NXP Semiconductors LD6836CX4/30P,315

Overview

LD6836CX4/30P,315 from NXP Semiconductors is a 3.0 V fixed-output, 300 mA ultra-low-dropout linear regulator in a 0.4 mm pitch WLCSP4 package (0.76 mm × 0.76 mm × 0.47 mm), featuring 90 mV dropout at full load, 30 µV_RMS output noise (10 Hz–100 kHz), and auto-discharge functionality via integrated pull-down transistor. It powers low-voltage analog/digital interfaces in space-constrained portable electronics.

For engineers reviewing the LD6836CX4/30P,315 datasheet, LD6836CX4/30P,315 pinout, LD6836CX4/30P,315 application, or LD6836CX4/30P,315 equivalent, key selection criteria include its 3.0 V output accuracy (±2% over temperature), 55 dB PSRR at 1 kHz, 150 µs startup time, 0.1 µA shutdown quiescent current, and WLCSP4 thermal resistance of 130 K/W - all critical for battery-powered mobile SoC power rails.

Technical Context

The LD6836CX4/30P,315 implements a PMOS pass transistor architecture enabling ultra-low dropout (90 mV @ 300 mA) and stable regulation down to 2.3 V input. Its internal reference generator, thermal protection circuitry, and overcurrent limiter operate independently of external components, requiring only a single 1 µF ceramic output capacitor for stability.

Unlike high-ohmic disable variants (e.g., LD6836CX4/30H), this P-suffix device integrates a dedicated pull-down transistor (R_pd = 100 Ω typical) that actively discharges the output node during shutdown - essential for fast power sequencing in multi-rail systems where residual voltage on downstream logic must be cleared within 300 µs.

Key Specifications

Pinout & Package

LD6836CX4/30P,315 uses a 4-bump Wafer-Level Chip-Scale Package (WLCSP4) with 0.4 mm pitch and footprint 0.76 mm × 0.76 mm. Solder bumps are arranged in a 2×2 grid; bump A1 serves as index marker.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar LDO regulator applications.

Compared with LD6836CX4/30H and TPS7A0530PDBVR, the LD6836CX4/30P,315 uniquely combines ultra-miniature WLCSP4 packaging, 90 mV dropout, and integrated 100 Ω pull-down - making it the only option among the three that satisfies simultaneous requirements for board space, battery efficiency, and controlled power-down sequencing.

Availability

LD6836CX4/30P,315 is available at Aetrix Electronics and suitable for smartphone baseband power, digital camera sensor bias, and portable media player audio codec applications requiring stable component supply, consistent WLCSP4 assembly support, and guaranteed automotive-grade reliability screening.

Supply support for LD6836CX4/30P,315 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and consumer electronics markets.

The LD6836 series was designed specifically for ultra-compact, low-noise power management in portable wireless devices - emphasizing miniaturization (WLCSP4), fast transient response, and integrated auto-discharge for advanced power sequencing.

FAQ

What is the nominal output voltage and tolerance of the LD6836CX4/30P,315?

The LD6836CX4/30P,315 delivers a fixed 3.0 V output with ±2% tolerance over the full operating temperature range (−40 °C to +85 °C). This specification is verified per Table 12 of the NXP LD6836_SER datasheet Rev. 2, ensuring compatibility with 3.0 V I/O standards in mobile processors and sensors. The LD6836CX4/30P,315 maintains this accuracy across input voltages from 2.3 V to 5.5 V and load currents up to 300 mA.

Does the LD6836CX4/30P,315 require external capacitors, and what values are recommended?

Yes, the LD6836CX4/30P,315 requires an external 1.0 µF X7R ceramic capacitor on the output (CL(ext)) for stability, with minimum value 0.7 µF and ESR between 5 mΩ and 500 mΩ. An input capacitor (Ci(ext)) of 0.7–1.0 µF is also recommended. These values are specified in Table 13 and Figure 20 of the LD6836_SER datasheet. The LD6836CX4/30P,315's stability is validated only with these capacitor parameters.

How does the auto-discharge function of the LD6836CX4/30P,315 work during shutdown?

When the EN pin is driven LOW, the LD6836CX4/30P,315 activates an internal 100 Ω pull-down transistor between OUT and GND, discharging the output capacitor to 5% of 3.0 V within 300 µs (typical) for a 1 µF load. This behavior is exclusive to P-suffix variants and is documented in Section 1.2 and Table 12 (t_sd(reg)) of the LD6836_SER datasheet. The LD6836CX4/30P,315 eliminates need for external discharge resistors in power-gated systems.

What is the thermal resistance and maximum power dissipation of the LD6836CX4/30P,315?

The LD6836CX4/30P,315 has a typical junction-to-ambient thermal resistance (R_th(j-a)) of 130 K/W under standard two-layer PCB conditions (Table 11). Its maximum total power dissipation is 770 mW (Table 9), calculated as (V_IN − 3.0 V) × I_OUT + (I_q × V_IN). At 300 mA load and 3.3 V input, power dissipation is ~90 mW - well within safe limits. The LD6836CX4/30P,315's thermal performance assumes solid copper connections per Section 7 recommendations.

Is the LD6836CX4/30P,315 RoHS-compliant and halogen-free?

Yes, the LD6836CX4/30P,315 is Pb-free, RoHS-compliant, and free of halogen and antimony - meeting NXP's "dark green" environmental standard as stated in Section 1.2. This compliance is verified per NX1-00023 quality specification (Section 11.1) and applies to both WLCSP4 and WLCSP4/C package variants. The LD6836CX4/30P,315 is qualified for consumer applications and supports lead-free reflow soldering per J-STD-020C.