NXP Semiconductors LD6836CX4/23P,315

Overview

LD6836CX4/23P,315 from NXP Semiconductors is a 2.3 V fixed-output, 300 mA ultra-low-dropout linear regulator in a 0.4 mm pitch WLCSP4 package (0.76 × 0.76 × 0.47 mm), featuring 90 mV dropout at full load, 30 µV_RMS output noise (10 Hz–100 kHz), and auto-discharge functionality via integrated pull-down transistor. It targets power-sensitive portable applications including smartphone baseband ICs and camera sensor rails.

For engineers reviewing the LD6836CX4/23P,315 datasheet, LD6836CX4/23P,315 pinout, LD6836CX4/23P,315 application, or LD6836CX4/23P,315 equivalent, key selection criteria include its 2.3 V output accuracy (±2% over −30 °C to +85 °C), 55 dB PSRR at 1 kHz, 150 µs startup time, and WLCSP4 thermal resistance of 130 K/W - all critical for compact battery-powered designs requiring low-noise, fast transient response, and controlled shutdown discharge.

Technical Context

The LD6836CX4/23P,315 implements a PMOS pass transistor architecture enabling ultra-low dropout (90 mV typ. at 300 mA) and stable operation with only 0.7 µF output capacitance. Its enable input (active HIGH, VIH ≥1.1 V) controls both regulation and the integrated 100 Ω pull-down switch that actively discharges the output during disable.

Internal protection includes over-temperature shutdown at 160 °C (20 K hysteresis) and current limiting (600 mA short-circuit current). The device operates across 2.3 V–5.5 V input range and maintains ±0.5% output voltage accuracy at 25 °C with 1 mA load, supporting precision analog and digital core supplies in space-constrained mobile platforms.

Key Specifications

Pinout & Package

LD6836CX4/23P,315 uses a 4-bump Wafer-Level Chip-Scale Package (WLCSP4) with 0.4 mm pitch and footprint 0.76 mm × 0.76 mm. Solder bumps are arranged in a 2×2 grid; bump A1 serves as index marker.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar LDO regulator applications.

Compared with LD6836CX4/23P,315, the XC6210B232MR-G trades miniaturization and current capability for mature SOT-25 manufacturability, while the RT9013-23GB offers better thermal dissipation but adds design complexity for discharge control - making LD6836CX4/23P,315 optimal for ultra-compact, fast-shutdown mobile power rails.

Availability

LD6836CX4/23P,315 is available at Aetrix Electronics and suitable for smartphone baseband power, digital camera sensor rails, portable media player audio codecs, and Bluetooth LE SoC I/O supplies requiring stable component supply, consistent WLCSP4 sourcing, and guaranteed auto-discharge functionality.

Supply support for LD6836CX4/23P,315 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and mobile applications, with leadership in RF, analog, and power management ICs.

The LD6836 series was designed specifically for ultra-miniaturized, low-noise power delivery in portable consumer electronics - emphasizing WLCSP integration, sub-100 mV dropout, and intelligent enable-controlled discharge for modern battery-constrained platforms.

FAQ

What is the output voltage tolerance of the LD6836CX4/23P,315 over temperature?

The LD6836CX4/23P,315 delivers 2.3 V output with ±2% tolerance across −30 °C to +85 °C ambient temperature and ±0.5% at +25 °C with 1 mA load. This accuracy is maintained without external trimming, supporting reliable operation in smartphone and wearable thermal environments where junction temperatures can exceed 100 °C.

Does the LD6836CX4/23P,315 require an external capacitor on the output pin?

Yes, the LD6836CX4/23P,315 requires an external 0.7–1.0 µF X7R ceramic capacitor on the OUT pin for stability, as specified in Table 13. Using less than 0.7 µF risks oscillation; exceeding 1.0 µF increases shutdown time. The capacitor must have ESR between 5 mΩ and 500 mΩ and be placed within 2 mm of the WLCSP4 bumps.

How does the auto-discharge function work in the LD6836CX4/23P,315?

When the EN pin is driven LOW, the LD6836CX4/23P,315 activates an internal 100 Ω pull-down transistor between OUT and GND, discharging the output capacitance to 10% of 2.3 V in ≤300 µs (with 1 µF CL). This prevents floating voltages and unintended wake-up in multi-rail systems - a feature absent in "H" variants like LD6836CX4/23H.

What is the maximum input voltage the LD6836CX4/23P,315 can tolerate?

The LD6836CX4/23P,315 supports continuous operation up to 5.5 V on the IN pin, with absolute maximum rating of +6.0 V for 4 ms transients. Exceeding 5.5 V during normal operation risks exceeding the 770 mW power dissipation limit in the WLCSP4 package, especially above 60 °C ambient.

Is the LD6836CX4/23P,315 RoHS-compliant and halogen-free?

Yes, the LD6836CX4/23P,315 is Pb-free, RoHS-compliant, and fully halogen- and antimony-free (NXP's "dark green" compliance standard), meeting JEDEC J-STD-609A Class 1 moisture sensitivity requirements for reflow soldering without baking.