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Texas Instruments LM3263TME/NOPB

Part No.:
LM3263TME/NOPB
Manufacturer:
Texas Instruments
Category:
Special Purpose Regulators
Package:
16-WFBGA, DSBGA
Datasheet:
AetrixLM3263TME/NOPB.pdf
Description:
IC REG CONV RF PWR 1OUT 16DSBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:634

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Product details

Overview

LM3263TME/NOPB from Texas Instruments is a high-current step-down DC-DC converter optimized for powering multi-mode, multi-band RF power amplifiers (PAs) in mobile devices. It operates from a single Li-ion cell (2.7 V to 5.5 V), delivers up to 2.5 A load current in PWM mode, supports dynamically adjustable output voltage from 0.4 V to 3.6 V, and integrates MIPI® RFFE digital control interface for real-time PA voltage scaling in 2G/3G/4G systems.

For engineers reviewing the LM3263TME/NOPB datasheet, LM3263TME/NOPB pinout, LM3263TME/NOPB application, or LM3263TME/NOPB equivalent, key selection criteria include its ACB-assisted 2.5-A capability, 2.7-MHz switching frequency, MIPI RFFE programmability, thermal/overcurrent protection, and DSBGA-16 package suitability for space-constrained smartphone front-end designs.

Technical Context

The LM3263TME/NOPB implements a synchronous buck topology with integrated PFET/NFET switches and internal compensation. Its Active Current Assist and Analog Bypass (ACB) circuit provides a parallel current path to limit peak inductor current to 1.45 A while sustaining 2.5-A total output, enabling smaller magnetics without sacrificing regulation across battery and PA load transients.

It supports three operational modes: forced PWM (for 2G spectral purity), auto-PFM/PWM (for 3G/4G efficiency optimization), and analog bypass (for minimal dropout). Voltage programming occurs via an 8-bit VSET register over the MIPI RFFE interface, with feedback referenced to FB and regulated against a 0.4–3.6 V DAC output.

Key Specifications

ParameterValue and Actual Design Meaning
Input Voltage Range2.7 V to 5.5 V - supports full Li-ion battery discharge curve without external pre-regulation.
Output Voltage Range0.4 V to 3.6 V - digitally programmable in 15-mV LSB steps to match RF PA envelope requirements.
Max Load Current2.5 A - achievable using combined switcher + ACB path; enables direct drive of high-power LTE/WCDMA PAs.
Switching Frequency2.7 MHz (typical) - allows use of compact 1.5-µH inductors and reduces EMI filtering burden in RF-sensitive layouts.
Control InterfaceMIPI RFFE v1.0 - 2-wire serial bus (SCLK/SDATA) with USID support; enables dynamic VOUT updates during TX bursts.
Protection FeaturesThermal shutdown (150°C), current limiting (1.45 A steady-state PFET, 1.9 A transient), and ACB-enabled dropout mitigation.
EfficiencyUp to 95% at 3.4 V/550 mA - optimized for mid-to-high PA output power levels in forced PWM mode.

Pinout & Package

The LM3263TME/NOPB is housed in a 2.049 mm × 2.049 mm, 16-pin DSBGA (YFQ) package with bottom-side ball layout optimized for low-inductance ground return and thermal dissipation in thin-profile mobile PCBs.

Pin/TerminalCircuit RoleDesign Meaning
PVINPower inputHigh-side PFET switch supply rail; connects directly to battery or system VBAT (2.7–5.5 V).
SVDDAnalog powerSupplies internal analog circuitry including error amplifier and DAC; requires local 10-µF decoupling.
PACBACB powerProvides dedicated supply for ACB circuitry; must be tied to PVIN with low-impedance path.
VIOI/O reference & enable1.65–1.95 V logic reference and active-low enable; toggling below 0.45 V resets device.
SCLK / SDATARFFE interfaceMIPI RFFE clock and bidirectional data lines; require pull-up to VIO and operate at ≤26 MHz.
FBFeedback inputAnalog feedback node connected to output filter capacitor; sets regulated VOUT via internal 0.4–3.6 V DAC.
SWSwitching nodeConnection to internal PFET drain and NFET source; requires low-ESR ceramic output capacitor and careful routing.
ACB / PACBACB output & supplyACB pin delivers assist current to output; PACB supplies ACB circuit-both critical for >1.45 A operation.
PGND / BGND / SGNDGround terminalsPGND carries high-switching current; BGND ties ACB/digital grounds; SGND isolates analog signal ground.
GPO1General-purpose outputConfigurable open-drain output; used for USID reconfiguration or status signaling per RFFE protocol.

