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Texas Instruments LM2650M-ADJ
- Part No.:
- LM2650M-ADJ
- Manufacturer:
- Texas Instruments
- Package:
- 24-SOIC (0.295", 7.50mm Width)
- Datasheet:
-
LM2650M-ADJ.pdf
- Description:
- IC REG BUCK ADJ 3A 24SOIC
- Quantity:
- Payment:
- Shipping:
Inventory:4,602
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Product details
Overview
LM2650M-ADJ from Texas Instruments is a synchronous step-down DC/DC converter IC designed for high-efficiency power conversion in battery-powered systems. It delivers up to 3A output current, supports adjustable output voltage from 1.5V to 16V, operates across 4.5V–18V input range, and achieves ≥94% efficiency at 1A load - making it ideal for GPS devices, portable instruments, and notebook computers.
For engineers reviewing the LM2650M-ADJ datasheet, LM2650M-ADJ pinout, LM2650M-ADJ application, or LM2650M-ADJ equivalent, this page provides verified technical context, validated pin functions, confirmed efficiency curves, exact thermal shutdown behavior (170°C), and real-world soft-start and sleep-mode configuration details critical for low-power system design.
Technical Context
The LM2650M-ADJ implements dual-mode regulation: fixed-frequency PWM (nominal 90 kHz, adjustable up to 300 kHz) for medium-to-heavy loads and automatic hysteretic "sleep" mode for light loads, with programmable sleep-in/sleep-out thresholds via external resistors on SIA and SOA pins. Its synchronous NMOS power stage features RDS(on) of 130 mΩ (HS) and 125 mΩ (LS) at 25°C, enabling >90% efficiency from 0.2A to 2A.
It integrates an internal 4V regulator (VDD), bootstrap gate driver (BOOT), logic-controlled shutdown (SD), and sleep override (SLEEP LOGIC). The feedback loop uses a 1.25V reference (VREF) with ±2% tolerance over temperature, and compensation is implemented externally via COMP and EA OUT pins using RC/CC networks per TI's recommended Type II design.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | 4.5V to 18V - supports 3–4-cell Li-ion, 6-cell lead-acid, and 8–12-cell NiMH battery stacks without external pre-regulation. |
| Output Voltage Range | 1.5V to 16V - set by external resistor divider on FB pin; enables single IC to serve multiple rail requirements (e.g., 3.3V, 5V, 12V). |
| Max Output Current | 3A continuous - limited by internal current sense and thermal shutdown; validated at 3A with ≥89% efficiency at 25°C. |
| Efficiency @ 1A | ≥94% - measured at VIN = 15V, VOUT = 5V, FOSC = 90 kHz; confirms suitability for run-mode battery life optimization. |
| Quiescent Current (Sleep) | 850 μA typical - enables multi-day standby in portable instrumentation without compromising wake-up responsiveness. |
| Shutdown Current | 9 μA max - ensures negligible battery drain during full system off-state; verified at VSD = 3V. |
| Thermal Shutdown | 170°C junction - active protection with hysteresis prevents latch-up; allows safe operation under transient overload or poor heatsinking. |
Pinout & Package
LM2650M-ADJ is housed in a 24-lead SOIC package (DW0024B), with exposed substrate pins (1, 12) requiring connection to a large copper ground plane for optimal thermal performance.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 12 (SUB) | Die substrate contact | Must be grounded to same large copper plane as PGND for thermal conduction and EMI reduction. |
| 2 (SLEEP LOGIC) | Sleep mode control input | Low = forced PWM; high = forced sleep; open = automatic transition between modes based on load. |
| 3, 4, 9, 10 (PGND) | Power ground return | Carries high di/dt switching currents; requires direct low-inductance connection to power-stage ground plane. |
| 5, 8 (SW) | Switch node | Connects to inductor and catch diode (or low-side FET); must use short, wide traces to minimize EMI and ringing. |
| 6, 7 (PVIN) | Power input supply | Bypassed individually to PGND with 0.1 μF low-ESR/ESL capacitor; feeds high-side gate driver and power FETs. |
| 11 (BOOT) | High-side gate driver supply | Connected via 0.1 μF capacitor to SW; bootstraps ~9V above PVIN to ensure full enhancement of HS NMOS. |
| 13 (FB) | Feedback input | Monitors output voltage via resistor divider; referenced to 1.25V internal bandgap; sets output accuracy and stability. |
| 14 (VDD) | Internal signal rail | 4V regulated output powering control circuitry; bypassed to GND with 0.2 μF capacitor for noise immunity. |
| 15 (COMP) | Error amplifier inverting input | Used for external compensation network (RC/CC) to stabilize control loop across line/load transients. |
| 16 (EA OUT) | Error amplifier output | Drives modulator; connects to COMP through RC/CC network to implement Type II compensation. |
| 17 (SS) | Soft-start timing node | Capacitor to GND sets ramp time; limits inrush current and enables controlled power-up sequencing. |
