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NXP Semiconductors LD6836CX4/33P,315
- Part No.:
- LD6836CX4/33P,315
- Manufacturer:
- NXP Semiconductors
- Package:
- 4-XFBGA, WLCSP
- Datasheet:
-
LD6836CX4/33P,315.pdf
- Description:
- IC REG LINEAR 3.3V 300MA 4WLCSP
- Quantity:
- Payment:
- Shipping:
Inventory:27,000
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Product details
Overview
LD6836CX4/33P,315 from NXP Semiconductors is a 3.3 V fixed-output, 300 mA ultra-low-dropout linear regulator in a 0.4 mm pitch WLCSP4 package (0.76 mm × 0.76 mm × 0.47 mm), featuring 90 mV dropout at full load, 30 µV RMS output noise (10 Hz–100 kHz), and auto-discharge functionality via integrated pull-down transistor. It serves as a precision power rail for core logic and RF circuitry in space-constrained portable electronics.
For engineers reviewing the LD6836CX4/33P,315 datasheet, LD6836CX4/33P,315 pinout, LD6836CX4/33P,315 application, or LD6836CX4/33P,315 equivalent, this page delivers verified electrical specs, WLCSP4 terminal mapping, thermal and noise performance data, and validated alternative LDOs for low-noise, miniaturized power management designs.
Technical Context
The LD6836CX4/33P,315 implements a PMOS pass transistor architecture enabling ultra-low dropout (90 mV @ 300 mA) and stable regulation across 2.3 V–5.5 V input range. Its enable pin (active HIGH, VIH ≥ 1.1 V) controls both regulation and the integrated 100 Ω pull-down switch that actively discharges the output during disable - critical for fast power-state transitions in battery-powered systems.
Designed for high PSRR (55 dB @ 1 kHz) and low noise (30 µV RMS), it integrates over-temperature shutdown (160 °C, 20 K hysteresis) and current limiting (600 mA short-circuit protection). The WLCSP4 package requires 0.7–1.0 µF X7R output capacitance with ESR 5–500 mΩ to ensure stability and meet specified 150 µs startup time.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Output Voltage | Fixed 3.3 V ±2 % (Tamb = −40 °C to +85 °C); enables direct replacement of 3.3 V logic rails without external feedback. |
| Dropout Voltage | 90 mV typical @ 300 mA; allows operation with VIN as low as 3.39 V while maintaining regulation - extends battery runtime in Li-ion and coin-cell applications. |
| PSRR | 55 dB @ 1 kHz; suppresses switching noise from upstream DC-DC converters feeding sensitive analog/RF blocks. |
| Output Noise | 30 µV RMS (10 Hz–100 kHz); meets low-noise requirements for ADC references, PLLs, and RF front-ends. |
| Quiescent Current | 0.1 µA typical in shutdown (VEN ≤ 0.4 V); minimizes standby leakage in always-on subsystems. |
| Startup Time | 150 µs to 95 % of 3.3 V (IOUT = 300 mA, CL = 1 µF); supports rapid wake-up in power-gated SoC domains. |
| Pull-down Resistance | 100 Ω typical; ensures fast, controlled discharge of output capacitance (<300 µs to 5 % VOUT) during disable. |
Pinout & Package
Package: Wafer-Level Chip-Scale Package (WLCSP4), 2×2 bump array, 0.4 mm pitch, dimensions 0.76 mm × 0.76 mm × 0.47 mm. Laser-marked with "V" code indicating 3.3 V / pull-down variant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GND (A1) | Supply ground reference | Primary return path for load current and internal bias; must connect to low-impedance ground plane for noise and thermal performance. |
| EN (A2) | Enable control input | Active HIGH logic input (VIH ≥ 1.1 V); asserts regulation and disables pull-down; VIL ≤ 0.4 V initiates auto-discharge mode. |
| OUT (B1) | Regulated output voltage | Delivers stable 3.3 V to load; connects to 0.7–1.0 µF X7R capacitor; pulled low via 100 Ω internal FET when EN = LOW. |
| IN (B2) | Input voltage supply | Accepts 2.3–5.5 V; requires local 0.7–1.0 µF ceramic decoupling; feeds PMOS pass element and internal reference/bias circuits. |
Key Features
| Feature | Design Value |
|---|---|
| Auto-discharge function | Integrated 100 Ω pull-down transistor on OUT pin enables fast, controlled discharge during disable - eliminates need for external bleeder resistors in portable systems. |
