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Texas Instruments LM3263TMX/NOPB
- Part No.:
- LM3263TMX/NOPB
- Manufacturer:
- Texas Instruments
- Category:
- Special Purpose Regulators
- Package:
- 16-WFBGA, DSBGA
- Datasheet:
-
LM3263TMX/NOPB.pdf
- Description:
- IC REG CONV RF PWR 1OUT 16DSBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,412
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Product details
Overview
LM3263TMX/NOPB from Texas Instruments is a high-current, MIPI® RFFE-controlled step-down DC-DC converter optimized for RF power amplifier (PA) biasing in multi-mode cellular handsets. It operates from 2.7 V to 5.5 V input, delivers dynamically programmable output voltage from 0.4 V to 3.6 V, supports up to 2.5-A load current in PWM mode, and integrates Active Current Assist & Analog Bypass (ACB) to maintain regulation under transient PA loads - deployed in smartphones and LTE/3G/2G RF front-end modules.
For engineers reviewing the LM3263TMX/NOPB datasheet, LM3263TMX/NOPB pinout, LM3263TMX/NOPB application, or LM3263TMX/NOPB equivalent, key selection criteria include RFFE digital interface compatibility, ACB-enabled inductor size reduction, 2.7-MHz switching frequency for compact filtering, PFM/PWM seamless transition for efficiency across PA output power levels, and DSBGA-16 thermal performance in space-constrained mobile PCBs.
Technical Context
The LM3263TMX/NOPB implements a synchronous buck topology with integrated PFET/NFET switches and an on-chip 8-bit DAC for VSET register control via MIPI RFFE bus (SCLK/SDATA). Its dual-mode operation-forced PWM for 2G and auto-PFM/PWM for 3G/4G-enables spectral-clean output ripple (<3 mVpp at 2.7 MHz) during transmission while minimizing quiescent current (360 µA in PFM) at low PA output power.
ACB functionality provides parallel current assist above ~1.45 A peak inductor current, limiting max inductor current to 1.45 A (typ) while sustaining 2.5-A total output, and enables analog bypass when dropout conditions arise - reducing effective dropout resistance to 45–55 mΩ and supporting fast VSET transitions (as low as 7.4 µs for 0.8 V → 3.3 V at 20 Ω load).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | 2.7 V to 5.5 V - supports full Li-ion battery discharge curve without external pre-regulation. |
| Output Voltage Range | 0.4 V to 3.6 V (programmable via 8-bit VSET register) - matches dynamic PA VCC requirements across 2G/3G/4G bands. |
| Max Load Current | 2.5 A (PWM mode, switcher + ACB) - sustains peak LTE PA current bursts without dropout. |
| Switching Frequency | 2.7 MHz (typical, PWM mode) - enables use of small 1.5-µH inductors and 0402/0201 MLCCs. |
| RFFE Interface | MIPI® RFFE v1.0 compliant (SCLK/SDATA/GPO1) - enables direct digital control from baseband or RF transceiver ICs. |
| ACB Peak Assist Current | 1.7 A (positive ACB limit) - augments switcher current to meet transient PA demand while constraining inductor size. |
| Efficiency @ 3.4 V / 550 mA | 93%–95% - minimizes thermal load and extends battery runtime in high-output-power LTE transmission. |
| Shutdown Current | 0.02 µA (typical) - preserves battery life during RF PA idle or sleep states. |
Pinout & Package
LM3263TMX/NOPB is housed in a 2.049 mm × 2.049 mm, 16-pin DSBGA (YFQ) package with 0.4-mm pitch and bottom-side solder balls. The package supports high-density mobile layouts and requires controlled thermal pad design per TI's DSBGA assembly guidelines.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| PVIN | Power input (PFET switch) | Primary high-side switch supply rail; connects to battery or system VBAT (2.7–5.5 V). |
| SVDD | Analog power supply | Bias rail for internal analog circuitry including error amplifier and DAC; decoupling critical for ripple rejection. |
| PACB | ACB power supply | Dedicated supply for ACB circuitry; must be connected to same source as PVIN for proper assist operation. |
| SW | Switching node | Connection point between internal PFET drain and NFET source; drives external inductor. |
| ACB | ACB output | Active current assist output; connects directly to output filter capacitor node to augment load current. |
| FB | Feedback input | Analog feedback sense point; connects to output capacitor to close regulation loop for VSET DAC setpoint. |
| VIO | RFFE I/O reference & enable | Defines logic thresholds for SCLK/SDATA (1.65–1.95 V); also serves as hardware enable/reset input. |
| SCLK / SDATA | RFFE serial interface | MIPI RFFE clock and bidirectional data lines; require pull-down when VIO is unpowered to prevent leakage. |
| GPO1 | General-purpose output | Configurable digital output; used for USID reconfiguration or status signaling to baseband processor. |
