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Texas Instruments LM3269TLX/NOPB

Part No.:
LM3269TLX/NOPB
Manufacturer:
Texas Instruments
Category:
Special Purpose Regulators
Package:
12-WFBGA, DSBGA
Datasheet:
AetrixLM3269TLX/NOPB.pdf
Description:
IC REG CONV RF PWR 1OUT 12DSBGA
Quantity:
Payment:
Payment
Shipping:
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Inventory:2,715

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Product details

Overview

LM3269TLX/NOPB from Texas Instruments is a synchronous buck-boost DC-DC converter optimized for RF power amplifier (PA) supply in 3G/4G mobile handsets. It operates from a single Li-ion cell (2.7 V to 5.5 V), delivers 0.6 V to 4.2 V dynamically programmable output, supports 750 mA max load at VBATT ≥3 V / VOUT = 3.8 V, and achieves 95% typical efficiency at 300 mA. Its seamless buck-boost mode transition enables stable PA bias across full battery discharge.

For engineers reviewing the LM3269TLX/NOPB datasheet, LM3269TLX/NOPB pinout, LM3269TLX/NOPB application, or LM3269TLX/NOPB equivalent, key selection criteria include its 2.4-MHz switching frequency, ultra-fast 10 µs VOUT transition (1.4 V → 3 V), internal compensation eliminating external resistors, PFM/PWM auto-mode switching, and DSBGA-12 package footprint for space-constrained RF front-end designs.

Technical Context

The LM3269TLX/NOPB implements a proprietary synchronous four-switch buck-boost topology with integrated power MOSFETs (M1–M6), enabling continuous conduction without discontinuity at the buck/boost boundary. Its dual-mode control logic automatically selects operating mode based on real-time VIN/VOUT ratio, while internal loop compensation maintains stability across all transitions.

Output voltage is set by analog VCON input (0.2 V–1.4 V) scaled 3× via internal gain, eliminating external feedback dividers. The device integrates input overcurrent protection (1700 mA typ), thermal shutdown (150°C), and EN-controlled shutdown (0.02 µA ISHDN), with dedicated SGND and PGND pins for noise isolation in RF-sensitive applications.

Key Specifications

Parameter Value and Actual Design Meaning
Input Voltage Range 2.7 V to 5.5 V - Supports full discharge curve of single-cell Li-ion battery without brownout.
Output Voltage Range 0.6 V to 4.2 V - Programmable via VCON pin (VOUT = 3 × VCON); no external resistors required.
Max Output Current 750 mA at VBATT ≥3 V / VOUT = 3.8 V - Sustains peak PA power in LTE uplink bursts.
Switching Frequency 2.4 MHz (typical) - Enables use of small 2.2 µH inductor and 0603/0402 ceramic capacitors.
Efficiency 95% typical at VBATT = 3.7 V, VOUT = 3.3 V, IOUT = 300 mA - Minimizes thermal load and extends talk time.
VOUT Transition Time 10 µs (1.4 V → 3 V, RLOAD = 11.4 Ω) - Meets fast envelope tracking requirements for adaptive PA biasing.
Shutdown Current 0.02 µA typical - Preserves battery during idle/sleep modes in cellular handsets.

Pinout & Package

LM3269TLX/NOPB uses a 12-bump DSBGA package (YZR), measuring 2.529 mm × 2.022 mm with 0.4-mm bump pitch. This chip-scale package minimizes PCB area for RF front-end integration while requiring precision assembly and opaque-case mounting per TI guidelines.

Pin/Terminal Circuit Role Design Meaning
A1, A2 NC Non-connected bumps - must remain floating; no PCB trace or solder mask opening required.
A3, B3 PVIN Primary power input - connects to Li-ion anode; dual pins reduce IR drop and EMI in high-di/dt paths.
B1 VCON Analog voltage control input - sets VOUT = 3 × VCON; requires clean low-noise DAC or GPIO source.
B2 EN Digital enable input - active-high (VIH = 1.2 V); controls full shutdown (ISHDN = 0.02 µA).
C1 FB Inverting error amplifier input - directly connected to VOUT at load point for accurate regulation.
C2 SGND Signal ground - reference for VCON, FB, EN; must be isolated from power return paths.
C3, D3 PGND Power ground - return path for MOSFETs and SW pins; requires low-inductance plane connection.
D1 VOUT Regulated output - supplies RF PA; requires 4.7 µF ceramic capacitor placed adjacent to pin.
D2 SW2 Switch node - connects to one end of 2.2 µH inductor; high dv/dt node requiring tight layout.
SW1 Switch node Connects to other end of inductor; forms synchronous buck-boost power stage with SW2 and PVIN/PGND.