| Ultra-low noise output | 30 µV RMS (10 Hz–100 kHz) supports noise-sensitive analog/RF loads without additional filtering. |
| High PSRR at 1 kHz | 55 dB rejection of input ripple improves immunity to switching converter noise in mixed-signal power architectures. |
| Miniature WLCSP4 footprint | 0.76 mm × 0.76 mm area saves >70 % board space vs. SOT753; compatible with fine-pitch reflow assembly. |
| Robust protection suite | Includes over-temperature shutdown (160 °C, 20 K hysteresis), current limiting (600 mA), and 10 kV HBM ESD rating - enhances field reliability. |
Applications
| Smartphone Application Processor Core Rail | Wi-Fi/Bluetooth RF Front-End Power |
|---|---|
Use Scenario: Powers 3.3 V I/O and auxiliary cores in smartphone APs where battery voltage drops below 3.6 V during discharge. IC Role / Device Role / Timing Role: Primary LDO delivering regulated 3.3 V with <150 µs startup to meet AP wake-up timing budgets. Use Value: 90 mV dropout extends usable battery life by >12 minutes per charge cycle compared to 200 mV-dropout alternatives. |
Use Scenario: Supplies clean 3.3 V to Wi-Fi/BT transceiver ICs adjacent to noisy DC-DC converters and digital baseband. IC Role / Device Role / Timing Role: Low-noise, high-PSRR post-regulator isolating RF section from system-wide supply ripple. Use Value: 30 µV RMS noise and 55 dB PSRR prevent EVM degradation and maintain >25 dB ACLR in 2.4 GHz transmission. |
| Digital Still Camera Image Sensor Bias | Portable Media Player Audio Codec Supply |
Use Scenario: Provides stable 3.3 V bias to CMOS image sensor analog front-end during burst capture sequences. IC Role / Device Role / Timing Role: Low-noise LDO ensuring minimal temporal noise coupling into pixel readout paths. Use Value: Sub-30 µV RMS noise prevents fixed-pattern noise artifacts and maintains >72 dB SNR in raw image data. |
Use Scenario: Powers stereo audio codec in battery-operated media players requiring silent operation and long playback. IC Role / Device Role / Timing Role: Auto-discharge LDO enabling instant mute and fast power-down between track changes. Use Value: 100 Ω pull-down discharges 10 µF output cap in <300 µs - eliminates audible pop/click during playback transitions. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar LDO regulator applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LD6836CX4/33H | Same WLCSP4 package and 3.3 V output, but high-ohmic (3-state) output during disable - no auto-discharge. | Used where output must float during shutdown (e.g., shared bus lines), not where active discharge is required. | Select LD6836CX4/33H only if system design prohibits output sinking during disable. |
| TPS7A0533PDBVR | 300 mA, 3.3 V LDO in 5-pin SOT-23; 170 mV dropout (vs. 90 mV); 25 µV RMS noise; no integrated pull-down. | Requires external discharge circuitry; larger footprint (2.9 mm × 1.6 mm vs. 0.76 mm²); suitable for less space-constrained designs. | Choose TPS7A0533PDBVR only if SOT-23 assembly infrastructure exists and WLCSP4 reflow capability is unavailable. |
Compared with LD6836CX4/33H and TPS7A0533PDBVR, the LD6836CX4/33P,315 uniquely combines ultra-low dropout, wafer-level miniaturization, and integrated auto-discharge - making it optimal for next-generation portable devices demanding simultaneous size, efficiency, and fast power sequencing.
Availability
LD6836CX4/33P,315 is available at Aetrix Electronics and suitable for smartphone power management, portable RF modules, digital camera sensor biasing, and portable media player audio subsystems requiring stable component supply and guaranteed long-term availability.
Supply support for LD6836CX4/33P,315 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company specializing in secure connectivity solutions for automotive, industrial, and consumer electronics, with leadership in power management, RF, and embedded security.
The LD6836 series was designed specifically for ultra-miniaturized, low-noise power delivery in portable and battery-powered applications - emphasizing dropout voltage, noise performance, and package size reduction without sacrificing protection or stability.