| 18 (GND) | Signal ground | Reference for all analog and logic circuitry; separate from PGND but tied at single point for noise isolation. |
| 19 (VIN) | Input to internal 4V regulator | Bypassed to GND with 0.1 μF capacitor; supplies bias to error amp, oscillator, and logic blocks. |
| 20 (FREQ ADJ) | Oscillator frequency adjust | Resistor to GND scales switching frequency from 90 kHz up to 300 kHz; higher frequency reduces inductor size. |
| 21 (SYNC) | External clock synchronization | Accepts TTL/CMOS clock signal to align switching with system clocks; grounded when unused. |
| 22 (SD) | Shutdown control | Pull low to enable; pull high (>2.1V) to enter shutdown drawing ≤25 μA total quiescent current. |
| 23 (SOA) | Sleep-out threshold adjust | Resistor to GND programs load current level at which device exits sleep mode into PWM operation. |
| 24 (SIA) | Sleep-in threshold adjust | Resistor to GND programs load current level at which device enters sleep mode from PWM operation. |
Key Features
| Feature | Design Value |
|---|---|
| Synchronous NMOS power stage | Eliminates external Schottky diode, reducing conduction losses and improving efficiency by 5–10% vs. asynchronous designs. |
| Programmable sleep mode thresholds | Enables precise trade-off between light-load efficiency and transient response via SIA/SOA resistors - no firmware required. |
| Logic-controlled micropower shutdown | Reduces total input current to ≤9 μA, preserving battery charge during extended storage or system suspend states. |
| Adjustable soft-start (SS pin) | Prevents input inrush and output overshoot; capacitor value directly sets startup time (e.g., 100 nF ≈ 1 ms). |
| Integrated bootstrap gate driver | Enables high-side NMOS operation without external charge pump; maintains VGS > 8V across full input range. |
Applications
| GPS Receivers | Portable Data Terminals |
|---|---|
Use Scenario: Powering RF front-end, baseband processor, and memory in handheld GPS units operating from 3.7V Li-ion cells. IC Role / Device Role / Timing Role: Primary 3.3V/5V step-down regulator delivering stable 3A peak current during satellite acquisition bursts. Use Value: Sleep mode maintains 850 μA quiescent draw during idle tracking, extending battery life to >20 hours on single charge. |
Use Scenario: Supplying 5V to barcode scanner engine, display backlight, and microcontroller in ruggedized field terminals. IC Role / Device Role / Timing Role: Main DC/DC converter supporting dynamic load steps from 10mA (idle) to 2.5A (scan burst) with <100 μs recovery. Use Value: Automatic PWM-to-sleep transition avoids manual mode switching; 94% efficiency at 1A sustains runtime during continuous scanning. |
| Notebook Subsystem Rails | Battery-Powered Test Instruments |
Use Scenario: Generating 12V for display backlight and 3.3V for I/O controllers in ultra-thin notebooks with shared battery bus. IC Role / Device Role / Timing Role: Adjustable-output buck converter configured for dual-rail generation using FB divider reconfiguration. Use Value: Wide 4.5–18V input range accommodates battery voltage sag and adapter input; 300 kHz max frequency enables compact 20 μH inductors. |
Use Scenario: Providing precision 5V rail for ADC reference and analog front-end in handheld multimeters and oscilloscopes. IC Role / Device Role / Timing Role: Low-noise, high-PSRR power source with soft-start preventing measurement offset during power-on. Use Value: Internal 4V VDD rail isolates analog circuitry from switching noise; 1.25V reference tolerance (±2%) ensures <0.1% output drift. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous step-down converter applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LM2678-5.0/NOPB | Fixed 5V output; no adjustable FB; 5A rating; 260 kHz fixed frequency; no sleep mode. | Better suited for high-current, fixed-voltage industrial supplies where efficiency at light load is secondary. | Select when output voltage is fixed and peak current exceeds 3A; avoid if adjustable output or battery standby efficiency is required. |
| TPS5430DDAR | 3A, 5.5–36V input; adjustable output; integrated MOSFETs; 500 kHz max frequency; no programmable sleep thresholds. | Higher input voltage support and faster switching enable smaller magnetics; lacks dedicated sleep-in/sleep-out adjustment. | Choose for wider VIN range or higher frequency operation; use only if external sleep control via EN pin suffices for light-load optimization. |
Compared with LM2650M-ADJ, LM2678-5.0 offers higher current and simpler layout but sacrifices output flexibility and light-load efficiency; TPS5430DDAR extends input range and frequency capability but requires external circuitry to replicate LM2650M-ADJ's precise sleep threshold programming.
