NXP Semiconductors LD6836CX4/13P,315

Overview

LD6836CX4/13P,315 from NXP Semiconductors is a 1.3 V fixed-output, 300 mA ultra-low-dropout linear regulator in a 0.4 mm pitch WLCSP4 package (0.76 mm × 0.76 mm × 0.47 mm), featuring 90 mV dropout at full load, 30 µV_RMS output noise (10 Hz–100 kHz), and auto-discharge functionality via integrated pull-down transistor. It targets power-sensitive portable applications including smartphone baseband ICs and camera sensor rails.

For engineers reviewing the LD6836CX4/13P,315 datasheet, LD6836CX4/13P,315 pinout, LD6836CX4/13P,315 application, or LD6836CX4/13P,315 equivalent, key selection criteria include its 1.3 V output accuracy (±0.5% at +25°C), 55 dB PSRR at 1 kHz, 150 µs startup time, and guaranteed operation across −40°C to +85°C ambient with input voltage range 2.3 V–5.5 V.

Technical Context

The LD6836CX4/13P,315 implements a PMOS pass transistor architecture enabling ultra-low dropout performance and stable regulation under fast load transients. Its enable input (active HIGH, VIH ≥ 1.1 V) controls both regulation and the integrated 100 Ω pull-down switch that actively discharges the output during shutdown - critical for system-level power sequencing in multi-rail mobile SoCs.

Designed for high-density portable PCBs, it requires only a 1 µF X7R ceramic output capacitor (min. 0.7 µF, ESR 5–500 mΩ) and exhibits low quiescent current (70–100 µA active, 0.1 µA shutdown) and robust protection: over-temperature shutdown at 160°C (20 K hysteresis), output current limiting, and 10 kV HBM ESD rating.

Key Specifications

Pinout & Package

LD6836CX4/13P,315 uses a 4-bump Wafer-Level Chip-Scale Package (WLCSP4) with 0.4 mm pitch and footprint 0.76 mm × 0.76 mm. Solder bumps face downward; pin A1 (GND) is marked by an index area on the die surface.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar LDO regulator applications.

Compared with LD6836CX4/13H and XC6210B132MR-G, LD6836CX4/13P,315 uniquely combines ultra-miniature WLCSP4 packaging, 90 mV dropout, 30 µV_RMS noise, and integrated auto-discharge - making it the only option meeting stringent size, noise, and power-sequencing requirements of modern mobile SoC designs.

Availability

LD6836CX4/13P,315 is available at Aetrix Electronics and suitable for smartphone baseband power, digital camera sensor rails, portable media player core logic, and personal navigation device GPS front-ends requiring stable component supply with guaranteed long-term availability.

Supply support for LD6836CX4/13P,315 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and mobile applications, with leadership in power management, RF, and microcontroller technologies.

The LD6836 series belongs to NXP's ultra-low-noise, ultra-low-dropout LDO portfolio designed specifically for space-constrained, battery-powered portable electronics demanding high accuracy, fast transient response, and integrated power sequencing features like auto-discharge.

FAQ

What is the nominal output voltage and tolerance of the LD6836CX4/13P,315?

The LD6836CX4/13P,315 delivers a fixed 1.3 V output with ±0.5% tolerance at +25°C and ±4% over −40°C to +85°C ambient. This accuracy is achieved through laser-trimmed internal resistive feedback, eliminating external components and ensuring stable core voltage for sensitive digital loads without calibration.

Does the LD6836CX4/13P,315 require external capacitors, and what are the specifications?

Yes, the LD6836CX4/13P,315 requires a minimum 0.7 µF X7R ceramic output capacitor (recommended 1.0 µF) with ESR between 5 mΩ and 500 mΩ. An input capacitor of the same value is also recommended. These values ensure stability, meet transient response specs, and maintain the specified 150 µs startup time and 300 µs shutdown time.

How does the auto-discharge function of the LD6836CX4/13P,315 operate?

When the EN pin is driven LOW, the LD6836CX4/13P,315 activates an integrated 100 Ω pull-down transistor between OUT and GND, discharging external output capacitance within 300 µs (typical). This prevents residual voltage from back-powering downstream circuitry and enables safe, deterministic power-down sequencing in multi-rail systems.

What thermal performance can be expected from the LD6836CX4/13P,315 in a standard PCB layout?

In a two-layer PCB per datasheet conditions, the LD6836CX4/13P,315 exhibits a junction-to-ambient thermal resistance (R_th(j-a)) of 130 K/W. To achieve this, all four solder bumps must connect to large copper areas - especially GND - and avoid solder-mask coverage under the die to maximize heat dissipation.

Is the LD6836CX4/13P,315 RoHS-compliant and halogen-free?

Yes, the LD6836CX4/13P,315 is fully RoHS-compliant, lead-free, and halogen- and antimony-free (NXP "dark green" compliant). It meets JESD22-A115C (machine model) and IEC 61340-3-1 (HBM) ESD standards, with 10 kV HBM and 400 V machine model ratings.