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NXP Semiconductors LD6816CX4/22P,315

Part No.:
LD6816CX4/22P,315
Manufacturer:
NXP Semiconductors
Category:
Voltage Regulators - Linear, Low Drop Out (LDO) Regulators
Package:
4-XFBGA, WLCSP
Datasheet:
AetrixLD6816CX4/22P,315.pdf
Description:
IC REG LINEAR 2.2V 150MA 4WLCSP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,667

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Product details

Overview

LD6816CX4/22P,315 from NXP Semiconductors is a 2.2 V fixed-output, 150 mA ultra-low-dropout linear regulator in WLCSP4 package with auto-discharge (pull-down) functionality. It delivers 45 mV dropout at full load, 30 µVRMS output noise (10 Hz–100 kHz), and 55 dB PSRR at 1 kHz, enabling stable power for noise-sensitive analog rails in space-constrained mobile devices.

For engineers reviewing the LD6816CX4/22P,315 datasheet, LD6816CX4/22P,315 pinout, LD6816CX4/22P,315 application, or LD6816CX4/22P,315 equivalent, key selection criteria include its 2.2 V output accuracy (±0.5% at +25°C), sub-150 µs startup time, 0.1 µA shutdown quiescent current, and integrated thermal/current protection - all critical for battery-powered portable electronics requiring fast enable control and rapid output discharge.

Technical Context

The LD6816CX4/22P,315 implements a PMOS pass transistor architecture enabling ultra-low dropout operation down to 45 mV at 150 mA, minimizing input-to-output voltage overhead and maximizing efficiency in low-voltage systems. Its internal reference and error amplifier maintain tight output regulation across −40°C to +85°C ambient.

Unlike high-ohmic disable variants (e.g., /xxH), this /xxP version integrates a dedicated pull-down transistor on the OUT pin, ensuring active discharge of downstream capacitance during shutdown - a requirement for sequencing-critical subsystems like RF transceivers or camera modules where residual voltage must be cleared rapidly.

Key Specifications

Parameter Value and Actual Design Meaning
Output Voltage Fixed 2.2 V ±0.5% at +25°C; ensures precise biasing for 2.2 V I/O domains without external feedback components.
Dropout Voltage 45 mV typical at 150 mA; enables operation from 2.245 V input, supporting single-cell Li-ion or Li-polymer battery discharge profiles.
PSRR 55 dB at 1 kHz; suppresses switching noise from adjacent DC-DC converters, preserving signal integrity in mixed-signal SoC power domains.
Output Noise 30 µVRMS (10 Hz–100 kHz); meets low-noise requirements for ADC references, audio codecs, and RF synthesizer VCO supplies.
Quiescent Current 0.1 µA typical in shutdown (VEN ≤ 0.4 V); minimizes battery drain during deep sleep modes in always-on sensors or IoT endpoints.
Startup Time < 150 µs to 95% of 2.2 V; supports fast wake-up sequences in applications requiring rapid system-level power state transitions.
Enable Threshold VIH = 1.1 V min; compatible with 1.8 V GPIO logic without level-shifting, simplifying host processor interface design.

Pinout & Package

LD6816CX4/22P,315 uses a 0.4 mm pitch Wafer-Level Chip-Scale Package (WLCSP4) measuring 0.76 mm × 0.76 mm × 0.47 mm, optimized for ultra-dense PCB layouts in smartphones and wearables.

Pin/Terminal Circuit Role Design Meaning
GND (A1) Supply ground reference Primary return path for regulator current; must connect to solid ground plane for thermal and noise performance.
EN (A2) Active-HIGH enable input Drives internal pass transistor; logic HIGH ≥1.1 V enables regulation; LOW ≤0.4 V disables with auto-discharge active.
OUT (B1) Regulated output voltage Delivers 2.2 V to load; includes integrated pull-down switch that actively discharges external capacitors during disable.
IN (B2) Input supply voltage Accepts 2.3 V–5.5 V; requires local 1 µF X7R ceramic capacitor with ESR 5–500 mΩ for stability per datasheet Section 10.1.

