NXP Semiconductors LD6836CX4/20P,315

Overview

LD6836CX4/20P,315 from NXP Semiconductors is a 2.0 V fixed-output, 300 mA ultra-low-dropout linear regulator in a 0.4 mm pitch WLCSP4 package (0.76 × 0.76 × 0.47 mm), featuring 90 mV dropout at full load, 30 µV_RMS output noise (10 Hz–100 kHz), and auto-discharge functionality via integrated pull-down transistor. It targets power-sensitive portable applications including smartphone baseband ICs and camera sensor rails.

For engineers reviewing the LD6836CX4/20P,315 datasheet, LD6836CX4/20P,315 pinout, LD6836CX4/20P,315 application, or LD6836CX4/20P,315 equivalent, key selection criteria include its 2.0 V fixed output, WLCSP4 footprint compatibility with high-density mobile PCBs, enable-active-HIGH timing (150 µs startup), and guaranteed 55 dB PSRR at 1 kHz for noise-critical analog supply domains.

Technical Context

The LD6836CX4/20P,315 implements a PMOS pass transistor architecture enabling ultra-low dropout operation down to 90 mV at 300 mA, with internal reference generator, thermal shutdown (160 °C), and overcurrent limiting. Its auto-discharge function-enabled by an integrated 100 Ω pull-down transistor on the OUT pin during disable-ensures rapid output voltage decay for system-level power sequencing compliance.

Designed for stability with 0.7–1.0 µF X7R ceramic output capacitance (ESR 5–500 mΩ), the device operates across −40 °C to +85 °C ambient and supports input voltages from 2.3 V to 5.5 V. The enable threshold is defined by VIH ≥ 1.1 V and VIL ≤ 0.4 V, independent of VIN, ensuring robust logic-level interfacing with application processors and PMICs.

Key Specifications

Pinout & Package

LD6836CX4/20P,315 uses a 4-bump Wafer-Level Chip-Scale Package (WLCSP4) with 0.4 mm pitch and overall dimensions 0.76 mm × 0.76 mm × 0.47 mm. Bump layout follows 2×2 grid with index area marking bump A1.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar LDO regulator applications.

Compared with LD6836CX4/20H and LD6836TD/20P, the LD6836CX4/20P,315 uniquely combines miniaturized WLCSP4 packaging, guaranteed 2.0 V accuracy, and integrated auto-discharge - making it optimal for space-constrained, battery-operated systems requiring deterministic power sequencing.

Availability

LD6836CX4/20P,315 is available at Aetrix Electronics and suitable for smartphone baseband power, digital camera sensor rails, portable media player audio codecs, and personal navigation device GPS front-ends requiring stable component supply with tight parametric consistency and long-term lifecycle support.

Supply support for LD6836CX4/20P,315 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and mobile applications, with leadership in power management, RF, and interface technologies.

The LD6836 series was designed specifically for ultra-miniaturized, low-noise power delivery in portable consumer electronics - emphasizing sub-100 mV dropout, WLCSP packaging, and integrated discharge functionality for modern SoC power architectures.

FAQ

What is the nominal output voltage and tolerance of the LD6836CX4/20P,315?

The LD6836CX4/20P,315 delivers a fixed 2.0 V output with ±2 % tolerance at +25 °C ambient and ±3 % over −30 °C to +85 °C. This accuracy is maintained across input voltages from 2.3 V to 5.5 V and load currents up to 300 mA, as verified in Table 12 of the official NXP datasheet Rev. 2.

Does the LD6836CX4/20P,315 include auto-discharge functionality, and how does it operate?

Yes, the LD6836CX4/20P,315 integrates an auto-discharge function via a 100 Ω pull-down transistor on the OUT pin. When the EN pin is driven LOW (≤0.4 V), the output discharges to 5 % of 2.0 V within 300 µs under a 1 µF load, as specified in Table 12. This eliminates floating outputs during system sleep, ensuring safe I/O state transitions.

What are the recommended external capacitors for stable operation of the LD6836CX4/20P,315?

The LD6836CX4/20P,315 requires a minimum 0.7 µF X7R ceramic capacitor on the OUT pin (CL_ext), with recommended value 1.0 µF and ESR between 5 mΩ and 500 mΩ. An input capacitor (Ci_ext) of 0.7–1.0 µF is also recommended. These values ensure stability, meet transient response specs, and align with Section 10.1 and Table 13 of the NXP datasheet.

What is the thermal resistance and maximum power dissipation of the LD6836CX4/20P,315?

The LD6836CX4/20P,315 has a junction-to-ambient thermal resistance (R_th(j-a)) of 130 K/W under standard two-layer PCB conditions. Its maximum total power dissipation is 770 mW (Table 9), corresponding to ~2.6 W/°C derating - sufficient for 300 mA loads at typical dropout voltages when board layout includes solid copper connections to GND and IN pins.

How does the LD6836CX4/20P,315 compare to the LD6836TD/20P in terms of package and performance?

The LD6836CX4/20P,315 uses a 0.76 mm × 0.76 mm WLCSP4 package, while LD6836TD/20P uses a larger 3.1 mm × 2.7 mm SOT753 package. Both deliver 2.0 V with auto-discharge, but LD6836CX4/20P,315 achieves 90 mV typical dropout versus 100 mV for LD6836TD/20P and offers superior board-area efficiency for high-density mobile PCBs.