Key Features

FeatureDesign Value
MIPI RFFE v1.0 InterfaceEnables real-time, low-latency VOUT updates synchronized to RF transmit events without host CPU intervention.
Active Current Assist + Analog Bypass (ACB)Reduces required inductor size by limiting peak inductor current to 1.45 A while delivering 2.5 A total output current.
Auto-PFM/PWM Mode TransitionSeamlessly shifts between high-efficiency PFM (light loads) and low-ripple PWM (high-power TX) based on PA demand.
2.7-MHz Fixed-Frequency PWMMinimizes EMI interference in cellular bands and allows use of ultra-small 1.5-µH inductors and 0402 capacitors.
16-Ball DSBGA Package2.049 mm × 2.049 mm footprint enables integration into antenna module or PA front-end subassemblies with <9.1 mm² solution area.

Applications

Smartphone RF Front-EndMulti-Mode Cellular Modem

Use Scenario: Dynamically supplying voltage to LTE/WCDMA/EDGE power amplifiers during burst transmission.

IC Role / Device Role / Timing Role: Primary PA supply regulator with MIPI RFFE-controlled VOUT scaling synchronized to baseband TX commands.

Use Value: Enables envelope tracking-like efficiency without complex analog circuitry-reducing PA power loss by up to 30% vs fixed-VDD.

Use Scenario: Powering dual-band or tri-band RF transceivers requiring rapid VOUT changes between 2G, 3G, and 4G modes.

IC Role / Device Role / Timing Role: Digitally programmable buck converter acting as the master PA supply under RFFE bus arbitration.

Use Value: Eliminates need for multiple discrete LDOs or external DACs-reducing BOM count and PCB area by >40%.

Tablet Cellular ConnectivityHandheld Radio Transmitter

Use Scenario: Delivering stable, low-noise power to high-efficiency GaAs/GaN PAs in 7–10 inch tablets with limited thermal headroom.

IC Role / Device Role / Timing Role: High-current step-down regulator with integrated thermal protection and ACB-assisted transient response.

Use Value: Maintains PA linearity during sustained TX bursts while limiting junction temperature rise to <125°C ambient.

Use Scenario: Supporting narrowband FM/PM transmitters in portable radios requiring fast VOUT settling during channel switching.

IC Role / Device Role / Timing Role: Fast-settling DC-DC converter with <15 µs VOUT rise/fall time (1.4 V ↔ 3.4 V @ 6.8 Ω).

Use Value: Reduces TX ramp-up delay by >5× vs traditional buck converters-critical for time-division duplex (TDD) protocols.

Equivalent & Alternatives

The following parts are listed as comparable options for similar RF PA supply applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
LM3243TME/NOPBSame DSBGA-16 package and RFFE interface, but rated for 3-A continuous output and includes enhanced ACB with 1.8-A assist limit.Targeted at higher-power LTE-A and 5G NR PAs requiring >2.5 A sustained current.Select when PA peak current exceeds 2.5 A or when future-proofing for next-gen RF bands with higher power demands.
TPS62864DRLR4-A buck converter with I²C interface (not RFFE), 1.8-V to 5.5-V input, 0.6-V to 3.3-V output, no ACB circuitry.Used in non-RFFE systems (e.g., Wi-Fi 6E, Bluetooth LE audio) where MIPI compatibility is not required.Choose only if redesigning away from MIPI RFFE ecosystem; lacks ACB, so requires larger inductor and exhibits higher dropout at 2.5-A loads.

Compared with LM3263TME/NOPB, LM3243TME/NOPB extends current capability and thermal margin for advanced PAs, while TPS62864DRLR offers higher current and I²C flexibility at the cost of RFFE compliance and ACB-enhanced transient performance.

Availability

LM3263TME/NOPB is available at Aetrix Electronics and suitable for smartphone RF front-end modules, cellular modem subsystems, and handheld radio transmitter designs requiring stable component supply, long-term lifecycle support, and traceable sourcing for production programs.

Supply support for LM3263TME/NOPB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company specializing in analog, embedded processing, and power management ICs for industrial, automotive, and communications markets.

The LM3263TME/NOPB belongs to TI's RF power management product line, engineered specifically to replace discrete LDOs and external DACs in MIPI RFFE-compliant cellular front-ends with a single, highly integrated buck converter.

FAQ

What is the primary function of the LM3263TME/NOPB in a cellular RF system?

