NXP Semiconductors LD6836CX4/18H,315
- Part No.:
- LD6836CX4/18H,315
- Manufacturer:
- NXP Semiconductors
- Package:
- 4-XFBGA, WLCSP
- Datasheet:
-
LD6836CX4/18H,315.pdf
- Description:
- IC REG LINEAR 1.8V 300MA 4WLCSP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
LD6836CX4/18H,315 from NXP Semiconductors is a 1.8 V fixed-output, 300 mA ultra-low-dropout linear regulator in a 0.4 mm pitch WLCSP4 package (0.76 mm × 0.76 mm × 0.47 mm), featuring 90 mV dropout at full load, 30 µVRMS output noise (10 Hz–100 kHz), and high-ohmic (3-state) output during disable - designed for power-sensitive portable applications including smartphone baseband ICs and camera sensor rails.
For engineers reviewing the LD6836CX4/18H,315 datasheet, LD6836CX4/18H,315 pinout, LD6836CX4/18H,315 application, or LD6836CX4/18H,315 equivalent, key selection criteria include its 1.8 V precision output, WLCSP4 footprint constraints, enable-active-HIGH timing (150 µs startup), PSRR of −55 dB at 1 kHz, and thermal shutdown at 160 °C with 20 K hysteresis.
Technical Context
The LD6836CX4/18H,315 implements a PMOS pass transistor architecture enabling ultra-low dropout operation down to 90 mV at 300 mA, with internal voltage reference and error amplifier delivering ±0.5% output accuracy at 25 °C. Its enable input (VEN) accepts 1.1–5.5 V logic-high signals independent of input supply, and it integrates overtemperature protection with 160 °C trip and 20 K hysteresis.
This device belongs to the LD6836x/xxH variant group, meaning it enters a high-impedance (3-state) output mode when disabled - unlike /xxP variants that activate an internal pull-down transistor. It requires a minimum 0.7 µF X7R ceramic output capacitor (ESR 5–500 mΩ) for stability and exhibits 55 dB PSRR at 1 kHz under 30 mA load.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Output voltage | Fixed 1.8 V ±3% over −40 °C to +85 °C ambient; enables direct powering of 1.8 V I/O domains without external feedback. |
| Dropout voltage | 90 mV typical at 300 mA; allows operation with VIN as low as 1.89 V while maintaining regulation - critical for battery-powered systems near end-of-discharge. |
| Quiescent current | 0.1 µA typical in shutdown (VEN ≤ 0.4 V); reduces system standby power leakage in always-on subsystems. |
| Output noise | 30 µVRMS (10 Hz–100 kHz); ensures clean bias for noise-sensitive analog circuits like ADC references or RF front-end LDOs. |
| PSRR | −55 dB at 1 kHz; suppresses switching noise from upstream DC-DC converters feeding the LDO input. |
| Startup time | 150 µs to 95% of 1.8 V; supports fast wake-up sequences in power-gated mobile SoC domains. |
| Thermal resistance | 130 K/W (junction-to-ambient, typical); requires minimal PCB copper area for thermal management in compact WLCSP layouts. |
Pinout & Package
LD6836CX4/18H,315 uses a 4-bump Wafer-Level Chip-Scale Package (WLCSP4) with 0.4 mm pitch, dimensions 0.76 mm × 0.76 mm × 0.47 mm, and laser-marked pin A1 index. The package is Pb-free, RoHS-compliant, and halogen-free.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GND | Supply ground | Primary return path for load current and internal circuitry; must connect to low-impedance ground plane to maintain PSRR and noise performance. |
| EN | Enable input (active HIGH) | Logic-controlled on/off; requires ≥1.1 V to enable; pulls output to high-impedance state when <0.4 V - no external pull-down needed. |
| OUT | Regulated output | Delivers stable 1.8 V to load; connects directly to target IC's VDD_IO or core rail; requires ≥0.7 µF X7R ceramic capacitor with ESR 5–500 mΩ. |
| IN | Input voltage | Accepts 2.3–5.5 V; must be decoupled with ≥0.7 µF capacitor close to pin to prevent instability and input ripple coupling. |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low dropout | 90 mV at 300 mA enables >95% efficiency at 1.8 V output with 2.0 V input - extends battery runtime in Li-ion and coin-cell systems. |
| Low-noise regulation | 30 µVRMS noise floor supports precision analog signal chains without requiring additional filtering stages. |
