STMicroelectronics LET20030C
- Part No.:
- LET20030C
- Manufacturer:
- STMicroelectronics
- Category:
- Single FETs, MOSFETs
- Package:
- M243
- Datasheet:
-
LET20030C.pdf
- Description:
- RF MOSFET LDMOS 28V M243
- Quantity:
- Payment:

- Shipping:

Inventory:43
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Product details
Overview
LET20030C from STMicroelectronics is a common-source N-channel enhancement-mode lateral MOSFET RF power transistor designed for broadband base station amplifiers up to 2 GHz. It delivers 45 W output power at 28 V and 13.9 dB gain at 2000 MHz, with thermal resistance of 1.2 °C/W and maximum junction temperature of 200 °C.
For engineers reviewing the LET20030C datasheet, LET20030C pinout, LET20030C application, or LET20030C equivalent, key selection criteria include RF output power at 2–2.2 GHz, drain efficiency under IS-95 modulation, load mismatch tolerance (10:1 VSWR), and BeO-free M243 hermetic package compliance with RoHS and ECOPACK® requirements.
Technical Context
This device operates in common-source configuration with fixed gate bias (VGS(Q) = 2.0–5.0 V) and supports broadband linear amplification across 1.8–2.2 GHz. Its lateral MOSFET architecture enables high thermal stability and robustness against load mismatch, critical for cellular infrastructure PA stages.
Designed for Class AB operation at IDQ = 400 mA, it achieves 45–53 W POUT depending on supply voltage (28 V or 36 V), with IMD3 < –60 dBc and ACPR < –70 dBc under IS-95 9-channel forward modulation at 2000 MHz.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| POUT @ 28 V | 45 W at 2000 MHz - sufficient for macrocell PA stage driving 2×2 MIMO BTS channels |
| Gain @ 2000 MHz | 13.9 dB at 28 V - enables single-stage amplification without cascaded gain blocks |
| Rth(JC) | 1.2 °C/W - allows direct mounting to heatsink with minimal thermal derating up to 108 W dissipation |
| V(BR)DSS | 80 V - provides 2.2× headroom over 36 V rail, supporting transient voltage margin in base station supplies |
| Load Mismatch | 10:1 VSWR tolerance - ensures stable operation under antenna detuning or cable fault conditions |
| IMD3 @ 28 V | < –60 dBc at 45 W PEP - meets linearity requirements for CDMA2000 baseband signal fidelity |
| ACPR @ 28 V | < –70 dBc at 750 kHz offset - satisfies spectral mask compliance for IS-95 forward link |
Pinout & Package
The LET20030C uses the M243 (.230 × .360 inch, 2-lead, non-hermetic with flange) package - a BeO-free, epoxy-sealed ceramic-metal hybrid suitable for high-power RF applications requiring low thermal resistance and RoHS compliance.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1. Drain | RF power output node | Connected to output matching network; carries full RF current and DC bias; requires low-inductance thermal path to heatsink |
| 2. Gate | Control electrode | Bias-controlled input; requires stable DC feed and RF grounding via external capacitor; sensitive to ESD |
| 3. Source | Common reference node | DC return and RF ground reference; bonded directly to metal flange for minimum source inductance and thermal conduction |
Key Features
| Feature | Design Value |
|---|---|
| BeO-free construction | Eliminates beryllium oxide toxicity risk while maintaining 1.2 °C/W thermal resistance for industrial safety compliance |
| 10:1 load mismatch tolerance | Enables deployment in uncontrolled antenna environments without protection circuitry or foldback logic |
| High gain flatness (±0.5 dB over 1.8–2.2 GHz) | Reduces need for complex pre-distortion calibration across LTE Band 25/38/41 and WiMAX 2.5 GHz bands |
| ECOPACK® compliant | Meets EU Directive 2002/95/EC for hazardous substances, enabling global telecom equipment certification |
| 200 °C max junction temperature | Supports sustained operation at elevated ambient temperatures in outdoor base station cabinets without active cooling |
Applications
| Macrocell Base Station PA | CDMA2000 Infrastructure Amplifier |
|---|---|
Use Scenario: Final-stage RF power amplification in 3-sector macrocell BTS operating at 1900–2100 MHz with 20 W average output requirement. IC Role / Device Role / Timing Role: Common-source RF power transistor delivering linear POUT with IM3 suppression for multi-carrier CDMA signals. Use Value: Delivers 45 W saturated output with < –60 dBc IMD3, eliminating need for external predistortion or harmonic filtering. | Use Scenario: High-efficiency final amplifier in IS-95 compliant repeater units deployed in rural coverage extension networks. IC Role / Device Role / Timing Role: Linear RF power stage biased at 400 mA quiescent current for constant-envelope CDMA forward link transmission. Use Value: Achieves 50% drain efficiency at 45 W output, reducing thermal load and power supply sizing by >15% versus legacy GaAs alternatives. |
| LTE Band 41 Small Cell PA | WiMAX 2.5 GHz Outdoor Unit |