| PGND / BGND / SGND | Ground terminals | Separate power (PGND), analog/digital (BGND), and signal (SGND) grounds - must be star-connected at single point. |
Key Features
| Feature | Design Value |
|---|---|
| MIPI RFFE v1.0 Digital Control | Enables real-time, low-latency VSET updates from baseband IC without analog DAC or GPIO overhead. |
| Active Current Assist & Analog Bypass (ACB) | Reduces required inductor current rating to ≤1.45 A while delivering 2.5-A peak output - cuts solution size by ~30% vs conventional buck. |
| Seamless PFM/PWM Transition | Automatically shifts between high-efficiency PFM (≤60 mA) and low-ripple PWM (>130 mA) - eliminates manual mode switching and maintains spectral compliance. |
| 2.7-MHz Fixed-Frequency PWM | Minimizes EMI sensitivity and allows use of ultra-small 1.5-µH shielded inductors (e.g., TOKO DFE201610MT-1R5N). |
| Internal Compensation | Eliminates external compensation components - reduces BOM count and layout sensitivity for production scalability. |
| Thermal & Overcurrent Protection | Integrated thermal shutdown (150°C trip) and fixed current limits (PFET: 1.9 A transient, NFET: −1.5 A) ensure robustness under fault conditions. |
Applications
| Smartphone RF Front-End | Multi-Band LTE Handset |
|---|---|
|
Use Scenario: Dynamic VCC_PA adjustment across LTE Band 1/3/7/40/41 during handover and MIMO transmission. IC Role / Device Role / Timing Role: Primary PA bias supply with RFFE-synchronized voltage scaling to minimize PA power dissipation and adjacent-channel leakage. Use Value: Enables >93% efficiency at 3.4 V/550 mA output, reducing thermal load on antenna module and extending talk time by 12% vs fixed-buck solutions. |
Use Scenario: Simultaneous 3G WCDMA + 4G LTE carrier aggregation requiring rapid VCC_PA slew between 0.8 V (idle) and 3.3 V (peak). IC Role / Device Role / Timing Role: Fast-settling, digitally controlled buck converter with ACB-assisted edge response (7.4 µs rise time) to track baseband command timing. Use Value: Meets 3GPP TS 34.121-1 spectral mask requirements with <3 mVpp ripple in forced PWM mode, eliminating need for post-regulator LDOs. |
| 2G/3G Feature Phone | RF PC Card Module |
|
Use Scenario: GSM/GPRS Class 12 PA biasing with burst-mode current demands up to 2.5 A at 2.5 V. IC Role / Device Role / Timing Role: High-current step-down regulator operating in forced-PWM mode to suppress switching noise in narrowband TX spectrum. Use Value: Delivers 2.5-A peak with <50 mVpk load transient deviation (0→1.2 A), ensuring stable PA gain and ACLR performance across temperature. |
Use Scenario: Compact, hot-pluggable RF card for portable test equipment requiring low-noise, digitally programmable PA supply. IC Role / Device Role / Timing Role: Standalone RFFE-controlled DC-DC with GPO1 status reporting and minimal external components (no compensation needed). Use Value: Achieves 9.1-mm² total solution size (including 1.5-µH inductor and 3×1-µF output caps), fitting within 12×12-mm card footprint. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar RF PA power supply applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LM3243TMX/NOPB | Same DSBGA-16 package and RFFE interface, but supports higher 3-A output and wider 0.3–3.6-V VOUT range; includes enhanced thermal derating for sustained 2.5-A loads. | Targeted at flagship smartphones with higher-power envelope-tracking PAs; requires updated inductor (2.2 µH) and slightly larger layout area. | Select LM3243TMX/NOPB when >2.5-A peak current headroom or extended low-VOUT linearity (<0.3 V) is required. |
| MAX25202ATP+T | 3.2-MHz switching frequency, 2.2-A max output, SPI-only interface (no RFFE), no ACB; uses 20-pin TQFN with exposed thermal pad. | Designed for industrial RF modules where MIPI compatibility is unnecessary and board-level thermal management is available. | Choose MAX25202ATP+T only if RFFE interface is not required and PCB allows TQFN thermal pad routing. |
Compared with LM3263TMX/NOPB, LM3243TMX/NOPB offers higher current capability and lower minimum VOUT but increases solution size and cost; MAX25202ATP+T trades RFFE integration and ACB benefits for simpler SPI control and higher-frequency operation - neither is pin-compatible, and both require layout revision and firmware adaptation.
Availability
LM3263TMX/NOPB is available at Aetrix Electronics and suitable for smartphone RF front-end designs, LTE handset power management systems, and battery-powered RF PC cards requiring stable component supply, long-term lifecycle support, and traceable sourcing for volume production.
Supply support for LM3263TMX/NOPB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with decades of experience in power management ICs for mobile and wireless infrastructure.