| High-ohmic disable | True 3-state output during disable isolates downstream circuitry completely - essential for multi-rail sequencing and power domain isolation. |
| Integrated ESD protection | 10 kV HBM rating eliminates need for external TVS diodes on IN/OUT pins in handheld product designs. |
| Thermal & current protection | Auto-shutdown at 160 °C with 20 K hysteresis and current limiting prevent damage during overload or poor PCB thermal design. |
Applications
| Smartphone Baseband Power | Digital Camera Sensor Rail |
|---|---|
Use Scenario: Powering 1.8 V I/O interfaces of LTE/5G baseband processors during active data transmission and deep-sleep modes. IC Role / Device Role / Timing Role: Primary low-noise post-regulator supplying clean 1.8 V to high-speed SerDes and memory interfaces. Use Value: 90 mV dropout preserves headroom from shared 2.0 V intermediate bus; 30 µVRMS noise prevents bit errors in high-Mbps MIPI D-PHY links. | Use Scenario: Delivering regulated 1.8 V to CMOS image sensor digital I/O banks during burst capture and preview streaming. IC Role / Device Role / Timing Role: Dedicated LDO for sensor interface power, enabled synchronously with sensor clock and reset signals. Use Value: 150 µs startup aligns with sensor initialization timing; high-ohmic disable prevents back-powering during sensor power-down sequences. |
| Portable Media Player Audio Codec | Personal Navigation Device GPS Front-End |
Use Scenario: Supplying 1.8 V to stereo audio codec digital I/O and PLL reference inputs in battery-operated MP3 players. IC Role / Device Role / Timing Role: Low-noise auxiliary LDO decoupling codec from noisy main system rail. Use Value: −55 dB PSRR at 1 kHz rejects switching noise from buck converter powering the SoC, preventing audible artifacts in headphone output. | Use Scenario: Providing 1.8 V bias to GPS/GNSS RF front-end LNA and mixer stages in handheld navigation units. IC Role / Device Role / Timing Role: Precision analog rail LDO placed adjacent to RF module to minimize trace inductance and noise coupling. Use Value: 0.1 µA shutdown current minimizes battery drain during GPS cold-start intervals; WLCSP4 size fits tight RF shielded zones. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar LDO regulator applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LD6836TD/18H | SOT753-5 package (3.1 mm × 2.7 mm); higher Rth(j-a) (125 K/W vs. 130 K/W); 100 mV dropout (typ.) at 300 mA. | Requires larger PCB area; better suited for prototyping or less space-constrained industrial modules. | Select when WLCSP assembly capability is unavailable or thermal margin exceeds 130 K/W requirement. |
| AP7361D-18YG-13 | Diodes Inc. 1.8 V, 300 mA LDO in X2-DFN1010-4; 120 mV dropout (typ.); 45 dB PSRR at 1 kHz; no integrated ESD beyond 2 kV HBM. | Lacks 10 kV HBM ESD rating; lower PSRR impacts noise rejection in RF-dense environments. | Choose only if cost sensitivity outweighs ESD robustness and PSRR requirements in consumer-grade non-handheld applications. |
Compared with LD6836TD/18H, the LD6836CX4/18H,315 saves >85% board area but trades 10 mV higher dropout and slightly worse thermal resistance; versus AP7361D-18YG-13, it delivers superior noise immunity and field-reliability via 10 kV HBM protection - critical for handheld electronics.
Availability
LD6836CX4/18H,315 is available at Aetrix Electronics and suitable for smartphone baseband power, digital camera sensor rails, portable media player audio codecs, and personal navigation device GPS front-ends requiring stable component supply with guaranteed long-term manufacturability.
Supply support for LD6836CX4/18H,315 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and mobile applications.
The LD6836 series is part of NXP's ultra-low-noise, miniaturized power management portfolio - engineered specifically for space- and noise-constrained portable electronics where WLCSP integration, sub-100 mV dropout, and 10 kV ESD robustness are mandatory.
