STMicroelectronics LDL112PV33R

Overview

LDL112PV33R from STMicroelectronics is a fixed-output 3.3 V, 1.2 A low-dropout linear regulator with 300 mV typical dropout at 1 A, ±2.0% output voltage tolerance at 25 °C, reverse current protection, and logic-controlled shutdown. It operates from 1.6 V to 5.5 V input and supports ceramic output capacitors as low as 1 µF - used in USB-powered devices and battery-powered point-of-load regulation.

For engineers reviewing the LDL112PV33R datasheet, LDL112PV33R pinout, LDL112PV33R application, or LDL112PV33R equivalent, key selection criteria include dropout voltage at full load, quiescent current in active/off modes, thermal resistance in DFN6 (3x3) package, reverse current blocking behavior, and compatibility with 1 µF ceramic output capacitance.

Technical Context

The LDL112PV33R uses a PMOS pass transistor architecture enabling true reverse current protection and ultra-low dropout. Its internal bandgap reference (800 mV) and error amplifier regulate output via feedback to the ADJ pin in adjustable versions; this fixed 3.3 V variant integrates that reference network internally.

Thermal shutdown triggers at 165 °C with 20 °C hysteresis, and current limiting caps short-circuit current at ~1.4–2 A. The enable pin (EN) accepts TTL/CMOS logic levels (V_IL ≤ 0.35 V, V_IH ≥ 1.4 V) and draws only 100 nA, supporting low-power system sequencing.

Key Specifications

Pinout & Package

LDL112PV33R is packaged in DFN6 (3×3) mm with exposed thermal pad, offering 55 °C/W junction-to-ambient thermal resistance when mounted on 6 cm² copper heatsink. Pin 1 is VIN; Pin 2 is GND; Pin 3 is EN; Pin 4 is VOUT; Pin 5 is NC; Pin 6 is Exposed Pad (must be connected to GND).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar LDO regulator applications.

Compared with XC6210B332MR-G and BD33IC0WEFJ-C, LDL112PV33R uniquely combines 1.2 A capability, 300 mV dropout, and integrated reverse current protection - eliminating external components and enabling robust power domain partitioning in space-constrained, multi-rail systems.

Availability

LDL112PV33R is available at Aetrix Electronics and suitable for USB-powered devices, battery-powered point-of-load systems, and low-voltage industrial controllers requiring stable component supply across long production lifecycles.

Supply support for LDL112PV33R includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing analog, power, microcontroller, and sensor solutions for industrial, automotive, and consumer markets.

The LDL112 series belongs to ST's high-efficiency, low-quiescent-current LDO portfolio - engineered specifically for energy-sensitive battery-operated and USB-powered applications demanding reverse current blocking and ceramic capacitor compatibility.

FAQ

What is the minimum input voltage required for LDL112PV33R to maintain 3.3 V output at 1.2 A?

The minimum input voltage is determined by dropout: at 1.2 A, max dropout is 600 mV (−40 °C to +125 °C). Thus, VIN(min) = 3.3 V + 0.6 V = 3.9 V. At 25 °C, typical dropout is 350 mV, so VIN(min) ≈ 3.65 V. Operation below 3.9 V at full load and high temperature risks regulation loss.

Can LDL112PV33R be used with a 2.2 µF X5R ceramic output capacitor?

Yes - the device is stable with 1–10 µF ceramic capacitors (X5R/X7R), including 2.2 µF. Stability testing (Figure 25) confirms robust phase margin across this range when ESR is <10 mΩ. No series resistor or ferrite bead is needed, simplifying layout.

Does the exposed thermal pad on the DFN6 (3×3) package require solder mask opening?

Yes - the exposed pad must be fully exposed (no solder mask) and connected to a solid GND plane using ≥4 thermal vias (0.3 mm diameter, spaced ≤1 mm apart). This achieves the specified 55 °C/W R_thJA; omitting vias or masking the pad degrades thermal performance by >40%.

Is the EN pin internally pulled down when not driven?

No - the EN pin has no internal pull-down. Leaving it floating violates the "Don't leave this pin floating" requirement in Table 1. A 100 kΩ pull-down resistor to GND or active drive from MCU GPIO is mandatory to ensure predictable startup and shutdown behavior.