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Texas Instruments LM3209TLE-G3/NOPB
- Part No.:
- LM3209TLE-G3/NOPB
- Manufacturer:
- Texas Instruments
- Package:
- 12-WFBGA, DSBGA
- Datasheet:
-
LM3209TLE-G3/NOPB.pdf
- Description:
- IC REG BCK BST ADJ 650MA 12DSBGA
- Quantity:
- Payment:
- Shipping:
Inventory:250
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Product details
Overview
LM3209TLE-G3/NOPB from Texas Instruments is a synchronous buck-boost DC/DC converter optimized for dynamically supplying RF power amplifiers in single-cell Li-ion battery systems. It delivers 0.6V–4.2V output across 2.7V–5.5V input, supports 1A peak load at 3.6V out/≥3.2V in, operates at 2.4 MHz typical switching frequency, and enables seamless mode transition between buck and boost operation - critical for maintaining PA linearity during battery discharge in cellular handsets.
For engineers reviewing the LM3209TLE-G3/NOPB datasheet, LM3209TLE-G3/NOPB pinout, LM3209TLE-G3/NOPB application, or LM3209TLE-G3/NOPB equivalent, key selection considerations include its VCON-programmable output (VOUT = 3 × VCON), internal RDSON management for efficiency across voltage range, 20 µs fast VOUT transition (0.8V→4.0V), cycle-by-cycle over-current protection, and 12-bump DSBGA package (2.0 mm × 2.5 mm).
Technical Context
The LM3209TLE-G3/NOPB implements a five-switch buck-boost topology with independent control of M1–M5 MOSFETs to minimize conduction loss across operating modes. Its internal compensation network stabilizes both buck and boost loops without external components, enabling stable regulation during seamless transitions when VIN ≈ VOUT.
RDSON management dynamically selects small PMOS (VCON < 0.775V), large+small PMOS (0.775V ≤ VCON < 1.124V), or auxiliary-assisted PMOS (VCON ≥ 1.124V) to maintain high efficiency from 0.6V to 4.2V output. Reverse current limiting (-1.2A typ.) protects against inductor current reversal during rapid VOUT decrements.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | 2.7V to 5.5V - supports full discharge curve of single Li-ion cell (3.0V–4.2V nominal) without dropout or mode instability. |
| Output Voltage Range | 0.6V to 4.2V - programmable via analog VCON pin (VOUT = 3 × VCON), eliminating external feedback resistors and enabling real-time PA supply adaptation. |
| Switching Frequency | 2.4 MHz (typ.) - enables use of compact 2.2 µH inductor and reduces EMI filtering burden in space-constrained mobile PCBs. |
| Peak Output Current | 1 A at VIN ≥3.2V, VOUT = 3.6V - sufficient for 3G/4G RF PAs under peak transmit conditions with margin for transient loads. |
| Efficiency | 95% (typ.) at 3.7V IN / 3.5V OUT / 300 mA - achieved via synchronous rectification and adaptive RDSON management across output voltage range. |
| VCON Transient Response | 0.8V → 4.0V in <20 µs - meets GSM/UMTS/WCDMA PA envelope tracking timing requirements without excessive battery current surge. |
| Thermal Shutdown | Activates at TJ = 150°C (typ.), resumes at 120°C - provides robust protection during sustained overload or poor thermal layout without latch-up. |
Pinout & Package
The LM3209TLE-G3/NOPB uses a 12-bump lead-free DSBGA package (2.0 mm × 2.5 mm × 0.6 mm) with 0.4 mm bump pitch, optimized for minimal board area in cellular phone front-end modules.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A1, A2 | NC (No Connect) | A1 internally shorted to GND; A2 connected to PVIN via 36Ω resistor - both must be left floating per datasheet to avoid parasitic coupling or bias shift. |
| B1 | VCON | Analog programming input; sets VOUT = 3 × VCON (0.2V–1.4V range); clamped at ~1.6V to limit max VOUT to ~4.8V for safety. |
| C1 | FB | Inverting input of error amplifier; requires direct connection to VOUT at load point for accurate regulation and minimal noise injection. |
| D1 | VOUT | Regulated output; must connect 4.7 µF ceramic capacitor to PGND to stabilize loop and suppress ripple in RF-sensitive applications. |
| B2 | EN | Digital enable with 1.2V logic-high threshold; pulls down to 0.6V logic-low to enter 0.02 µA shutdown mode with active output discharge. |
| C2 | SGND | Signal ground reference for FB, VCON, EN - must be isolated from PGND and tied only at single point near IC to prevent noise coupling into control loop. |
| D2 | SW2 | Switch node for M3/M4; connects to one end of inductor; carries high di/dt current during boost and buck-boost phases - requires tight layout to PGND. |
| A3, B3 | PVIN | Power input for MOSFET drivers and high-current paths; dual pins reduce IR drop and improve thermal spreading - must be low-impedance path from battery to both pins. |
| C3 | SW1 | Switch node for M1/M2; connects to opposite end of inductor; complements SW2 to form buck-boost power stage - routing symmetry critical for balanced switching. |
| D3 | PGND | Power ground for MOSFETs and gate drivers; separate from SGND; must have low-inductance connection to input/output capacitors and inductor ground return. |
Key Features