Key Features

Feature Design Value
Auto-discharge function Integrated 100 Ω pull-down transistor on OUT pin clears residual charge in <300 µs, eliminating need for external bleed resistors in power sequencing.
Ultra-low noise output 30 µVRMS noise floor enables direct powering of precision analog blocks without additional filtering stages.
High PSRR at 1 kHz 55 dB rejection of ripple from upstream DC-DC converters reduces need for cascaded LDO stages in multi-rail systems.
Thermal & overcurrent protection Shuts down at 160°C junction temperature with 20 K hysteresis; limits peak output current to 300 mA, preventing damage during fault conditions.
ESD robustness 10 kV HBM rating allows safe handling in standard assembly environments without special ESD precautions beyond IPC-610.

Applications

Smartphone Baseband Power Portable Camera Module

Use Scenario: Powers 2.2 V I/O interface of LTE/5G baseband processors during active transmission bursts.

IC Role / Device Role / Timing Role: Low-noise, fast-response LDO supplying clean VIO rail; enabled synchronously with RF transmit enable signal.

Use Value: 45 mV dropout extends usable battery life by maintaining regulation down to 2.245 V input; auto-discharge prevents data corruption during rapid modem sleep/wake cycles.

Use Scenario: Supplies image sensor analog core and ISP digital I/O in compact smartphone rear cameras.

IC Role / Device Role / Timing Role: Primary 2.2 V regulator with controlled shutdown timing to meet MIPI CSI-2 power sequencing requirements.

Use Value: Sub-150 µs startup ensures sensor readiness within frame sync deadlines; 30 µVRMS noise prevents fixed-pattern noise in captured images.

Wireless Headset Audio Codec Wearable Sensor Hub

Use Scenario: Provides low-noise 2.2 V supply to stereo audio DAC and headphone driver in Bluetooth earbuds.

IC Role / Device Role / Timing Role: Post-regulator for noise-sensitive audio signal chain; disabled during Bluetooth link idle periods.

Use Value: 0.1 µA shutdown current extends battery runtime between charges; 55 dB PSRR isolates DAC from noisy Bluetooth radio supply.

Use Scenario: Powers MEMS accelerometer, gyroscope, and BLE SoC in fitness trackers with aggressive power cycling.

IC Role / Device Role / Timing Role: Always-on LDO for sensor biasing, activated only during motion-triggered data acquisition windows.

Use Value: Fast enable/disable (<150 µs startup, <300 µs discharge) enables microsecond-level power gating, reducing average system current by >40%.

Equivalent & Alternatives

The following parts are listed as comparable options for similar LDO regulator applications.

Alternative Part Technical Difference Application Difference Selection Advice
Torex XC6210B222MR-G 2.2 V fixed output, 150 mA, 65 mV dropout (at 150 mA), no auto-discharge; SOT-25 package (2.9 × 2.8 mm). Larger footprint; lacks active output discharge - requires external circuitry for sequencing compliance. Select when board area permits larger package and auto-discharge is not required for system-level power sequencing.
Richtek RT9013-22GB 2.2 V fixed output, 300 mA, 250 mV dropout (at 300 mA), 50 µVRMS noise, no auto-discharge; DFN-6 (1.5 × 1.5 mm). Higher current capability but higher dropout and noise; no integrated pull-down transistor. Choose when higher output current is needed and external discharge control can be implemented via GPIO-driven MOSFET.

Compared with XC6210B222MR-G and RT9013-22GB, LD6816CX4/22P,315 uniquely combines ultra-low dropout (45 mV), low noise (30 µVRMS), and integrated auto-discharge in a 0.76 mm × 0.76 mm WLCSP - making it optimal for miniaturized, sequencing-critical portable designs where board space and power-state transition fidelity are constrained.

Availability

LD6816CX4/22P,315 is available at Aetrix Electronics and suitable for smartphone baseband power, portable camera modules, wireless headset audio codecs, and wearable sensor hubs requiring stable component supply with guaranteed long-term availability.

Supply support for LD6816CX4/22P,315 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor leader focused on secure connectivity solutions for automotive, industrial, and consumer markets, with broad analog and power management IP.

