NXP Semiconductors LD6816CX4/13P,315
- Part No.:
- LD6816CX4/13P,315
- Manufacturer:
- NXP Semiconductors
- Package:
- 4-XFBGA, WLCSP
- Datasheet:
-
LD6816CX4/13P,315.pdf
- Description:
- IC REG LINEAR 1.3V 150MA 4WLCSP
- Quantity:
- Payment:

- Shipping:

Inventory:27,000
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Product details
Overview
LD6816CX4/13P,315 from NXP Semiconductors is a 1.3 V fixed-output, 150 mA ultra-low-dropout linear regulator in WLCSP4 package, featuring 45 mV dropout at full load, 30 µVRMS output noise (10 Hz–100 kHz), and auto-discharge functionality via integrated pull-down transistor. It operates from 2.3 V to 5.5 V input and delivers stable power to low-voltage analog/digital circuitry in space-constrained portable devices.
For engineers reviewing the LD6816CX4/13P,315 datasheet, LD6816CX4/13P,315 pinout, LD6816CX4/13P,315 application, or LD6816CX4/13P,315 equivalent, key selection criteria include its 1.3 V fixed output, WLCSP4 footprint (0.76 mm × 0.76 mm), enable-controlled auto-discharge behavior, PSRR of −55 dB at 1 kHz, and thermal shutdown at 160 °C - all critical for battery-powered mobile interface rails.
Technical Context
The LD6816CX4/13P,315 implements a PMOS pass transistor architecture enabling ultra-low dropout (45 mV @ 150 mA) and fast start-up (<150 µs). Its internal bandgap reference, error amplifier, and over-temperature/over-current protection circuits operate independently of input voltage, with enable threshold defined by fixed VIH (≥1.1 V) and VIL (≤0.4 V) levels.
This variant belongs to the "P" suffix family, integrating a dedicated pull-down transistor that actively discharges the output to ground when disabled - distinct from "H" variants offering high-impedance shutdown. The 0.4 mm pitch WLCSP4 package requires reflow-only assembly and supports ≤1.0 µF output capacitance with 5–500 mΩ ESR.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Output Voltage | Fixed 1.3 V ±2% over −40 °C to +85 °C; ensures precise biasing for 1.3 V logic or analog blocks without external feedback. |
| Dropout Voltage | 45 mV typical at 150 mA; enables regulation down to VIN = 1.345 V, maximizing battery runtime in single-cell Li-ion or Li-poly systems. |
| PSRR | −55 dB at 1 kHz; suppresses switching noise from upstream DC-DC converters feeding sensitive RF or audio circuitry. |
| Output Noise | 30 µVRMS (10 Hz–100 kHz); low enough for powering ADC references or PLL VCO supplies without added filtering. |
| Quiescent Current | 70–100 µA active; 0.1 µA in shutdown; minimizes standby drain in always-on sensor or communication subsystems. |
| Enable Function | Active-HIGH EN pin (VIH ≥1.1 V); provides clean, controlled power sequencing for multi-rail SoCs or FPGAs. |
| Pull-down Resistance | 100 Ω typical; ensures rapid discharge of output capacitance (<300 µs to 5% VOUT) during disable, preventing floating node issues. |
Pinout & Package
Package: Wafer-Level Chip-Scale Package (WLCSP4), 0.76 mm × 0.76 mm × 0.47 mm, 0.4 mm bump pitch, Pb-free/RoHS/halogen-free compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GND (A1) | Supply ground reference | Primary return path for regulator current; must connect to solid ground plane for thermal and noise performance. |
| EN (A2) | Enable control input | Logic-level signal (0–0.4 V = OFF; ≥1.1 V = ON); no external pull-up required; controls both regulation and auto-discharge. |
| OUT (B1) | Regulated output voltage | 1.3 V source delivering up to 150 mA; integrates pull-down switch for active discharge when EN = LOW. |
| IN (B2) | Input supply voltage | Accepts 2.3–5.5 V; requires local 1 µF ceramic capacitor (X7R, ±30% tolerance) placed within 2 mm of pin. |
Key Features
| Feature | Design Value |
|---|---|
| Auto-discharge function | Integrated 100 Ω pull-down transistor actively sinks OUT to GND during disable, eliminating need for external bleed resistors in portable systems. |
