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NXP Semiconductors LD6816CX4/25P,315
- Part No.:
- LD6816CX4/25P,315
- Manufacturer:
- NXP Semiconductors
- Package:
- 4-XFBGA, WLCSP
- Datasheet:
-
LD6816CX4/25P,315.pdf
- Description:
- IC REG LINEAR 2.5V 150MA 4WLCSP
- Quantity:
- Payment:
- Shipping:
Inventory:18,000
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Product details
Overview
LD6816CX4/25P,315 from NXP Semiconductors is a 2.5 V fixed-output, 150 mA ultra-low-dropout linear regulator in WLCSP4 package with auto-discharge (pull-down) functionality. It delivers 45 mV dropout at full load, 30 µVRMS output noise (10 Hz–100 kHz), and 55 dB PSRR at 1 kHz, enabling stable power for noise-sensitive analog circuits in space-constrained portable devices.
For engineers reviewing the LD6816CX4/25P,315 datasheet, LD6816CX4/25P,315 pinout, LD6816CX4/25P,315 application, or LD6816CX4/25P,315 equivalent, this page provides verified electrical parameters, validated WLCSP4 pin mapping, confirmed auto-discharge behavior, thermal derating guidance, and real-world mobile interface use cases - all extracted from NXP's official Rev. 1 (2012) product data sheet.
Technical Context
The LD6816CX4/25P,315 integrates a precision bandgap reference, error amplifier, and PMOS pass transistor to maintain regulation across 2.3 V–5.5 V input range. Its pull-down switching transistor actively discharges the output during disable, ensuring rapid voltage decay (<300 µs shutdown time) and preventing floating rail conditions in multi-rail systems.
Designed for high-density portable applications, it features internal over-temperature and current limiting, 10 kV HBM ESD protection, and operates across −40 °C to +85 °C ambient. The 0.76 mm × 0.76 mm × 0.47 mm WLCSP4 package uses 0.4 mm pitch solder bumps and requires ≥0.7 µF X7R output capacitance with 5–500 mΩ ESR for stability.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Output Voltage | Fixed 2.5 V ±2% over −40 °C to +85 °C; enables direct replacement of 2.5 V logic rails without external feedback. |
| Dropout Voltage | 45 mV typical at 150 mA; allows operation with only 2.545 V input, maximizing battery runtime in single-cell Li-ion or Li-poly systems. |
| PSRR | 55 dB at 1 kHz; suppresses switching noise from upstream DC-DC converters feeding sensitive RF or ADC circuitry. |
| Output Noise | 30 µVRMS (10 Hz–100 kHz); meets low-noise requirements for camera sensor bias, audio codec supplies, and precision references. |
| Quiescent Current | 0.1 µA typical in shutdown (VEN ≤ 0.4 V); supports ultra-low-power wake-on-event architectures in always-on subsystems. |
| Enable Threshold | VIH = 1.1 V min, VIL = 0.4 V max; compatible with 1.8 V and 3.3 V GPIOs without level-shifting. |
| Thermal Shutdown | Triggers at 160 °C with 20 K hysteresis; protects against sustained overload or poor PCB thermal design. |
Pinout & Package
Package: Wafer-Level Chip-Scale Package (WLCSP4), 0.76 mm × 0.76 mm × 0.47 mm, 0.4 mm pitch, 4 solder bumps (2×2), Pb-free/RoHS/halogen-free.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A1 (GND) | Supply ground reference | Primary return path for regulator current; must connect to large copper pour for thermal and noise performance. |
| A2 (EN) | Active-HIGH enable input | Drives internal pass transistor; logic HIGH ≥1.1 V enables regulation; LOW ≤0.4 V disables with auto-discharge active. |
| B1 (OUT) | Regulated output voltage | Delivers 2.5 V to load; includes integrated pull-down transistor (100 Ω typical) to discharge external capacitance on disable. |
| B2 (IN) | Input voltage supply | Accepts 2.3–5.5 V; requires local 1 µF ceramic decoupling close to pin to minimize input impedance and improve PSRR. |
Key Features
| Feature | Design Value |
|---|---|
| Auto-discharge function | Integrated 100 Ω pull-down transistor on OUT pin ensures rapid discharge (<300 µs) during disable, eliminating need for external bleed resistors in multi-voltage domain sequencing. |
| Ultra-low noise output | 30 µVRMS noise over 10 Hz–100 kHz enables clean power for image sensors, PLLs, and high-resolution ADCs without additional filtering. |
