STMicroelectronics LDL112D10R

Overview

LDL112D10R from STMicroelectronics is a 1.0 V fixed-output, 1.2 A low-dropout linear regulator with 300 mV typical dropout at 1 A, ±2.0% output voltage accuracy at 25 °C, reverse current protection, and logic-controlled shutdown. It operates from 1.6 V to 5.5 V input and supports ceramic output capacitors as low as 1 µF - ideal for USB-powered devices and battery-powered point-of-load regulation.

For engineers reviewing the LDL112D10R datasheet, LDL112D10R pinout, LDL112D10R application, or LDL112D10R equivalent, key selection criteria include dropout voltage under 1.2 A load, sub-1 µA shutdown current, thermal/short-circuit protection behavior, and compatibility with 1 µF ceramic COUT in space-constrained DFN6 (3x3) or SO8-batwing packages.

Technical Context

The LDL112D10R uses a PMOS pass transistor architecture enabling ultra-low dropout and inherent reverse current blocking without external components. Its bandgap-referenced error amplifier drives the gate of the PMOS element to regulate output voltage with static line regulation of 0.05–0.1 %/V and load regulation of 15–30 mV across 0–1.2 A.

Thermal shutdown activates at 165 °C with 20 °C hysteresis, and internal current limiting caps short-circuit current at 1.4–2 A. The EN pin accepts TTL/CMOS logic levels (V_IL ≤ 0.35 V, V_IH ≥ 1.4 V), and the exposed pad must be connected to GND for thermal and electrical integrity.

Key Specifications

Pinout & Package

LDL112D10R is available in SO8-batwing and DFN6 (3x3) mm packages. Both variants feature identical pin functions and require the exposed pad to be soldered to GND for optimal thermal performance and EMI suppression.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar low-dropout, fixed-output LDO applications.

Compared with XC6219B102MR-G and RT9013-10GB, LDL112D10R uniquely combines 1.2 A capability, true reverse current blocking, and sub-1 µA shutdown in a thermally robust SO8/DFN6 package - making it the only drop-in solution for high-current, safety-critical, or multi-source power architectures.

Availability

LDL112D10R is available at Aetrix Electronics and suitable for USB-powered peripherals, battery-powered wearables, and industrial sensor nodes requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for LDL112D10R includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader specializing in power management, microcontrollers, and analog ICs, with manufacturing aligned to ISO 9001 and AEC-Q200 standards.

The LDL112 series belongs to ST's high-efficiency, low-quiescent-current LDO portfolio designed specifically for battery-constrained and thermally demanding applications in consumer, industrial, and automotive segments.

FAQ

What is the minimum output capacitor required for stable operation?

The LDL112D10R is stable with a minimum 1 µF ceramic capacitor on VOUT, provided its ESR is below 10 mΩ. This value is validated across all supported packages and input voltages up to 5.5 V. Larger values (up to 10 µF) improve transient response but are not required for stability.

Does LDL112D10R provide reverse current protection in both ON and OFF states?

Yes - reverse current protection is active in all operating conditions: during normal operation (EN = high), shutdown (EN = low), and fast transients. The internal PMOS gate and bulk switching scheme physically blocks conduction from VOUT to VIN whenever VOUT exceeds VIN by more than 100 mV.

Can LDL112D10R be used with an input voltage lower than 1.6 V?

No - the absolute minimum input voltage is 1.6 V per datasheet specifications. Operation below this threshold may cause regulation loss, increased dropout, or undefined behavior. For sub-1.6 V inputs, consider ST's LDL111 series or alternative ultra-low-VIN LDOs.

Is the exposed pad electrically connected, and how must it be handled in PCB layout?

Yes - the exposed pad is internally connected to GND and must be soldered to a dedicated GND copper pour on the PCB. It serves dual roles: thermal dissipation (reducing R_thJA by up to 45 °C/W in DFN6) and noise reduction. Floating or unconnected pads violate thermal specs and risk instability or premature failure.