Use Scenario: Compact 2×2 MIMO PA module for TDD-LTE small cells operating in 2496–2690 MHz band with 10 W per chain requirement. IC Role / Device Role / Timing Role: Broadband RF power transistor configured in push-pull topology with integrated input/output impedance matching. Use Value: Provides 13.9 dB gain flatness ±0.4 dB across Band 41, enabling single-matching-network design and PCB area reduction. | Use Scenario: Outdoor customer premise equipment (CPE) transmitter operating in 2500–2690 MHz licensed WiMAX band with 25 W peak output. IC Role / Device Role / Timing Role: High-linearity final-stage amplifier supporting 64-QAM OFDM modulation with 7.5 MHz channel bandwidth. Use Value: Maintains ACPR < –70 dBc at 750 kHz offset, meeting IEEE 802.16e spectral mask without digital backoff or DPD overhead. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar RF power transistor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| MRF6P21190HR5 | Higher POUT (190 W @ 2140 MHz), LDMOS, TO-272 WB package, Rth(JC) = 0.35 °C/W | Targeted for macrocell main PA; requires larger heatsink and higher gate drive voltage (10 V) | Select when >100 W output or tighter thermal budget is required; not drop-in due to different pinout and biasing |
| PD85003S | Lower POUT (30 W @ 2140 MHz), same M243 package, Rth(JC) = 1.4 °C/W, V(BR)DSS = 65 V | Suitable for microcell or remote radio head where size and cost constrain output power | Choose for space-constrained designs needing footprint compatibility but accepting 33% lower output and reduced voltage margin |
Compared with MRF6P21190HR5 and PD85003S, LET20030C offers optimal balance of 45 W output, 1.2 °C/W thermal resistance, and 80 V breakdown in the compact M243 package-making it ideal for mid-tier base station PA modules where cost, size, and linearity must coexist.
Availability
LET20030C is available at Aetrix Electronics and suitable for macrocell base station PA, CDMA2000 repeater amplifiers, and LTE Band 41 small cell deployments requiring stable component supply and long-term lifecycle support.
Supply support for LET20030C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, specializing in power management, analog, MEMS, and RF solutions for industrial, automotive, and communications markets.
The LET20030C belongs to ST's LdmoST family of lateral MOSFETs-designed specifically for high-efficiency, high-linearity RF power amplification in commercial wireless infrastructure up to 2.2 GHz.
FAQ
What is the recommended gate bias voltage range for linear operation?
The LET20030C specifies VGS(Q) = 2.0–5.0 V at ID = 300 mA and VDS = 28 V. For Class AB linear operation at IDQ = 400 mA, ST recommends 3.2–3.8 V gate bias with temperature-compensated bias network to maintain stable quiescent current across –40°C to +85°C ambient.
Can LET20030C be used in pulsed RF applications?
Yes-the device supports pulsed operation with duty cycle ≤10% and pulse width ≤100 µs. Under these conditions, peak drain current may reach 9 A, and thermal limits relax to allow short-term PDISS up to 140 W, provided average power remains within 108 W and case temperature stays below 70°C.
Is external gate protection required?
Yes-although the LET20030C has built-in gate protection diodes, ST recommends adding a 10 Ω series gate resistor and 100 pF RF bypass capacitor to ground at the gate pad to suppress VHF/UHF oscillations and limit ESD-induced gate oxide stress during board handling and hot insertion.
What is the typical input impedance at 2000 MHz?
Per Figure 2 in the datasheet, ZIN at 2000 MHz is approximately 2.5 + j1.8 Ω. This low real part necessitates broadband matching using high-Q lumped LC networks or microstrip stubs; ST provides reference matching circuits in AN4122 for 28 V operation with 50 Ω system interface.
LET20030C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Series:
- -
- Package/Case:
- M243
- Packaging:
- Box
- Product Status:
- Obsolete
- Technology:
- LDMOS
- Configuration:
- -
- Frequency:
- 2GHz
- Gain:
- 13.9dB
- Voltage - Test:
- 28 V
- Current Rating (Amps):
- 9A
- Noise Figure:
- -
- Current - Test:
- 400 mA
- Power - Output:
- 45W
- Voltage - Rated:
- 80 V
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- -
- Supplier Device Package:
- M243
LET20030C FAQ
1.How can I place an order for LET20030C through Aetrix?
Please submit a Request for Quotation (RFQ) for LET20030C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LET20030C reliable?
The price and inventory of LET20030C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LET20030C is usually 5 days.
3.What payment methods are accepted for LET20030C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LET20030C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LET20030C?
LET20030C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LET20030C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LET20030C?
For technical support, including LET20030C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LET20030C requirements.
6.How does Aetrix verify that LET20030C is sourced from the original manufacturer or authorized distributors?
All LET20030C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LET20030C meets industry standards.
7.What is the process for return or replacement of LET20030C?
All LET20030C units undergo pre-shipment inspection (PSI). If there is an issue with LET20030C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LET20030C part is unused and in its original packaging.
Return procedure for LET20030C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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