Texas Instruments LM2750LDX-5.0

Overview

LM2750LDX-5.0 from Texas Instruments is a fixed 5.0V ±4% switched-capacitor boost regulator in a 10-pin WSON (3mm × 3mm) package, delivering up to 120mA output current at VIN ≥2.9V and 40mA down to VIN = 2.7V, with 1.7MHz fixed switching frequency and <4mV_p-p output ripple at 100mA - used for low-noise Li-ion-to-5V conversion in space-constrained portable electronics.

For engineers reviewing the LM2750LDX-5.0 datasheet, LM2750LDX-5.0 pinout, LM2750LDX-5.0 application, or LM2750LDX-5.0 equivalent, key selection considerations include input voltage range (2.7V–5.6V), shutdown current (<2µA), thermal shutdown at 150°C, pre-regulation architecture minimizing VIN ripple, and strict capacitor requirements (CIN/COUT = 2.2µF, CFLY = 1µF).

Technical Context

The LM2750LDX-5.0 implements a two-phase non-overlapping switched-capacitor doubler with integrated linear pre-regulation: during φ1, CFLY charges to VIN; during φ2, it stacks atop VIN to generate ~2×VIN, then pre-regulation modulates switch resistance to hold VOUT at 5.0V ±4%. This architecture eliminates inductors and achieves 85% peak efficiency.

It features internal soft-start (500µs typical turn-on time), overcurrent limiting (300mA typ.), thermal shutdown (engage at TJ = 150°C, release at 130°C), and active-low shutdown with 200kΩ internal pull-down. Grounding uses five terminals (pins 3, 5, 6, and DAP) for low-impedance thermal and noise performance.

Key Specifications

Pinout & Package

LM2750LDX-5.0 is housed in a 10-pin WSON (3mm × 3mm, Package Code NGY0010A/DSC0010A) with exposed die-attach pad (DAP) for thermal and electrical grounding. Pin 3 is GND (not FB) for the -5.0 variant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar switched-capacitor boost regulator applications.

Compared with TPS60403DBVR and MAX682ESA+, the LM2750LDX-5.0 provides 100% higher output current than the former and superior 5V accuracy and ripple performance versus the latter - making it optimal for noise-sensitive, medium-current portable power rails requiring minimal external components.

Availability

LM2750LDX-5.0 is available at Aetrix Electronics and suitable for white LED backlighting, cellular phone SIM card power, audio amplifier bias supplies, and general-purpose Li-ion-to-5V conversion requiring stable component supply across production lifecycles.

Supply support for LM2750LDX-5.0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and power management technologies, with decades of expertise in high-efficiency DC/DC conversion and precision power solutions.

The LM2750LDX-5.0 belongs to TI's switched-capacitor regulator product line, engineered specifically for space-constrained, battery-powered applications demanding inductorless 5V generation with ultra-low noise and minimal external components.

FAQ

What is the minimum input voltage required for LM2750LDX-5.0 to deliver its full 120mA output current?

The LM2750LDX-5.0 delivers up to 120mA output current only when the input voltage is 2.9V or higher. Below 2.9V - down to the absolute minimum of 2.7V - the device is rated for up to 40mA output current. This stepped current capability aligns with Li-ion battery discharge characteristics, ensuring usable power across the full battery range while maintaining regulation integrity. Operating the LM2750LDX-5.0 at 2.7V–2.9V with >40mA load risks output droop or thermal shutdown.

Can LM2750LDX-5.0 operate without the flying capacitor (CFLY)?

No - the LM2750LDX-5.0 cannot operate without the 1µF flying capacitor (CFLY). It is fundamental to the switched-capacitor doubler architecture: CFLY stores and transfers charge between VIN and VOUT during alternating clock phases (φ1 and φ2). Omitting CFLY disables voltage doubling and regulation entirely. TI specifies CFLY = 1µF (e.g., TDK C1608X5R1A105K), and deviation below 1µF increases output resistance and ripple, risking instability or out-of-regulation behavior under load.

What is the purpose of the die-attach pad (DAP) on LM2750LDX-5.0, and how must it be connected?

The die-attach pad (DAP) on LM2750LDX-5.0 serves dual thermal and electrical functions: it conducts heat from the silicon die to the PCB and provides a low-impedance ground return path. It must be soldered directly to a solid copper ground plane using multiple thermal vias - not left floating or insulated. TI requires DAP connection to GND (same net as pins 3, 5, and 6) for safe operation; failure to do so causes excessive junction temperature rise, premature thermal shutdown, and potential reliability degradation. The DAP accounts for ~50% of total thermal dissipation.

How does the pre-regulation feature of LM2750LDX-5.0 reduce input noise compared to standard charge pumps?

The LM2750LDX-5.0 applies regulation *before* voltage doubling - modulating the on-resistance of input-connected switches during the charge phase (φ1) to control energy transfer into CFLY. This pre-regulation eliminates the large, discontinuous input current spikes typical of open-loop charge pumps, reducing VIN ripple to negligible levels. As a result, the LM2750LDX-5.0 keeps the battery line virtually noise-free - critical when sharing VIN with RF transceivers or precision ADCs - whereas conventional charge pumps require bulky input filtering to achieve comparable noise suppression.

Is LM2750LDX-5.0 compatible with tantalum or electrolytic output capacitors?

No - LM2750LDX-5.0 is not compatible with tantalum or aluminum electrolytic output capacitors. Its design relies on low-ESR ceramic capacitors (e.g., X7R/X5R MLCCs like TDK C2012X7R1A225K) to maintain stability, low ripple, and efficiency. Tantalum and electrolytic capacitors exhibit high ESR (often >100mΩ), which increases output ripple, degrades transient response, and can cause oscillation or thermal overstress. TI explicitly recommends against them and specifies COUT = 2.2µF ceramic only - substituting non-ceramic types voids performance guarantees and risks functional failure.