The LM3263TME/NOPB serves as a digitally programmable, high-current step-down DC-DC converter that supplies dynamically scaled voltage to RF power amplifiers in smartphones and tablets. It uses the MIPI RFFE interface to adjust output voltage from 0.4 V to 3.6 V in real time, optimizing PA efficiency across 2G, 3G, and 4G transmission modes. Its ACB feature ensures stable 2.5-A delivery without large inductors-making LM3263TME/NOPB essential for compact, thermally constrained front-end designs.

Does the LM3263TME/NOPB support both PWM and PFM operating modes?

Yes, the LM3263TME/NOPB supports forced PWM mode for 2G applications requiring low output ripple, auto-PFM/PWM mode for 3G/4G efficiency optimization, and analog bypass mode for minimal dropout. Mode selection is controlled via the SMPS_CFG register over the MIPI RFFE interface. In PWM mode, it operates at 2.7 MHz with tight ripple control; in PFM, it reduces switching frequency and quiescent current to maximize light-load efficiency-ensuring LM3263TME/NOPB adapts intelligently to varying PA power demands.

What is the role of the ACB (Active Current Assist and Analog Bypass) feature in the LM3263TME/NOPB?

The ACB feature in LM3263TME/NOPB provides a parallel current path that activates when load current exceeds ~1.45 A or during fast VOUT transients. It limits peak inductor current to maintain small magnetic size while delivering up to 2.5 A total output. ACB also enables faster output voltage settling (<15 µs for 1.4 V ↔ 3.4 V) and reduces dropout resistance to 45 mΩ in bypass mode. This makes LM3263TME/NOPB uniquely suited for multi-mode PAs where transient response, efficiency, and board space are simultaneously critical.

Which package type does the LM3263TME/NOPB use, and why is it suitable for mobile applications?

The LM3263TME/NOPB uses a 2.049 mm × 2.049 mm, 16-ball DSBGA (YFQ) package. Its ultra-compact footprint, low profile (<0.5 mm height), and bottom-terminal layout minimize parasitic inductance and improve thermal coupling to the PCB-critical for high-frequency, high-current RF power delivery in smartphones and tablets. The DSBGA construction allows dense placement near PA modules and supports automated assembly in high-volume mobile manufacturing, making LM3263TME/NOPB ideal for space- and thermal-constrained front-end designs.

How is output voltage programmed on the LM3263TME/NOPB, and what is its resolution?

Output voltage on the LM3263TME/NOPB is programmed via an 8-bit VSET_CTRL register (register 03h) communicated over the MIPI RFFE interface. This provides 256 discrete output levels from 0.4 V to 3.6 V, yielding a 15-mV LSB step size. The DAC output feeds the FB pin, enabling precise, software-controlled VOUT scaling synchronized to RF transmit events. Because the setting is digital and non-volatile per register write, LM3263TME/NOPB supports repeatable, glitch-free voltage transitions-essential for maintaining PA linearity and spectral mask compliance across modulation schemes.

LM3263TME/NOPB Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Series:
-
Package/Case:
16-WFBGA, DSBGA
Packaging:
Tape & Reel (TR)
Product Status:
Active
Applications:
Converter, RF Power Amplifier
Voltage - Input:
2.7V ~ 5.5V
Number of Outputs:
1
Voltage - Output:
0.4V ~ 3.6V
Operating Temperature:
-30°C ~ 90°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
16-DSBGA

LM3263TME/NOPB FAQ

1.How can I place an order for LM3263TME/NOPB through Aetrix?

Please submit a Request for Quotation (RFQ) for LM3263TME/NOPB on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for LM3263TME/NOPB reliable?

The price and inventory of LM3263TME/NOPB are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LM3263TME/NOPB is usually 5 days.

3.What payment methods are accepted for LM3263TME/NOPB?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LM3263TME/NOPB transactions.

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4.How is shipping managed for LM3263TME/NOPB?

LM3263TME/NOPB orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your LM3263TME/NOPB order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for LM3263TME/NOPB?

For technical support, including LM3263TME/NOPB datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LM3263TME/NOPB requirements.

6.How does Aetrix verify that LM3263TME/NOPB is sourced from the original manufacturer or authorized distributors?

All LM3263TME/NOPB products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LM3263TME/NOPB meets industry standards.

7.What is the process for return or replacement of LM3263TME/NOPB?

All LM3263TME/NOPB units undergo pre-shipment inspection (PSI). If there is an issue with LM3263TME/NOPB, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The LM3263TME/NOPB part is unused and in its original packaging.

Return procedure for LM3263TME/NOPB:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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