The LD6816 series was designed specifically for ultra-miniaturized, battery-powered portable electronics - delivering ultra-low dropout, low noise, and integrated auto-discharge in wafer-level packaging to meet stringent size and power sequencing demands.

FAQ

What is the nominal output voltage and tolerance of LD6816CX4/22P,315?

The LD6816CX4/22P,315 provides a fixed 2.2 V output voltage with ±0.5% tolerance at +25°C and ±3% over −40°C to +85°C ambient. This accuracy is achieved through laser-trimmed internal resistor networks and is specified in Table 9 of the NXP datasheet under "ΔVO output voltage variation" for VOUT ≥1.8 V.

Does LD6816CX4/22P,315 support auto-discharge, and how does it work?

Yes, LD6816CX4/22P,315 includes an integrated pull-down transistor that activates when the EN pin is driven LOW, providing a low-ohmic path (typical Rpd = 100 Ω) from OUT to GND. This discharges external output capacitance in under 300 µs, as confirmed in Section 9.8 and Table 9 (tsd(reg)) of the datasheet.

What is the minimum recommended output capacitor for stable operation of LD6816CX4/22P,315?

The LD6816CX4/22P,315 requires a minimum 0.7 µF X7R ceramic capacitor on the OUT pin, with recommended value of 1.0 µF and ESR between 5 mΩ and 500 mΩ. This is specified in Table 10 and Section 10.1 of the datasheet to ensure phase margin and transient response stability.

What is the thermal resistance (Rth(j-a)) of LD6816CX4/22P,315, and how does PCB layout affect it?

The typical junction-to-ambient thermal resistance of LD6816CX4/22P,315 is 130 K/W under standard two-layer PCB conditions (Table 8). Layout significantly impacts this value: connecting all pins - especially GND - to large copper areas and using vias to inner ground/power planes reduces effective Rth(j-a), as detailed in Section 7 footnote [1].

Is LD6816CX4/22P,315 RoHS-compliant and halogen-free?

Yes, LD6816CX4/22P,315 is Pb-free, RoHS-compliant, and fully halogen- and antimony-free (dark green compliant), as stated in Section 1.2 "Features and benefits" of the NXP product data sheet Rev. 1 (2012).

LD6816CX4/22P,315 Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Series:
-
Package/Case:
4-XFBGA, WLCSP
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Output Configuration:
Positive
Output Type:
Fixed
Number of Regulators:
1
Voltage - Input (Max):
5.5V
Voltage - Output (Min/Fixed):
2.2V
Voltage - Output (Max):
-
Voltage Dropout (Max):
0.075V @ 150mA
Current - Output:
150mA
Current - Quiescent (Iq):
100 µA
Current - Supply (Max):
250 µA
PSRR:
55dB (1kHz)
Control Features:
Enable
Protection Features:
Over Current, Over Temperature, Transient Voltage
Operating Temperature:
-40°C ~ 85°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
4-WLCSP (0.76x0.76)

LD6816CX4/22P,315 FAQ

1.How can I place an order for LD6816CX4/22P,315 through Aetrix?

Please submit a Request for Quotation (RFQ) for LD6816CX4/22P,315 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for LD6816CX4/22P,315 reliable?

The price and inventory of LD6816CX4/22P,315 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LD6816CX4/22P,315 is usually 5 days.

3.What payment methods are accepted for LD6816CX4/22P,315?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LD6816CX4/22P,315 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for LD6816CX4/22P,315?

LD6816CX4/22P,315 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your LD6816CX4/22P,315 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for LD6816CX4/22P,315?

For technical support, including LD6816CX4/22P,315 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LD6816CX4/22P,315 requirements.

6.How does Aetrix verify that LD6816CX4/22P,315 is sourced from the original manufacturer or authorized distributors?

All LD6816CX4/22P,315 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LD6816CX4/22P,315 meets industry standards.

7.What is the process for return or replacement of LD6816CX4/22P,315?

All LD6816CX4/22P,315 units undergo pre-shipment inspection (PSI). If there is an issue with LD6816CX4/22P,315, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The LD6816CX4/22P,315 part is unused and in its original packaging.

Return procedure for LD6816CX4/22P,315:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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