| Ultra-low noise output | 30 µVRMS noise over 10 Hz–100 kHz enables direct powering of noise-sensitive analog components without additional LDO filtering stages. |
| High PSRR at low frequency | −55 dB rejection at 1 kHz allows co-location with noisy DC-DC converters while maintaining clean 1.3 V supply for precision circuitry. |
| Fast transient response | <150 µs start-up time and <300 µs shutdown time support dynamic power gating in mobile SoC subsystems requiring microsecond-level rail control. |
| Robust protection suite | Thermal shutdown (160 °C, 20 K hysteresis) and current limiting (600 mA short-circuit) ensure safe operation under fault conditions without external components. |
Applications
| Smartphone Baseband Core | Digital Camera Image Sensor Bias |
|---|---|
Use Scenario: Powering 1.3 V I/O or core logic in LTE/5G baseband processors during active transmission bursts. IC Role / Device Role / Timing Role: Primary low-noise, fast-response LDO supplying regulated 1.3 V rail synchronized with processor enable signals. Use Value: Ultra-low dropout preserves battery headroom; auto-discharge prevents back-powering during sleep mode transitions. |
Use Scenario: Delivering stable 1.3 V bias to CMOS image sensor analog front-end during exposure readout cycles. IC Role / Device Role / Timing Role: Low-noise voltage source decoupled from noisy digital supply domains, enabled only during active frame capture. Use Value: 30 µVRMS noise avoids pixel-level fixed-pattern noise; fast start-up ensures rail stability before analog sampling begins. |
| Portable Media Player Audio Codec | Bluetooth LE SoC Peripheral Rail |
Use Scenario: Supplying 1.3 V reference voltage to stereo DAC/ADC in battery-powered media players. IC Role / Device Role / Timing Role: Precision LDO providing clean analog supply independent of system DC-DC ripple. Use Value: −55 dB PSRR attenuates switching noise from 3.3 V buck converter, preserving SNR in 24-bit audio paths. |
Use Scenario: Powering 1.3 V GPIO or peripheral interface block in Bluetooth Low Energy SoCs during advertising/connection states. IC Role / Device Role / Timing Role: Enable-controlled auxiliary LDO activated only when BLE peripherals require active bias. Use Value: 0.1 µA shutdown current extends shelf life; WLCSP4 footprint matches tight layout constraints of wearable PCBs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar LDO regulator applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPS7A0513PDBVR | 1.3 V fixed, 200 mA, SOT-23-5 package (2.9 mm × 1.6 mm); higher quiescent current (2.5 µA active, 50 nA shutdown). | Larger footprint and no auto-discharge; requires external resistor for output discharge. | Choose when board space permits larger package and lower-cost assembly outweighs miniaturization and active discharge needs. |
| MCP1700T-1302E/TT | 1.3 V fixed, 250 mA, SOT-23-3 package; 170 mV dropout at 250 mA; no enable pin or auto-discharge. | Always-on operation; lacks sequencing control and output discharge capability. | Choose for cost-sensitive, non-sequenced applications where 170 mV dropout is acceptable and board area is less constrained than WLCSP4. |
Compared with TPS7A0513PDBVR and MCP1700T-1302E/TT, LD6816CX4/13P,315 offers the smallest footprint (0.76 mm²), lowest dropout (45 mV), and unique integrated auto-discharge - making it optimal for ultra-portable designs requiring aggressive power sequencing and minimal board area.
Availability
LD6816CX4/13P,315 is available at Aetrix Electronics and suitable for smartphone baseband cores, digital camera image sensor bias, portable media player audio codecs, and Bluetooth LE SoC peripheral rails requiring stable component supply with guaranteed long-term availability.
Supply support for LD6816CX4/13P,315 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and consumer electronics, with leadership in power management and RF technologies.
