NXP Semiconductors LD6816CX4/27P,315

Overview

LD6816CX4/27P,315 from NXP Semiconductors is a 2.7 V fixed-output, 150 mA ultra-low-dropout linear regulator in WLCSP4 package with auto-discharge (pull-down) function. It delivers 45 mV dropout at full load, 30 µV_RMS output noise (10 Hz–100 kHz), and 55 dB PSRR at 1 kHz-designed for powering noise-sensitive analog/digital cores in space-constrained mobile devices.

For engineers reviewing the LD6816CX4/27P,315 datasheet, LD6816CX4/27P,315 pinout, LD6816CX4/27P,315 application, or LD6816CX4/27P,315 equivalent, this page provides verified electrical specs, thermal behavior, enable timing, auto-discharge resistance value, and WLCSP4 soldering footprint guidance aligned to J-STD-020C reflow profiles.

Technical Context

The LD6816CX4/27P,315 integrates a precision bandgap reference, error amplifier, and PMOS pass transistor optimized for sub-50 mV dropout across −40 °C to +85 °C ambient. Its active-HIGH enable input (VIH ≥ 1.1 V) controls both regulation and the integrated 100 Ω pull-down switch that discharges the output during shutdown.

Internal over-temperature shutdown (160 °C trigger, 20 K hysteresis) and current limiting (600 mA short-circuit protection) operate independently of enable state. The device requires only a 1.0 µF X7R ceramic output capacitor (ESR 5–500 mΩ) for stability and achieves <150 µs startup time with 150 mA load.

Key Specifications

Pinout & Package

LD6816CX4/27P,315 uses a 0.4 mm pitch Wafer-Level Chip-Scale Package (WLCSP4) measuring 0.76 mm × 0.76 mm × 0.47 mm, with four solder bumps arranged in a 2×2 grid. The package is Pb-free, RoHS-compliant, halogen- and antimony-free (dark green compliant).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar LDO regulator applications.

Compared with XC6219B272MR-G and RT9193-27GB, LD6816CX4/27P,315 uniquely combines ultra-low dropout (45 mV), low noise (30 µV_RMS), and integrated auto-discharge in a 0.76 mm × 0.76 mm WLCSP-enabling smaller PCB area, longer battery life, and simplified power sequencing in space-constrained mobile designs.

Availability

LD6816CX4/27P,315 is available at Aetrix Electronics and suitable for smartphone baseband cores, digital still camera sensor bias, portable media player audio codecs, and personal navigation device GPS front-ends requiring stable component supply with tight voltage tolerance and low-noise performance.

Supply support for LD6816CX4/27P,315 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and mobile applications.

The LD6816 series was designed specifically for ultra-miniaturized, battery-powered consumer electronics-delivering ultra-low dropout, low noise, and integrated power sequencing features in wafer-level chip-scale packaging.

FAQ

What is the nominal output voltage and tolerance of LD6816CX4/27P,315?

The LD6816CX4/27P,315 provides a fixed 2.7 V output with ±2 % tolerance over −40 °C to +85 °C ambient temperature and 1 mA to 150 mA load current. This accuracy is guaranteed across the full operating range without external components, making LD6816CX4/27P,315 suitable for precision voltage rails in mobile SoCs and sensor interfaces.

Does LD6816CX4/27P,315 include an auto-discharge function, and how does it work?

Yes, LD6816CX4/27P,315 integrates an auto-discharge function via an internal 100 Ω pull-down transistor on the OUT pin. When the EN pin is driven LOW, this transistor activates and discharges the output capacitance to <10 % of nominal voltage within 300 µs-eliminating the need for external bleed resistors in power sequencing critical applications like smartphone boot-up and GPS cold start.

What is the minimum recommended output capacitor for stable operation of LD6816CX4/27P,315?

LD6816CX4/27P,315 requires a minimum 0.7 µF X7R ceramic capacitor at the OUT pin, with a recommended value of 1.0 µF and ESR between 5 mΩ and 500 mΩ. Using a 1.0 µF capacitor ensures optimal transient response, stability, and compliance with the specified 150 µs startup time and 300 µs shutdown time-critical for LD6816CX4/27P,315 in portable media and navigation devices.

What are the thermal characteristics and maximum power dissipation limits for LD6816CX4/27P,315?

LD6816CX4/27P,315 has a typical junction-to-ambient thermal resistance (R_th(j-a)) of 130 K/W on a two-layer PCB. Its absolute maximum power dissipation is 770 mW at T_amb = 25 °C, with junction temperature limited to +125 °C. Over-temperature protection shuts down the device at 160 °C with 20 K hysteresis-ensuring reliable operation of LD6816CX4/27P,315 in thermally constrained smartphone and wearable designs.

Is LD6816CX4/27P,315 compatible with lead-free reflow soldering processes?

Yes, LD6816CX4/27P,315 is qualified for lead-free reflow soldering per J-STD-020C. Its WLCSP4 package (0.47 mm typical thickness, ~0.44 mm³ volume) falls into the "<1.6 mm thickness, <350 mm³ volume" category, requiring a peak reflow temperature of 260 °C. Moisture sensitivity level (MSL) compliance and solder paste stencil design per Figure 26 in the datasheet ensure robust assembly yield for LD6816CX4/27P,315 in high-volume manufacturing.