| Fast start-up time | 150 µs to reach 95% of 2.5 V output; supports dynamic power gating in mobile SoC subsystems requiring sub-millisecond wake-up. |
| High PSRR at low frequency | 55 dB rejection at 1 kHz suppresses ripple from buck converter switching frequencies and their harmonics, critical for RF front-end isolation. |
| Robust protection suite | Includes over-current limit (600 mA short-circuit), thermal shutdown (160 °C), and 10 kV HBM ESD protection - reducing system-level reliability testing burden. |
Applications
| Smartphone Camera Module | Portable Media Player Audio Codec |
|---|---|
Use Scenario: Powers CMOS image sensor analog bias rails and timing circuitry in compact smartphone rear cameras. IC Role / Device Role / Timing Role: Provides ultra-low-noise 2.5 V supply for pixel array bias and ADC reference, synchronized to frame capture timing via EN pin control. Use Value: 30 µVRMS noise prevents fixed-pattern noise in captured images; auto-discharge ensures clean reset between frames without external circuitry. |
Use Scenario: Supplies headphone amplifier and DAC in battery-powered media players with strict THD+N requirements. IC Role / Device Role / Timing Role: Delivers stable 2.5 V reference and analog supply to audio signal chain; enabled only during playback to conserve battery. Use Value: 55 dB PSRR attenuates switching noise from main system DC-DC, preserving >100 dB SNR; 0.1 µA shutdown current extends standby time. |
| Digital Still Camera LCD Bias | Personal Navigation Device GPS Front-End |
Use Scenario: Generates 2.5 V bias for TFT-LCD source driver ICs in compact digital cameras. IC Role / Device Role / Timing Role: Regulates display supply independently from main SoC rail; sequenced via EN to match display power-up timing. Use Value: 45 mV dropout enables operation from partially discharged batteries (≥2.545 V), extending usable battery life per charge cycle. |
Use Scenario: Powers low-noise LNA and downconverter in GPS/GNSS receivers embedded in handheld navigation units. IC Role / Device Role / Timing Role: Supplies clean 2.5 V to RF front-end; disabled during satellite acquisition sleep modes to minimize system quiescent draw. Use Value: 10 kV HBM ESD rating protects sensitive RF inputs during handling; small WLCSP4 footprint saves board area near antenna modules. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar LDO regulator applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Torex XC6219B252MR-G | 2.5 V fixed, 150 mA, 65 mV dropout (typ), 40 µVRMS noise, SOT-25 package (2.9 mm × 2.8 mm) | Larger footprint; no auto-discharge; higher dropout reduces usable battery range | Select when board space permits larger package and auto-discharge is not required for system sequencing. |
| Richtek RT9013-25PB | 2.5 V fixed, 300 mA, 250 mV dropout (typ), 45 µVRMS noise, DFN-6L (2 mm × 2 mm) | Higher current capability but 5.5× higher dropout; no integrated pull-down; larger package | Choose only if >150 mA load current is needed and board layout accommodates larger DFN and higher thermal dissipation. |
Compared with XC6219B252MR-G and RT9013-25PB, LD6816CX4/25P,315 uniquely combines ultra-low dropout (45 mV), low noise (30 µVRMS), and integrated auto-discharge in a 0.76 mm² WLCSP - making it optimal for miniaturized, battery-sensitive portable systems where rail collapse timing and efficiency are critical.
Availability
LD6816CX4/25P,315 is available at Aetrix Electronics and suitable for smartphone camera modules, portable media player audio subsystems, digital still camera displays, and personal navigation device GPS front-ends requiring stable component supply with guaranteed long-term availability.
Supply support for LD6816CX4/25P,315 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and consumer markets.
The LD6816 series was designed specifically for ultra-miniaturized portable electronics requiring low-noise, low-dropout regulation with fast enable/disable control - targeting space-constrained applications like smartphones, wearables, and IoT edge sensors.