The LD6816 series was designed specifically for ultra-miniaturized portable electronics requiring low-noise, low-dropout regulation with intelligent power control - targeting next-generation smartphones, wearables, and IoT edge sensors.
FAQ
What is the nominal output voltage of the LD6816CX4/13P,315?
The LD6816CX4/13P,315 delivers a fixed 1.3 V output voltage with ±2% accuracy over −40 °C to +85 °C ambient temperature and 1 mA to 150 mA load current. This value is laser-marked as "B" on the WLCSP4 die and confirmed in Table 4 of the NXP datasheet.
Does the LD6816CX4/13P,315 support auto-discharge, and how does it work?
Yes, the LD6816CX4/13P,315 integrates an active pull-down transistor that connects OUT to GND when the EN pin is driven LOW. This auto-discharge function achieves <300 µs shutdown time and eliminates floating outputs, distinguishing it from "H"-suffix variants that enter high-impedance state.
What is the minimum recommended output capacitor for stable operation of the LD6816CX4/13P,315?
The LD6816CX4/13P,315 requires a minimum 0.7 µF X7R ceramic capacitor at the OUT pin, with recommended value of 1.0 µF and ESR between 5 mΩ and 500 mΩ. This ensures stability across temperature and load transients, as specified in Table 10 and Section 10.1 of the datasheet.
What package type and dimensions does the LD6816CX4/13P,315 use?
The LD6816CX4/13P,315 uses a Wafer-Level Chip-Scale Package (WLCSP4) measuring 0.76 mm × 0.76 mm × 0.47 mm with 0.4 mm bump pitch. Pin configuration is 2×2 array (A1=GND, A2=EN, B1=OUT, B2=IN), per Figure 1 and Table 1 of the NXP product data sheet.
How does the LD6816CX4/13P,315 handle thermal overload conditions?
The LD6816CX4/13P,315 incorporates thermal shutdown protection activating at 160 °C junction temperature, with 20 K hysteresis to prevent oscillation. When triggered, regulation ceases and the device remains off until junction temperature falls below 140 °C, ensuring robust operation in thermally dense portable PCB layouts.
LD6816CX4/13P,315 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 4-XFBGA, WLCSP
- Packaging:
- Bulk
- Product Status:
- Obsolete
- Output Configuration:
- Positive
- Output Type:
- Fixed
- Number of Regulators:
- 1
- Voltage - Input (Max):
- 5.5V
- Voltage - Output (Min/Fixed):
- 1.3V
- Voltage - Output (Max):
- -
- Voltage Dropout (Max):
- 0.075V @ 150mA
- Current - Output:
- 150mA
- Current - Quiescent (Iq):
- 100 µA
- Current - Supply (Max):
- 250 µA
- PSRR:
- 55dB (1kHz)
- Control Features:
- Enable
- Protection Features:
- Over Current, Over Temperature, Transient Voltage
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 4-WLCSP (0.76x0.76)
LD6816CX4/13P,315 FAQ
1.How can I place an order for LD6816CX4/13P,315 through Aetrix?
Please submit a Request for Quotation (RFQ) for LD6816CX4/13P,315 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LD6816CX4/13P,315 reliable?
The price and inventory of LD6816CX4/13P,315 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LD6816CX4/13P,315 is usually 5 days.
3.What payment methods are accepted for LD6816CX4/13P,315?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LD6816CX4/13P,315 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LD6816CX4/13P,315?
LD6816CX4/13P,315 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LD6816CX4/13P,315 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LD6816CX4/13P,315?
For technical support, including LD6816CX4/13P,315 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LD6816CX4/13P,315 requirements.
6.How does Aetrix verify that LD6816CX4/13P,315 is sourced from the original manufacturer or authorized distributors?
All LD6816CX4/13P,315 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LD6816CX4/13P,315 meets industry standards.
7.What is the process for return or replacement of LD6816CX4/13P,315?
All LD6816CX4/13P,315 units undergo pre-shipment inspection (PSI). If there is an issue with LD6816CX4/13P,315, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LD6816CX4/13P,315 part is unused and in its original packaging.
Return procedure for LD6816CX4/13P,315:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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