NXP Semiconductors LD6836CX4/12H,315

Overview

LD6836CX4/12H from NXP Semiconductors is a 1.2 V fixed-output, 300 mA ultra-low-dropout linear regulator in a 0.4 mm pitch WLCSP4 package (0.76 × 0.76 × 0.47 mm), featuring 90 mV dropout at full load, 30 µV_RMS output noise (10 Hz–100 kHz), and high-ohmic (3-state) output during disable - designed for power-sensitive mobile interfaces in smartphones and portable media players.

For engineers reviewing the LD6836CX4/12H datasheet, LD6836CX4/12H pinout, LD6836CX4/12H application, or LD6836CX4/12H equivalent, this page delivers verified electrical specs, WLCSP4 terminal mapping, thermal and noise performance data, and validated alternative LDOs for compact, low-noise, battery-powered designs requiring precise 1.2 V rail regulation.

Technical Context

The LD6836CX4/12H implements a PMOS pass transistor architecture enabling ultra-low dropout (90 mV @ 300 mA) and stable operation with only 0.7 µF output capacitance. Its enable input (active HIGH, V_IL ≤ 0.4 V, V_IH ≥ 1.1 V) controls fast start-up (150 µs to 95% V_OUT) while maintaining 0.1 µA shutdown quiescent current.

It integrates over-temperature shutdown (160 °C trigger, 20 K hysteresis), output current limiting (600 mA short-circuit), and 10 kV HBM ESD protection. The high-ohmic disable state isolates the output without pull-down, preserving downstream bias integrity in multi-rail systems.

Key Specifications

Pinout & Package

LD6836CX4/12H uses a 4-bump Wafer-Level Chip-Scale Package (WLCSP4) with 0.4 mm pitch and footprint 0.76 mm × 0.76 mm. Solder bumps face down; index area marks bump A1.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar LDO regulator applications.

Compared with TPS7A0512PDBVR and MCP1700T-1202E/TT, LD6836CX4/12H delivers higher output current (300 mA vs. ≤250 mA), lower dropout (90 mV vs. ≥170 mV), smaller WLCSP4 footprint (0.76 mm² vs. ≥4.6 mm²), and built-in 10 kV HBM ESD - making it superior for miniaturized, noise-sensitive, and sequenced power domains.

Availability

LD6836CX4/12H is available at Aetrix Electronics and suitable for smartphone core supplies, portable media player audio rails, digital camera sensor biasing, and Bluetooth LE SoC I/O regulation requiring stable component supply across high-volume consumer electronics production.

Supply support for LD6836CX4/12H includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and consumer applications, with leadership in power management ICs and RF technologies.

The LD6836 series was engineered specifically for ultra-compact, low-noise, high-efficiency power regulation in portable electronics - emphasizing miniaturization (WLCSP), battery longevity (ultra-low dropout and shutdown IQ), and system robustness (integrated protection).

FAQ

What is the maximum input voltage rating for LD6836CX4/12H?

The absolute maximum input voltage for LD6836CX4/12H is +6.0 V for transient conditions up to 4 ms, with recommended continuous operation between 2.3 V and 5.5 V. Exceeding 6.0 V risks permanent damage; design margin should maintain VIN ≤ 5.5 V under all steady-state and dynamic conditions. The LD6836CX4/12H datasheet specifies these limits in Table 9 (Limiting Values).

Does LD6836CX4/12H require an external output capacitor, and what value is recommended?

Yes, LD6836CX4/12H requires an external output capacitor for stability: minimum 0.7 µF, typical 1.0 µF, with X7R dielectric and ESR between 5 mΩ and 500 mΩ. This capacitor directly impacts startup/shutdown timing and PSRR performance. The LD6836CX4/12H application diagram (Figure 20) shows a standard 1 µF ceramic placement adjacent to the OUT pin.

What is the thermal resistance (R_th(j-a)) of LD6836CX4/12H, and how does it affect PCB layout?

LD6836CX4/12H has a typical junction-to-ambient thermal resistance of 130 K/W (Table 11). To achieve this value, the WLCSP4 package must be mounted on a PCB with solid copper connections to internal ground/power planes - especially under the GND (A1) bump - and avoid solder-mask coverage beneath the die. Poor thermal layout may raise R_th(j-a) beyond 150 K/W, risking thermal shutdown above 100 mA continuous load.

How does the high-ohmic disable state of LD6836CX4/12H differ from pull-down variants like LD6836CX4/12P?

When disabled, LD6836CX4/12H places the OUT pin in a high-impedance (3-state) condition - electrically isolating the output node. In contrast, LD6836CX4/12P activates an internal pull-down transistor (R_pd ≈ 100 Ω) to discharge the output capacitance rapidly. LD6836CX4/12H is selected when downstream circuits must retain bias or avoid unintended discharge paths; LD6836CX4/12P suits applications needing fast rail collapse.

Is LD6836CX4/12H RoHS-compliant and halogen-free?

Yes, LD6836CX4/12H is Pb-free, RoHS-compliant, and fully halogen- and antimony-free - meeting NXP's "dark green" compliance standard. This is confirmed in Section 1.2 (Features and benefits) and applies to both WLCSP4 and WLCSP4/C variants. Full material declarations are available in NXP's official compliance documentation for LD6836_SER.