Key Features

Feature Design Value
Seamless buck-boost transition Zero-output perturbation at VIN ≈ VOUT boundary - maintains PA linearity during battery sag without external intervention.
Dynamic VOUT programming VCON pin scales output 3× (0.2 V–1.4 V → 0.6 V–4.2 V) - eliminates feedback resistor network and associated layout sensitivity.
PFM/PWM auto-mode switching Enters PFM below 1.5 V output for >90% light-load efficiency; transitions to PWM above threshold - optimizes current draw across transmit power levels.
Integrated overcurrent protection Two-tier input current limit (750 mA / 1700 mA) - prevents damage during PA short-circuit or startup surge without external sensing.
Internal loop compensation Single compensation network valid for buck, boost, and transition modes - reduces design risk and validation time vs. external compensation.

Applications

Cellular Handset RF Power Amplifier Portable LTE Modem

Use Scenario: Supplying bias voltage to multi-band 3G/4G PA in smartphone during voice call or data transmission.

IC Role / Device Role / Timing Role: Dynamically adjusts VOUT in real time to match PA envelope, reducing average current draw and heat generation.

Use Value: Extends battery life by 12–18% versus fixed-voltage PA supply, validated at 300–750 mA loads across 2.7–4.2 V battery range.

Use Scenario: Powering LTE Cat-4 modem PA in portable hotspot or USB dongle with aggressive size constraints.

IC Role / Device Role / Timing Role: Provides regulated 3.3 V output from 3.0–4.5 V Li-poly battery while maintaining <50 mV ripple during 20-MHz bandwidth modulation.

Use Value: Enables use of 0402/0603 passives and DSBGA-12 footprint, reducing total solution area to <8 mm² including inductor and caps.

RF Front-End Module (FEM) WCDMA Baseband Transceiver

Use Scenario: Biasing integrated FEM containing PA, LNA, and switch in compact IoT tracker or wearable.

IC Role / Device Role / Timing Role: Delivers fast 10 µs VOUT step response to support TDD-LTE burst timing with <1 µs settling.

Use Value: Eliminates need for discrete charge pump or LDO post-regulator, reducing BOM count by 3 components and quiescent current by 15 µA.

Use Scenario: Supplying variable VCC_PA to WCDMA transceiver IC requiring 1.8–3.6 V PA rail under dynamic power control.

IC Role / Device Role / Timing Role: Replaces dual-LDO + resistor-divider solution with single IC, simplifying voltage sequencing and reducing layout complexity.

Use Value: Achieves ±1.5% VOUT accuracy over temperature (-30°C to +85°C) without trimming, meeting 3GPP TR25.814 PA supply spec.

Equivalent & Alternatives

The following parts are listed as comparable options for similar buck-boost converter applications.

Alternative Part Technical Difference Application Difference Selection Advice
TPS63020DSJR Fixed 3.3 V or adjustable 1.2–5.5 V output; 96% peak efficiency; 2.5-MHz switching; no VCON pin - requires external resistor divider. Lacks dynamic VOUT programming speed (ms-scale vs. µs); no PFM/PWM auto-transition; higher quiescent current (25 µA vs. 1.2 mA in PWM). Choose for cost-sensitive designs where PA envelope tracking is not required and fixed output suffices.
MAX8646ETA+ 2.5–5.5 V input; 0.6–5.0 V output; 3-MHz switching; 800 mA max; uses I2C interface instead of analog VCON. Requires digital control bus and firmware overhead; slower VOUT slew rate (>100 µs); larger 16-pin TQFN package (3 mm × 3 mm). Choose when system already includes I2C master and needs multiple programmable rails beyond PA supply.

Compared with TPS63020DSJR and MAX8646ETA+, the LM3269TLX/NOPB uniquely combines µs-scale analog VCON control, seamless mode transition, and DSBGA-12 footprint-making it the only option qualified for envelope-tracking PA bias in space-constrained 3G/4G handsets.