Availability
LM2650M-ADJ is available at Aetrix Electronics and suitable for GPS receivers, portable data terminals, and notebook subsystem rails requiring stable component supply, long-term manufacturability, and RoHS-compliant packaging.
Supply support for LM2650M-ADJ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and power management technologies, with decades of expertise in high-efficiency DC/DC conversion.
The LM2650M-ADJ belongs to TI's legacy high-current synchronous buck converter family, engineered specifically for battery-powered portable electronics demanding both high full-load efficiency and ultra-low quiescent current in standby.
FAQ
What is the maximum output current supported by the LM2650M-ADJ?
The LM2650M-ADJ supports up to 3A continuous output current, validated under thermal and electrical conditions per the TI SNVS133C datasheet. This rating assumes proper PCB layout with adequate copper area for PGND/SUB pins and ambient temperature ≤40°C. At 3A, efficiency remains ≥89% with 15V input and 5V output, and thermal shutdown activates at 170°C junction temperature to prevent damage.
How do I configure the LM2650M-ADJ for a 3.3V output?
To configure the LM2650M-ADJ for 3.3V output, use a resistor divider on the FB pin with R1 = 41.2 kΩ and R2 = 24.9 kΩ (1% tolerance), per Table 1 in the SNVS133C datasheet. This sets VOUT = 1.25V × (1 + R1/R2) ≈ 3.3V. Ensure the divider draws 100–200 μA to minimize noise sensitivity while maintaining accuracy within ±2% over temperature.
Does the LM2650M-ADJ require external MOSFETs?
No, the LM2650M-ADJ does not require external MOSFETs. It integrates synchronous NMOS high-side and low-side power switches with RDS(on) of 130 mΩ and 125 mΩ respectively. These internal FETs eliminate the need for an external Schottky diode and simplify design, enabling efficiencies >94% at 1A without additional active components.
What is the purpose of the SIA and SOA pins on the LM2650M-ADJ?
The SIA (pin 24) and SOA (pin 23) pins on the LM2650M-ADJ allow independent programming of the sleep-in and sleep-out load current thresholds. Connecting resistors from each pin to GND sets the exact current levels at which the IC transitions between PWM and sleep modes - enabling precise optimization of light-load efficiency without sacrificing transient response.
Can the LM2650M-ADJ synchronize its switching frequency to an external clock?
Yes, the LM2650M-ADJ supports external frequency synchronization via the SYNC pin (pin 21). Applying a TTL- or CMOS-compatible clock signal to this pin locks the internal oscillator to the external source, allowing noise-sensitive systems (e.g., RF receivers or precision ADCs) to avoid beat frequencies. When unused, SYNC must be grounded to ensure stable internal operation at the nominal 90 kHz or adjusted frequency.
LM2650M-ADJ Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- 24-SOIC (0.295", 7.50mm Width)
- Packaging:
- Tube
- Product Status:
- Obsolete
- Function:
- Step-Down
- Output Configuration:
- Positive
- Topology:
- Buck
- Output Type:
- Adjustable
- Number of Outputs:
- 1
- Voltage - Input (Min):
- 4.5V
- Voltage - Input (Max):
- 18V
- Voltage - Output (Min/Fixed):
- 1.5V
- Voltage - Output (Max):
- 16V
- Current - Output:
- 3A
- Frequency - Switching:
- 90kHz
- Synchronous Rectifier:
- Yes
- Operating Temperature:
- -40°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-SOIC
LM2650M-ADJ FAQ
1.How can I place an order for LM2650M-ADJ through Aetrix?
Please submit a Request for Quotation (RFQ) for LM2650M-ADJ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LM2650M-ADJ reliable?
The price and inventory of LM2650M-ADJ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LM2650M-ADJ is usually 5 days.
3.What payment methods are accepted for LM2650M-ADJ?
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4.How is shipping managed for LM2650M-ADJ?
LM2650M-ADJ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LM2650M-ADJ order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LM2650M-ADJ?
For technical support, including LM2650M-ADJ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LM2650M-ADJ requirements.
6.How does Aetrix verify that LM2650M-ADJ is sourced from the original manufacturer or authorized distributors?
All LM2650M-ADJ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LM2650M-ADJ meets industry standards.
7.What is the process for return or replacement of LM2650M-ADJ?
All LM2650M-ADJ units undergo pre-shipment inspection (PSI). If there is an issue with LM2650M-ADJ, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LM2650M-ADJ part is unused and in its original packaging.
Return procedure for LM2650M-ADJ:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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