The LM3263TMX/NOPB belongs to TI's RF Power Amplifier Power Supply family, engineered specifically to replace discrete LDO/buck combinations in space-constrained, spectrally sensitive cellular handsets using MIPI RFFE control.
FAQ
What is the primary function of the LM3263TMX/NOPB in an RF front-end system?
The LM3263TMX/NOPB serves as a digitally controlled, high-current step-down DC-DC converter that supplies dynamically adjustable bias voltage (0.4 V to 3.6 V) to RF power amplifiers in smartphones and LTE handsets. Its MIPI RFFE interface enables real-time VSET updates from the baseband processor, while its ACB feature ensures stable regulation during rapid PA load transients - making LM3263TMX/NOPB essential for spectral-compliant, energy-efficient RF transmission.
Does the LM3263TMX/NOPB support both PFM and PWM modes, and how is mode selection controlled?
Yes, the LM3263TMX/NOPB supports automatic PFM/PWM mode transition based on load current, controlled via the SMPS_CFG register bit 5. When set to '1', the device enters Auto-PFM mode - operating in PFM at light loads (<60 mA) for maximum efficiency and seamlessly switching to PWM above ~130 mA to maintain low output ripple. Forced PWM mode (bit 5 = '0') is used for 2G GSM/GPRS to suppress switching noise in narrowband spectra - all mode control is executed digitally over the RFFE bus without external signals.
What is the role of the ACB (Active Current Assist and Analog Bypass) feature in the LM3263TMX/NOPB?
The ACB feature in the LM3263TMX/NOPB provides a parallel current path that activates when inductor current exceeds ~1.45 A, allowing the device to sustain 2.5-A total output while limiting inductor sizing and losses. It also enables analog bypass operation near dropout - reducing effective dropout resistance to 45–55 mΩ - and accelerates VSET transition times (e.g., 7.4 µs for 0.8 V → 3.3 V). This makes LM3263TMX/NOPB uniquely suited for multi-mode PA biasing where transient response and efficiency coexist.
Which package type and footprint does the LM3263TMX/NOPB use, and what are key layout considerations?
The LM3263TMX/NOPB uses a 2.049 mm × 2.049 mm, 16-pin DSBGA (YFQ) package with 0.4-mm ball pitch. Key layout considerations include separate PGND/BGND/SGND planes tied at a single star point, short low-inductance PVIN and SW traces, localized SVDD and PACB decoupling with 0402 1-µF X5R capacitors, and strict adherence to TI's DSBGA thermal pad guidelines - especially for opaque-case assembly. The compact footprint enables integration into sub-10-mm² RF module areas.
Can the LM3263TMX/NOPB operate directly from a single-cell Li-ion battery across its full discharge range?
Yes, the LM3263TMX/NOPB is explicitly designed to operate from a single Li-ion cell across its entire usable voltage range of 2.7 V to 5.5 V. Its ACB-assisted bypass mode maintains regulation down to ~3.1 V input at high load, and its 0.4–3.6-V programmable output range accommodates PA VCC requirements from deep-sleep (0.4 V) to LTE peak power (3.6 V). Efficiency remains >89% at 3.5 V/1.9 A output even at 3.8-V input - confirming robust operation across the battery discharge curve.
LM3263TMX/NOPB Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- 16-WFBGA, DSBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- Converter, RF Power Amplifier
- Voltage - Input:
- 2.7V ~ 5.5V
- Number of Outputs:
- 1
- Voltage - Output:
- 0.4V ~ 3.6V
- Operating Temperature:
- -30°C ~ 90°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 16-DSBGA
LM3263TMX/NOPB FAQ
1.How can I place an order for LM3263TMX/NOPB through Aetrix?
Please submit a Request for Quotation (RFQ) for LM3263TMX/NOPB on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LM3263TMX/NOPB reliable?
The price and inventory of LM3263TMX/NOPB are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LM3263TMX/NOPB is usually 5 days.
3.What payment methods are accepted for LM3263TMX/NOPB?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LM3263TMX/NOPB transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LM3263TMX/NOPB?
LM3263TMX/NOPB orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LM3263TMX/NOPB order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LM3263TMX/NOPB?
For technical support, including LM3263TMX/NOPB datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LM3263TMX/NOPB requirements.
6.How does Aetrix verify that LM3263TMX/NOPB is sourced from the original manufacturer or authorized distributors?
All LM3263TMX/NOPB products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LM3263TMX/NOPB meets industry standards.
7.What is the process for return or replacement of LM3263TMX/NOPB?
All LM3263TMX/NOPB units undergo pre-shipment inspection (PSI). If there is an issue with LM3263TMX/NOPB, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LM3263TMX/NOPB part is unused and in its original packaging.
Return procedure for LM3263TMX/NOPB:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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