FAQ
What is the maximum input voltage rating for LD6836CX4/33P,315?
The LD6836CX4/33P,315 supports an absolute maximum input voltage of +6.0 V for transient conditions up to 4 ms. Its recommended operating input range is 2.3 V to 5.5 V. Exceeding 6.0 V risks permanent damage to the internal PMOS pass transistor and bandgap reference circuitry. Always include input transient suppression if used in environments with voltage spikes.
Does LD6836CX4/33P,315 require an external output capacitor, and what are the specifications?
Yes, LD6836CX4/33P,315 requires an external output capacitor of 0.7–1.0 µF X7R ceramic type with ESR between 5 mΩ and 500 mΩ. This capacitor ensures loop stability, reduces output impedance at high frequencies, and supports the specified 150 µs startup time. Using a lower-value or higher-ESR capacitor may cause oscillation or extended settling time.
How does the auto-discharge function work in LD6836CX4/33P,315?
When the EN pin is driven LOW (≤0.4 V), LD6836CX4/33P,315 activates an internal 100 Ω NMOS pull-down transistor between OUT and GND. This discharges the output capacitance to 5 % of 3.3 V within 300 µs (with 1 µF load), eliminating residual voltage that could cause latch-up or unintended wake-up in downstream circuitry - no external components needed.
What is the thermal resistance (Rth(j-a)) of LD6836CX4/33P,315, and how does it affect layout?
The LD6836CX4/33P,315 has a typical junction-to-ambient thermal resistance of 130 K/W under standard two-layer PCB conditions. To achieve this, all four solder bumps must connect to large copper areas - especially GND (A1) - and thermal vias should be placed directly beneath the die. Avoid solder mask over the WLCSP4 footprint to maximize heat transfer.
Is LD6836CX4/33P,315 RoHS-compliant and halogen-free?
Yes, LD6836CX4/33P,315 is fully RoHS-compliant, lead-free, and halogen- and antimony-free - meeting NXP's "dark green" compliance standard. This ensures environmental safety and compatibility with lead-free reflow soldering profiles (peak temperature ≤260 °C) required by modern electronics manufacturing.
LD6836CX4/33P,315 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- 4-XFBGA, WLCSP
- Packaging:
- Bulk
- Product Status:
- Obsolete
- Output Configuration:
- Positive
- Output Type:
- Fixed
- Number of Regulators:
- 1
- Voltage - Input (Max):
- 5.5V
- Voltage - Output (Min/Fixed):
- 3.3V
- Voltage - Output (Max):
- -
- Voltage Dropout (Max):
- 0.16V @ 300mA
- Current - Output:
- 300mA
- Current - Quiescent (Iq):
- 100 µA
- Current - Supply (Max):
- 250 µA
- PSRR:
- 55dB (1kHz)
- Control Features:
- Enable
- Protection Features:
- Over Current, Over Temperature
- Operating Temperature:
- -40°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 4-WLCSP (0.76x0.76)
LD6836CX4/33P,315 FAQ
1.How can I place an order for LD6836CX4/33P,315 through Aetrix?
Please submit a Request for Quotation (RFQ) for LD6836CX4/33P,315 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LD6836CX4/33P,315 reliable?
The price and inventory of LD6836CX4/33P,315 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LD6836CX4/33P,315 is usually 5 days.
3.What payment methods are accepted for LD6836CX4/33P,315?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LD6836CX4/33P,315 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LD6836CX4/33P,315?
LD6836CX4/33P,315 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LD6836CX4/33P,315 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LD6836CX4/33P,315?
For technical support, including LD6836CX4/33P,315 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LD6836CX4/33P,315 requirements.
6.How does Aetrix verify that LD6836CX4/33P,315 is sourced from the original manufacturer or authorized distributors?
All LD6836CX4/33P,315 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LD6836CX4/33P,315 meets industry standards.
7.What is the process for return or replacement of LD6836CX4/33P,315?
All LD6836CX4/33P,315 units undergo pre-shipment inspection (PSI). If there is an issue with LD6836CX4/33P,315, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LD6836CX4/33P,315 part is unused and in its original packaging.
Return procedure for LD6836CX4/33P,315:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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