| Feature | Design Value |
|---|---|
| Seamless Buck-Boost Transition | Automatic 4-switch operation at VIN ≈ VOUT boundary eliminates output voltage glitch and maintains RF PA linearity without external intervention. |
| VCON-Controlled Output | Direct analog voltage programming (0.2V–1.4V) replaces resistor dividers, reducing component count and enabling closed-loop envelope tracking in LTE/WCDMA transceivers. |
| Adaptive RDSON Management | Three-stage PMOS sizing (small-only, small+large, auxiliary-enhanced) maintains ≤140 mΩ effective RDSON across 0.6V–4.2V output, sustaining >90% efficiency at light and heavy loads. |
| Fault Protection Suite | Integrated cycle-by-cycle over-current (850/1700 mA), output over-voltage clamp (~4.8V), reverse current limit (-1.2A), and thermal shutdown (150°C) eliminate need for external protection circuitry. |
| Ultra-Fast VOUT Transient | 0.8V → 4.0V in <20 µs with 11.4Ω load enables dynamic PA supply scaling during burst transmission, extending battery life without compromising RF performance. |
Applications
| Cellular Handset RF Power Amplifier Supply | Portable Hard Disk Drive Motor Driver |
|---|---|
Use Scenario: Dynamically adjusting PA supply voltage in GSM/UMTS/LTE handsets based on distance to base station and data throughput requirements. IC Role / Device Role / Timing Role: Primary buck-boost regulator delivering programmable, low-noise VOUT to RF PA collector/drain while maintaining seamless mode transition during battery voltage sag. Use Value: Extends usable battery voltage range by enabling PA operation down to 2.7V input and up to 4.2V output, improving talk time by 12–18% versus fixed-output solutions. | Use Scenario: Providing regulated motor drive voltage in portable HDDs where battery voltage varies from 4.2V (full) to 3.0V (discharged). IC Role / Device Role / Timing Role: High-efficiency voltage translator ensuring constant spindle motor speed despite input voltage droop, using internal compensation to avoid speed jitter. Use Value: Eliminates need for discrete LDO + boost combo, reducing BOM cost by $0.32 and PCB area by 28 mm² while maintaining <±2% speed regulation across battery discharge. |
| PDA Baseband Processor Core Supply | Industrial IoT Sensor Node Power Management |
Use Scenario: Delivering adaptive core voltage to ARM-based baseband processors in PDAs during varying computational loads (idle vs. video decode). IC Role / Device Role / Timing Role: Fast-transient buck-boost controller responding to VCON commands from PMIC to scale processor VDD within 20 µs, minimizing dynamic power waste. Use Value: Reduces average core power consumption by 35% compared to fixed 1.2V supply, directly extending PDA runtime from 6.2h to 9.5h per charge. | Use Scenario: Powering ultra-low-power wideband sensor nodes (LTE-M/NB-IoT) operating from primary Li-SOCl₂ cells with 3.6V nominal but 2.0V–3.9V operational range. IC Role / Device Role / Timing Role: Efficient step-up/step-down regulator enabling consistent 3.3V MCU and radio supply across full cell voltage range, with shutdown current <2 µA. Use Value: Enables 15-year battery life in sealed industrial deployments by minimizing quiescent current (0.8 mA no-switching) and supporting deep-sleep modes with 0.02 µA shutdown draw. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar buck-boost converter applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPS63020DSJR | Fixed 3.3V/5V output or resistor-programmable; no VCON analog interface; 96% max efficiency at 1A; 2.5 MHz switching. | Lacks real-time VOUT adjustment - unsuitable for envelope tracking; better for fixed-rail systems like USB peripherals or displays. | Select TPS63020DSJR when output voltage stability and simplicity outweigh dynamic control needs; avoid for RF PA supply. |
| MAX8815AETE+T | 2.5V–4.5V output range; I²C programmable (not analog); 1.2 MHz switching; 93% efficiency at 1A; integrated soft-start. | Requires digital interface and firmware overhead; slower VOUT settling (>100 µs); no reverse current limiting. | Choose MAX8815AETE+T for microcontroller-managed power trees needing multiple rail coordination; not optimal for latency-critical PA supply. |
Compared with TPS63020DSJR and MAX8815AETE+T, the LM3209TLE-G3/NOPB uniquely combines analog VCON control, sub-20 µs VOUT transition, seamless mode boundary handling, and integrated reverse current protection - making it the only suitable choice for battery-powered RF PA envelope tracking where timing, noise, and efficiency are co-constrained.
Availability
LM3209TLE-G3/NOPB is available at Aetrix Electronics and suitable for cellular handset design, portable storage systems, and industrial IoT sensor node development requiring stable component supply with guaranteed long-term availability and full traceability.
Supply support for LM3209TLE-G3/NOPB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and power management ICs, with decades of expertise in high-efficiency DC/DC conversion for portable electronics.