FAQ
What is the nominal output voltage and tolerance of the LD6836CX4/18H,315?
The LD6836CX4/18H,315 provides a fixed 1.8 V output with ±0.5% tolerance at 25 °C and ±3% over the full operating temperature range (−40 °C to +85 °C). This accuracy is maintained across input voltages from 2.3 V to 5.5 V and load currents up to 300 mA, making it suitable for precision 1.8 V I/O rail applications without external trimming.
Does the LD6836CX4/18H,315 require an external output capacitor, and what are the specifications?
Yes, the LD6836CX4/18H,315 requires a minimum 0.7 µF X7R ceramic output capacitor with ESR between 5 mΩ and 500 mΩ for stable operation. The recommended value is 1.0 µF, and capacitor tolerance must be ±30% or better across −40 °C to +125 °C. Failure to meet these specs may cause oscillation or degraded transient response.
How does the enable functionality work on the LD6836CX4/18H,315?
The LD6836CX4/18H,315 features an active-HIGH enable input (EN) with VIH ≥ 1.1 V and VIL ≤ 0.4 V. When EN is pulled high, the device starts regulating within 150 µs; when pulled low, it enters high-ohmic (3-state) output mode - isolating the OUT pin completely. No external pull-up or pull-down resistors are required due to internal biasing.
What thermal protection features does the LD6836CX4/18H,315 include?
The LD6836CX4/18H,315 incorporates overtemperature shutdown at 160 °C with 20 K hysteresis, plus output current limiting to protect against short-circuit faults. These features operate independently of enable state and remain active even during disable, ensuring safe thermal behavior in all operating conditions - critical for sealed portable enclosures.
Is the LD6836CX4/18H,315 compatible with lead-free reflow soldering processes?
Yes, the LD6836CX4/18H,315 is qualified for lead-free reflow soldering per J-STD-020C. Its WLCSP4 package has a moisture sensitivity level (MSL) compliant with standard handling protocols, and the peak reflow temperature profile must not exceed 260 °C for ≤30 seconds. Proper PCB land pattern per Figure 26 is required to ensure reliable solder joint formation.
LD6836CX4/18H,315 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 4-XFBGA, WLCSP
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Output Configuration:
- Positive
- Output Type:
- Fixed
- Number of Regulators:
- 1
- Voltage - Input (Max):
- 5.5V
- Voltage - Output (Min/Fixed):
- 1.8V
- Voltage - Output (Max):
- -
- Voltage Dropout (Max):
- 0.16V @ 300mA
- Current - Output:
- 300mA
- Current - Quiescent (Iq):
- 100 µA
- Current - Supply (Max):
- 250 µA
- PSRR:
- 55dB (1kHz)
- Control Features:
- Enable
- Protection Features:
- Over Current, Over Temperature
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 4-WLCSP (0.76x0.76)
LD6836CX4/18H,315 FAQ
1.How can I place an order for LD6836CX4/18H,315 through Aetrix?
Please submit a Request for Quotation (RFQ) for LD6836CX4/18H,315 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LD6836CX4/18H,315 reliable?
The price and inventory of LD6836CX4/18H,315 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LD6836CX4/18H,315 is usually 5 days.
3.What payment methods are accepted for LD6836CX4/18H,315?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LD6836CX4/18H,315 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LD6836CX4/18H,315?
LD6836CX4/18H,315 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LD6836CX4/18H,315 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LD6836CX4/18H,315?
For technical support, including LD6836CX4/18H,315 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LD6836CX4/18H,315 requirements.
6.How does Aetrix verify that LD6836CX4/18H,315 is sourced from the original manufacturer or authorized distributors?
All LD6836CX4/18H,315 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LD6836CX4/18H,315 meets industry standards.
7.What is the process for return or replacement of LD6836CX4/18H,315?
All LD6836CX4/18H,315 units undergo pre-shipment inspection (PSI). If there is an issue with LD6836CX4/18H,315, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LD6836CX4/18H,315 part is unused and in its original packaging.
Return procedure for LD6836CX4/18H,315:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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