logic supply for low-voltage SoCs and memory interfaces. |
| Dropout Voltage | 45 mV typical at 150 mA - enables >97% efficiency at 1.25 V input, critical for extending battery runtime in 1.8 V/2.5 V system rails. |
| PSRR | 55 dB at 1 kHz - suppresses switching noise from adjacent DC-DC converters feeding shared input supplies. |
| Output Noise | 30 µVRMS (10 Hz–100 kHz) - meets low-noise requirements for RF front-end biasing and precision ADC reference supplies. |
| Quiescent Current | 0.1 µA typical in shutdown (VEN ≤ 0.4 V) - minimizes leakage current in always-on subsystems like real-time clocks or wake-up controllers. |
| Startup Time | <150 µs to 95% of 1.2 V - satisfies fast power-up timing for camera modules and touch controllers requiring immediate rail availability. |
| Pull-down Resistance | 100 Ω typical - discharges output to 5% of 1.2 V within 300 µs, preventing floating states during power sequencing or sleep mode transitions. |
Pinout & Package
Package: Wafer-Level Chip-Scale Package (WLCSP4), 0.76 mm × 0.76 mm × 0.47 mm, 0.4 mm bump pitch, 4 solder bumps (2×2 array). Backside coating not present (standard WLCSP4, not CxxP variant).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GND (A1) | Supply ground reference | Primary return path for load current and internal bias; must connect to solid ground plane via multiple vias to minimize impedance and thermal resistance. |
| EN (A2) | Enable control input | Active HIGH logic interface (VIH ≥ 1.1 V); asserts regulation and activates pull-down transistor when high, disables both when low. |
| OUT (B1) | Regulated output voltage | Delivers 1.2 V to load; includes integrated 100 Ω pull-down switch to ground when EN is low - eliminates need for external discharge resistor. |
| IN (B2) | Input voltage supply | Accepts 2.3–5.5 V; requires local 1 µF ceramic decoupling capacitor placed within 2 mm of IN pin to stabilize transient response. |
Key Features
| Feature | Design Value |
|---|---|
| Auto-discharge function | Integrated 100 Ω pull-down transistor on OUT pin activated during disable - eliminates external components and reduces BOM count for portable designs. |
| Ultra-low noise regulation | 30 µVRMS output noise (10 Hz–100 kHz) with 1 µF X7R capacitor - enables direct powering of RF transceivers and high-resolution audio codecs without additional filtering. |
| High PSRR at mid-band | 55 dB rejection at 1 kHz - mitigates ripple from buck converter switching frequencies and their harmonics in mixed-signal SoC power domains. |
| Thermal and current protection | 160°C thermal shutdown with 20 K hysteresis and current limiting - prevents damage during output short-circuit or PCB overheating in sealed handheld enclosures. |
| Low-temperature drift | ±4% output variation over −40°C to +85°C - maintains stable voltage for temperature-sensitive sensors and PLL reference circuits without calibration. |
Applications
| Smartphone Core Logic Supply | Digital Camera Sensor Bias |
|---|---|
|
Use Scenario: Powering ARM Cortex-A/M series application processor I/O and memory interface rails in compact smartphone mainboards. IC Role / Device Role / Timing Role: Low-noise, fast-startup LDO delivering clean 1.2 V to DDR I/O buffers and SerDes PHYs during dynamic frequency scaling. Use Value: 45 mV dropout preserves headroom from shared 1.8 V intermediate bus; 150 µs startup meets Android fast-boot timing budgets. |
Use Scenario: Providing regulated bias voltage to CMOS image sensor analog front-end (AFE) and column ADC circuitry. IC Role / Device Role / Timing Role: Ultra-low-noise 1.2 V supply isolating sensitive analog pixel readout paths from digital switching noise. Use Value: 30 µVRMS noise floor prevents SNR degradation in 12+ bit imaging pipelines; auto-discharge prevents ghosting during frame reset. |
| Portable Media Player Audio Codec | Bluetooth LE SoC Peripheral Rail |
|
Use Scenario: Supplying clean 1.2 V to stereo DAC/ADC and headphone amplifier stages in battery-powered music players. IC Role / Device Role / Timing Role: Low-ripple, low-quiescent-current regulator maintaining signal integrity during playback and standby modes. Use Value: 0.1 µA shutdown current extends weeks-long standby time; 55 dB PSRR rejects noise from Bluetooth radio section sharing same battery. |
Use Scenario: Powering GPIO, UART, and BLE radio peripheral blocks in ultra-compact wearables and IoT tags. IC Role / Device Role / Timing Role: Space-optimized LDO enabling single-layer PCB routing with minimal decoupling footprint. Use Value: 0.76 mm × 0.76 mm WLCSP4 package fits under 2 mm × 2 mm BLE modules; 100 Ω pull-down ensures reliable reset sequencing. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar LDO regulator applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Torex XC6219B122MR-G | 1.2 V fixed, 150 mA, 60 mV dropout at 100 mA; no integrated pull-down; SOT-25 package (2.9 mm × 2.8 mm) | Larger footprint; requires external discharge resistor for sequencing; higher dropout reduces efficiency at low VIN | Select when board area permits larger package and auto-discharge is handled externally. |
| Richtek RT9013-12GB | 1.2 V fixed, 250 mA, 250 mV dropout at 250 mA; 1.5 µA quiescent current in shutdown; DFN-6 package (1.5 mm × 1.5 mm) | Higher dropout limits use below 1.45 V input; no pull-down; slightly larger than WLCSP but smaller than SOT-25 | Select when higher output current is needed and 0.1 µA shutdown is not required. |
Compared with XC6219B122MR-G and RT9013-12GB, LD6816CX4/12P,315 uniquely combines ultra-low dropout (45 mV), integrated auto-discharge, and smallest possible footprint (0.76 mm²), making it optimal for next-generation miniaturized mobile platforms where board space and sequencing integrity are critical.