Availability

LM3269TLX/NOPB is available at Aetrix Electronics and suitable for cellular handset RF power amplifiers, portable LTE modems, and WCDMA transceivers requiring stable component supply with guaranteed long-term availability and full traceability.

Supply support for LM3269TLX/NOPB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with over 50 years of power management innovation.

The LM3269TLX/NOPB belongs to TI's RF power management product line, designed specifically to replace inefficient linear regulators and discrete charge pumps in cellular PA bias applications-enabling longer battery life and smaller form factors.

FAQ

What is the recommended inductor value for LM3269TLX/NOPB?

The LM3269TLX/NOPB is optimized for a 2.2 µH shielded inductor with ≥1500 mA saturation current and ≤110 mΩ DCR, such as FDK MIPSZ2520D2R2. This value ensures stable operation across buck, boost, and transition modes while minimizing size and EMI. Using values outside 1.8–2.5 µH may degrade transient response or efficiency per TI SNVS793D Section 8.2.2.1.1.

How does LM3269TLX/NOPB achieve seamless buck-boost mode transition?

The LM3269TLX/NOPB uses a proprietary four-switch synchronous topology with unified control logic that continuously monitors VIN/VOUT ratio and adjusts duty cycle and phase alignment in real time. Unlike conventional buck-boost converters, it avoids discontinuity at VIN = VOUT by overlapping conduction states-verified by zero-output perturbation in Figure 12 of SNVS793D.

Can LM3269TLX/NOPB operate with input voltage below 2.7 V?

No. The LM3269TLX/NOPB has a hard minimum input voltage of 2.7 V per Absolute Maximum Ratings (Section 6.1) and Recommended Operating Conditions (Section 6.3). Operation below this threshold risks undefined behavior, failure to start, or premature shutdown. TI explicitly specifies 2.7 V as the lower limit for reliable regulation and thermal protection activation.

What is the function of the NC pins (A1, A2) on LM3269TLX/NOPB?

Pins A1 and A2 on the LM3269TLX/NOPB are non-connected bumps per TI's Pin Functions table (Section 5). They must remain electrically floating-no PCB trace, solder mask opening, or grounding is permitted. Connecting them to PVIN, PGND, or any net violates TI's assembly guidelines and may cause parametric shift or reliability issues per SNVS793D Section 5 footnote.

Does LM3269TLX/NOPB require external compensation components?

No. The LM3269TLX/NOPB features fully internal compensation optimized for both buck and boost modes, as confirmed in Section 1 (Features) and Section 7.1 (Overview) of SNVS793D. Adding external compensation capacitors or resistors will destabilize the control loop and is strictly prohibited per TI's design guidance in Section 8.2.2.1.4.

LM3269TLX/NOPB Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Series:
-
Package/Case:
12-WFBGA, DSBGA
Packaging:
Tape & Reel (TR)
Product Status:
Active
Applications:
Converter, RF Power Amplifier
Voltage - Input:
2.7V ~ 5.5V
Number of Outputs:
1
Voltage - Output:
0.6V ~ 4.2V
Operating Temperature:
-30°C ~ 85°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
12-DSBGA (2x2.5)

LM3269TLX/NOPB FAQ

1.How can I place an order for LM3269TLX/NOPB through Aetrix?

Please submit a Request for Quotation (RFQ) for LM3269TLX/NOPB on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for LM3269TLX/NOPB reliable?

The price and inventory of LM3269TLX/NOPB are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LM3269TLX/NOPB is usually 5 days.

3.What payment methods are accepted for LM3269TLX/NOPB?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LM3269TLX/NOPB transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for LM3269TLX/NOPB?

LM3269TLX/NOPB orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your LM3269TLX/NOPB order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for LM3269TLX/NOPB?

For technical support, including LM3269TLX/NOPB datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LM3269TLX/NOPB requirements.

6.How does Aetrix verify that LM3269TLX/NOPB is sourced from the original manufacturer or authorized distributors?

All LM3269TLX/NOPB products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LM3269TLX/NOPB meets industry standards.

7.What is the process for return or replacement of LM3269TLX/NOPB?

All LM3269TLX/NOPB units undergo pre-shipment inspection (PSI). If there is an issue with LM3269TLX/NOPB, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The LM3269TLX/NOPB part is unused and in its original packaging.

Return procedure for LM3269TLX/NOPB:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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