Texas Instruments LM26484SQEV

Overview

LM26484SQEV from Texas Instruments is an evaluation board for the LM26484 power management unit, featuring two externally configurable 2.0A step-down DC-DC converters and one LDO controller. Pre-configured outputs are 1.8V (Buck1), 1.0V (Buck2), and 1.0V (LDO), with all voltages adjustable via external feedback resistors. It supports common-input voltage systems in embedded power subsystem validation.

For engineers reviewing the LM26484SQEV datasheet, LM26484SQEV pinout, LM26484SQEV application, or LM26484SQEV equivalent, this board enables rapid characterization of regulator stability, load transient response, thermal behavior, and feedback network design for multi-rail PMU integration in space-constrained applications.

Technical Context

The LM26484SQEV implements a dual-buck + LDO controller architecture using external NMOS FETs (e.g., SI1450DH) and discrete passive components. Each buck stage operates in synchronous rectification mode with independent enable (ENSW1/ENSW2) and feedback (FB1/FB2) pins, while the LDO controller drives an external NMOS gate (LDOGATE) with dedicated feedback (LDOFB) and enable (ENLDO).

Power sequencing is supported via active-low nPOR output and separate analog/digital ground planes (AGND, PGND_SW1, PGND_SW2). The board uses WQFN-24 footprint matching the LM26484 IC package (5 × 4 × 0.8 mm), with DAP thermal pad connected to GND for dissipation.

Key Specifications

Availability

LM26484SQEV is available at Aetrix Electronics and suitable for embedded power validation, PMU reference design verification, and multi-rail DC-DC/LDO co-simulation requiring stable component supply and documented thermal performance.

Supply support for LM26484SQEV includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company specializing in analog, embedded processing, and power management technologies, with over 90 years of innovation in high-reliability electronic systems.

The LM26484 product line delivers highly integrated, externally configurable power management units for space-constrained portable and industrial applications requiring precise multi-rail regulation and sequencing control.

FAQ

What is the primary function of the LM26484SQEV evaluation board?

The LM26484SQEV evaluation board demonstrates and validates the operation of the LM26484 power management IC, enabling engineers to test two 2.0A step-down DC-DC converters and one LDO controller under real-world conditions. It provides pre-populated circuitry, jumper-selectable configurations, and documented feedback networks to accelerate development of multi-rail power subsystems using the LM26484.

Does the LM26484SQEV include the LM26484 IC?

Yes, the LM26484SQEV includes one LM26484 IC mounted in a 24-pin WQFN package (5 × 4 × 0.8 mm) with thermal DAP pad soldered to the board. The IC is fully functional and pre-wired to supporting passives, MOSFETs (SI1450DH), and feedback networks as specified in TI's AN-1858 application note.

How are output voltages configured on the LM26484SQEV?

Output voltages on the LM26484SQEV are set via external resistor dividers: Buck1 uses R1/R2, Buck2 uses R3/R4, and the LDO uses R5/R6 - values selected from TI's Table 2 and Table 3 in SNVA350B. Jumper JP12, JP10, and JP11 allow optional reconfiguration; cleaning flux residue from FB nodes is critical for accuracy.

What power supply requirements does the LM26484SQEV need?

The LM26484SQEV requires a single common DC input (2.7V–5.5V) applied across VIN1, VIN2, and AVIN via jumpers JP1, JP2, and JP4. Input must be current-limited to ≥3A to support both 2.0A buck stages simultaneously. AVDD and AGND connections are mandatory for analog circuit stability per LM26484SQEV schematic.

Can the LM26484SQEV be used for thermal testing?

Yes, the LM26484SQEV supports thermal evaluation through its exposed DAP pad (connected to GND), multi-layer PCB stack-up (including dedicated ground and VDD_M planes), and documented thermal layout (Figures 4–8 in SNVA350B). Board-level IR imaging and junction temperature estimation are feasible when paired with the LM26484's internal thermal overload protection feature.