Availability
LD6816CX4/12P,315 is available at Aetrix Electronics and suitable for smartphone power management, digital camera sensor biasing, portable media player audio subsystems, Bluetooth LE peripheral rails, and wearable device core logic supplies requiring stable component supply with guaranteed long-term availability.
Supply support for LD6816CX4/12P,315 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and mobile applications, with leadership in RF, analog, and power management ICs.
The LD6816 series was designed specifically for ultra-miniaturized portable electronics requiring ultra-low-noise, ultra-low-dropout regulation with integrated power sequencing - targeting smartphone, tablet, and wearable form factors where WLCSP packaging and auto-discharge are essential.
FAQ
What is the nominal output voltage and tolerance of the LD6816CX4/12P,315?
The LD6816CX4/12P,315 provides a fixed 1.2 V output voltage with ±0.5% tolerance at +25°C ambient and ±4% over the full −40°C to +85°C operating range. This tight regulation ensures compatibility with low-voltage logic families and precision analog circuitry without external feedback adjustment.
Does the LD6816CX4/12P,315 include an integrated pull-down transistor?
Yes, the LD6816CX4/12P,315 includes an integrated 100 Ω pull-down transistor on the OUT pin that activates when the EN pin is driven LOW. This auto-discharge function rapidly pulls the output to near ground, eliminating the need for external discharge resistors in power sequencing designs.
What is the maximum input voltage and dropout specification for the LD6816CX4/12P,315?
The LD6816CX4/12P,315 accepts input voltages from 2.3 V to 5.5 V, with an absolute maximum rating of +6.0 V for 4 ms transients. Its dropout voltage is 45 mV typical at 150 mA load, enabling efficient operation even when input is only 1.245 V - critical for battery-powered systems nearing end-of-life.
What package type and dimensions does the LD6816CX4/12P,315 use?
The LD6816CX4/12P,315 uses a Wafer-Level Chip-Scale Package (WLCSP4) measuring 0.76 mm × 0.76 mm × 0.47 mm with 0.4 mm bump pitch. It has four solder bumps arranged in a 2×2 grid, with pin A1 designated as GND and marked by a laser-etched index area on the die surface.
What are the key thermal and protection features of the LD6816CX4/12P,315?
The LD6816CX4/12P,315 includes over-temperature protection (shuts down at 160°C with 20 K hysteresis) and output current limiting (600 mA short-circuit current). Its thermal resistance is 130 K/W (junction-to-ambient), achievable only with proper PCB layout including thermal vias and large copper planes connected to GND and IN pins.
LD6816CX4/12P,315 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 4-XFBGA, WLCSP
- Packaging:
- Bulk
- Product Status:
- Obsolete
- Output Configuration:
- Positive
- Output Type:
- Fixed
- Number of Regulators:
- 1
- Voltage - Input (Max):
- 5.5V
- Voltage - Output (Min/Fixed):
- 1.2V
- Voltage - Output (Max):
- -
- Voltage Dropout (Max):
- 0.075V @ 150mA
- Current - Output:
- 150mA
- Current - Quiescent (Iq):
- 100 µA
- Current - Supply (Max):
- 250 µA
- PSRR:
- 55dB (1kHz)
- Control Features:
- Enable
- Protection Features:
- Over Current, Over Temperature, Transient Voltage
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 4-WLCSP (0.76x0.76)
LD6816CX4/12P,315 FAQ
1.How can I place an order for LD6816CX4/12P,315 through Aetrix?
Please submit a Request for Quotation (RFQ) for LD6816CX4/12P,315 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LD6816CX4/12P,315 reliable?
The price and inventory of LD6816CX4/12P,315 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LD6816CX4/12P,315 is usually 5 days.
3.What payment methods are accepted for LD6816CX4/12P,315?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LD6816CX4/12P,315 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LD6816CX4/12P,315?
LD6816CX4/12P,315 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LD6816CX4/12P,315 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LD6816CX4/12P,315?
For technical support, including LD6816CX4/12P,315 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LD6816CX4/12P,315 requirements.
6.How does Aetrix verify that LD6816CX4/12P,315 is sourced from the original manufacturer or authorized distributors?
All LD6816CX4/12P,315 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LD6816CX4/12P,315 meets industry standards.
7.What is the process for return or replacement of LD6816CX4/12P,315?
All LD6816CX4/12P,315 units undergo pre-shipment inspection (PSI). If there is an issue with LD6816CX4/12P,315, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LD6816CX4/12P,315 part is unused and in its original packaging.
Return procedure for LD6816CX4/12P,315:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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