STMicroelectronics LDLN025PU12R

Overview

LDLN025PU12R from STMicroelectronics is a 250 mA ultra-low-noise LDO voltage regulator in DFN4-1x1 package, delivering 1.2 V output with ±2% accuracy across -40 °C to +125 °C, 6.5 μVRMS noise (10 Hz–100 kHz), 250 mV dropout at 250 mA, and 80 dB PSRR at 100 Hz. It powers noise-sensitive RF and imaging circuits in space-constrained portable devices.

For engineers reviewing the LDLN025PU12R datasheet, LDLN025PU12R pinout, LDLN025PU12R application, or LDLN025PU12R equivalent, this page provides verified electrical specs, package mapping, real-world load/line transient behavior, thermal protection thresholds, and validated alternatives for battery-powered analog signal chains.

Technical Context

The LDLN025PU12R uses a bandgap-referenced error amplifier with internal soft-start and logic-controlled enable to manage power sequencing in multi-rail systems. Its low-quiescent-current bias generator maintains 12 μA I_Q at no-load while retaining regulation down to 1.5 V input.

Designed for ceramic-capacitor stability, it integrates overcurrent and thermal shutdown (160 °C trip, 20 °C hysteresis), output discharge (230 Ω), and controlled I_Q in dropout-enabling extended runtime in always-on sensor nodes and mobile image sensors.

Key Specifications

Pinout & Package

LDLN025PU12R is supplied in DFN4-1x1 (1.0 mm × 1.0 mm, 0.38 mm pitch) package with wettable flank leads and exposed thermal pad requiring GND connection. Thermal resistance R_thJA = 220 °C/W.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar low-noise LDO applications.

Compared with XC6210B122MR-G and ADP160ACBZ-1.2-R7, LDLN025PU12R uniquely delivers 250 mA capability with 6.5 μVRMS noise in a 1 mm² DFN-making it the only option for space-constrained, high-performance RF and imaging power rails.

Availability

LDLN025PU12R is available at Aetrix Electronics and suitable for smartphone camera modules, VCO power supplies, portable medical sensors, and industrial IoT edge nodes requiring stable component supply with guaranteed long-term availability.

Supply support for LDLN025PU12R includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, specializing in power management, analog, MEMS, and microcontrollers for automotive, industrial, and consumer markets.

The LDLN025 series belongs to ST's ultra-low-noise LDO product line, engineered specifically for powering noise-sensitive RF, imaging, and precision analog circuits in battery-operated portable electronics.

FAQ

What is the maximum input voltage for LDLN025PU12R?

The absolute maximum input voltage is 7 V, but the recommended operating range is 1.5 V to 5.5 V. Exceeding 5.5 V risks violating the V_OUT + 0.3 V limit (since V_OUT = 1.2 V), potentially damaging the output stage. Operation above 5.5 V is not characterized or guaranteed per DS11756 Rev 8.

Can LDLN025PU12R be used with 0.47 μF output capacitance?

No-0.47 μF is below the minimum recommended C_OUT of 0.7 μF. Using 0.47 μF risks instability, as confirmed by Figure 19 (stability region starts at 0.7 μF for ESR ≤500 mΩ). A 1 μF X7R ceramic capacitor is the validated standard for all operating conditions.

Does the NC pin require PCB routing?

No-the NC pin is not internally connected and has no electrical function. Per Table 1 and DS11756 page 3, it may be left unconnected or tied to GND solely for mechanical reinforcement; no current flows through it, and routing is optional.

How does thermal shutdown behave under sustained overload?

Thermal shutdown activates at 160 °C junction temperature with 20 °C hysteresis. Once tripped, the device disables output and remains off until T_J drops to ~140 °C. This protects against permanent damage during continuous 300 mA overload or poor PCB thermal design, as verified in Table 4 and Figure 14.