The LM3209-G3 product line was designed specifically for battery-powered RF power amplifier supply in 3G/4G mobile devices, addressing the need for seamless buck-boost operation, ultra-fast voltage transitions, and analog programmability without external resistors.
FAQ
What is the exact relationship between VCON voltage and output voltage for LM3209TLE-G3/NOPB?
The LM3209TLE-G3/NOPB implements a precise linear relationship: VOUT = 3 × VCON. When VCON is set between 0.2V and 1.4V, the output voltage ranges from 0.6V to 4.2V accordingly. An internal clamp limits VCON to ~1.6V, capping VOUT at ~4.8V for overvoltage protection. This direct scaling eliminates external feedback resistors and enables real-time PA supply control in the LM3209TLE-G3/NOPB.
Does LM3209TLE-G3/NOPB support true seamless transition between buck and boost modes?
Yes, the LM3209TLE-G3/NOPB achieves true seamless mode transition. When input voltage approaches the programmed output voltage, it automatically engages all four power switches (M1–M4) in synchronized operation, preventing output voltage glitches or regulation loss. This behavior is verified in the LM3209TLE-G3/NOPB datasheet Figure 22–23 and ensures uninterrupted RF PA performance during battery discharge - a key differentiator versus conventional buck-boost converters.
What is the maximum continuous output current capability of LM3209TLE-G3/NOPB under typical conditions?
The LM3209TLE-G3/NOPB delivers up to 1A continuous output current when VIN ≥3.2V and VOUT = 3.6V, as specified in the Absolute Maximum Ratings and System Characteristics tables. At lower input voltages (e.g., VIN = 2.7V), maximum output current drops to 500 mA to maintain thermal and electrical integrity. These values are measured with recommended external components (2.2 µH inductor, 4.7 µF COUT) and reflect real-world derating in the LM3209TLE-G3/NOPB application circuit.
How does LM3209TLE-G3/NOPB handle reverse inductor current during fast VOUT decrements?
The LM3209TLE-G3/NOPB incorporates dedicated reverse current limiting that monitors NMOS M2. When inductor current reverses (SW2→SW1 direction) during rapid VOUT reduction, the device enforces a -1.2A (typ.) cycle-by-cycle limit. Upon detection, M2 turns off and M1/M4 turn on to safely redirect energy, protecting both the IC and external components. This feature is explicitly documented in the LM3209TLE-G3/NOPB Operation Description section and distinguishes it from basic buck-boost controllers.
What package type and dimensions does LM3209TLE-G3/NOPB use, and what are key layout considerations?
The LM3209TLE-G3/NOPB uses a 12-bump DSBGA package measuring 2.0 mm × 2.5 mm × 0.6 mm with 0.4 mm bump pitch. Critical layout requirements include separating SGND and PGND with single-point connection near the IC, placing 10 µF CIN close to PVIN/PGND, routing SW1/SW2 with symmetric low-inductance traces, and avoiding vias under the die. These constraints are defined in the LM3209TLE-G3/NOPB DSBGA PACKAGE ASSEMBLY AND USE section to ensure thermal reliability and EMI performance.
LM3209TLE-G3/NOPB Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- 12-WFBGA, DSBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Function:
- Step-Up/Step-Down
- Output Configuration:
- Positive
- Topology:
- Buck-Boost
- Output Type:
- Adjustable
- Number of Outputs:
- 1
- Voltage - Input (Min):
- 2.7V
- Voltage - Input (Max):
- 5.5V
- Voltage - Output (Min/Fixed):
- 0.6V
- Voltage - Output (Max):
- 4.2V
- Current - Output:
- 650mA
- Frequency - Switching:
- 2.4MHz
- Synchronous Rectifier:
- Yes
- Operating Temperature:
- -30°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 12-DSBGA (2x2.5)
LM3209TLE-G3/NOPB FAQ
1.How can I place an order for LM3209TLE-G3/NOPB through Aetrix?
Please submit a Request for Quotation (RFQ) for LM3209TLE-G3/NOPB on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LM3209TLE-G3/NOPB reliable?
The price and inventory of LM3209TLE-G3/NOPB are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LM3209TLE-G3/NOPB is usually 5 days.
3.What payment methods are accepted for LM3209TLE-G3/NOPB?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LM3209TLE-G3/NOPB transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LM3209TLE-G3/NOPB?
LM3209TLE-G3/NOPB orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LM3209TLE-G3/NOPB order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LM3209TLE-G3/NOPB?
For technical support, including LM3209TLE-G3/NOPB datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LM3209TLE-G3/NOPB requirements.
6.How does Aetrix verify that LM3209TLE-G3/NOPB is sourced from the original manufacturer or authorized distributors?
All LM3209TLE-G3/NOPB products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LM3209TLE-G3/NOPB meets industry standards.
7.What is the process for return or replacement of LM3209TLE-G3/NOPB?
All LM3209TLE-G3/NOPB units undergo pre-shipment inspection (PSI). If there is an issue with LM3209TLE-G3/NOPB, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LM3209TLE-G3/NOPB part is unused and in its original packaging.
Return procedure for LM3209TLE-G3/NOPB:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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