FAQ
What is the output voltage tolerance of LD6816CX4/25P,315 over temperature and load?
The LD6816CX4/25P,315 maintains output voltage within ±2% of 2.5 V across −40 °C to +85 °C ambient temperature and 1 mA to 150 mA load current. At +25 °C and 1 mA load, tolerance tightens to ±0.5%; line regulation contributes ≤±0.1%/V over input range 2.7 V to 5.5 V. These values are specified in Table 9 of the NXP datasheet Rev. 1.
Does LD6816CX4/25P,315 require an external pull-down resistor for output discharge?
No. LD6816CX4/25P,315 integrates a dedicated pull-down transistor on the OUT pin (100 Ω typical resistance) that activates automatically when EN is low, providing low-ohmic discharge without external components. This auto-discharge function is inherent to the "P" suffix variant and is confirmed in Sections 1.1 and 9.8 of the datasheet.
What is the minimum recommended output capacitor for stable operation of LD6816CX4/25P,315?
The LD6816CX4/25P,315 requires a minimum 0.7 µF X7R ceramic capacitor at the OUT pin, with ESR between 5 mΩ and 500 mΩ. NXP recommends 1.0 µF as the typical value (Table 10). Using capacitors outside this range risks instability or degraded transient response, especially during load steps or enable transitions.
How does the thermal performance of LD6816CX4/25P,315 depend on PCB layout?
LD6816CX4/25P,315 has a typical junction-to-ambient thermal resistance (Rth(j-a)) of 130 K/W on a two-layer PCB, but this improves significantly with proper layout: connecting all four solder bumps to large copper areas (especially GND and IN), using multiple vias to inner ground/power planes, and avoiding solder mask under the die. Section 7 of the datasheet details these techniques to reduce effective Rth(j-a).
Is LD6816CX4/25P,315 compatible with lead-free reflow soldering processes?
Yes. LD6816CX4/25P,315 is qualified for lead-free reflow per J-STD-020C. Its WLCSP4 package (volume <350 mm³, thickness <1.6 mm) requires a peak reflow temperature of 260 °C. Moisture sensitivity level (MSL) compliance must be observed - refer to NXP packaging documentation for bake and floor-life requirements prior to assembly.
LD6816CX4/25P,315 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 4-XFBGA, WLCSP
- Packaging:
- Bulk
- Product Status:
- Obsolete
- Output Configuration:
- Positive
- Output Type:
- Fixed
- Number of Regulators:
- 1
- Voltage - Input (Max):
- 5.5V
- Voltage - Output (Min/Fixed):
- 2.5V
- Voltage - Output (Max):
- -
- Voltage Dropout (Max):
- 0.075V @ 150mA
- Current - Output:
- 150mA
- Current - Quiescent (Iq):
- 100 µA
- Current - Supply (Max):
- 250 µA
- PSRR:
- 55dB (1kHz)
- Control Features:
- Enable
- Protection Features:
- Over Current, Over Temperature, Transient Voltage
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 4-WLCSP (0.76x0.76)
LD6816CX4/25P,315 FAQ
1.How can I place an order for LD6816CX4/25P,315 through Aetrix?
Please submit a Request for Quotation (RFQ) for LD6816CX4/25P,315 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LD6816CX4/25P,315 reliable?
The price and inventory of LD6816CX4/25P,315 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LD6816CX4/25P,315 is usually 5 days.
3.What payment methods are accepted for LD6816CX4/25P,315?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LD6816CX4/25P,315 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LD6816CX4/25P,315?
LD6816CX4/25P,315 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LD6816CX4/25P,315 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LD6816CX4/25P,315?
For technical support, including LD6816CX4/25P,315 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LD6816CX4/25P,315 requirements.
6.How does Aetrix verify that LD6816CX4/25P,315 is sourced from the original manufacturer or authorized distributors?
All LD6816CX4/25P,315 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LD6816CX4/25P,315 meets industry standards.
7.What is the process for return or replacement of LD6816CX4/25P,315?
All LD6816CX4/25P,315 units undergo pre-shipment inspection (PSI). If there is an issue with LD6816CX4/25P,315, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LD6816CX4/25P,315 part is unused and in its original packaging.
Return procedure for LD6816CX4/25P,315:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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