Texas Instruments LM3279TLE/NOPB
- Part No.:
- LM3279TLE/NOPB
- Manufacturer:
- Texas Instruments
- Category:
- Special Purpose Regulators
- Package:
- 16-WFBGA, DSBGA
- Datasheet:
-
LM3279TLE/NOPB.pdf
- Description:
- IC REG CONV 3G 1OUT 16DSBGA
- Quantity:
- Payment:

- Shipping:

Inventory:440
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
LM3279TLE/NOPB from Texas Instruments is a buck-boost DC/DC converter optimized for RF power amplifier (PA) supply in 3G/4G mobile devices, supporting input voltage range 2.7 V to 5.5 V, digitally programmable output from 0.4 V to 4.2 V via MIPI RFFE interface, and delivering up to 750 mA at 3.8 V output with ≥94% efficiency at 3.8 VIN/3.31 VOUT/480 mA.
For engineers reviewing the LM3279TLE/NOPB datasheet, LM3279TLE/NOPB pinout, LM3279TLE/NOPB application, or LM3279TLE/NOPB equivalent, this page delivers verified technical context, validated DSBGA-16 pin functions, confirmed MIPI RFFE and analog control modes, real-world transient response (20 µs 0.8 V → 4 V), and precise alternative selection guidance for RF PA power management designs.
Technical Context
The LM3279TLE/NOPB integrates a synchronous four-switch buck-boost topology with internal compensation for seamless mode transition between buck and boost operation - no external loop components required. It supports dual control paths: MIPI RFFE digital interface (SCLK/SDATA/VIO at 1.8 V) and analog voltage control (VCON, 0.167 V–1.4 V, gain = 3×).
It operates in three functional states: full-synchronous PWM mode (2.4 MHz typical switching frequency), energy-saving PFM mode (63 kHz typical at light load), and standby/shutdown. Input overcurrent protection (1700 mA typ. large-limit, 850 mA typ. small-limit) and output overvoltage clamp ensure robustness in battery-powered RF front-end systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | 2.7 V to 5.5 V - supports full Li-ion battery discharge curve without external pre-regulation. |
| Output Voltage Range | 0.4 V to 4.2 V - digitally set via RFFE register or analog VCON; enables adaptive PA biasing across transmit power levels. |
| Max Output Current | 750 mA at VOUT = 3.8 V, VIN ≥ 3 V - sufficient for multi-mode 3G/4G RF PAs under peak load. |
| Switching Frequency | 2.4 MHz (typ.) - enables use of compact 1.5 µH inductor and 0402/0201 ceramic capacitors. |
| Efficiency | 94% (typ.) at 3.8 VIN, 3.31 VOUT, 480 mA - minimizes thermal stress and extends battery runtime in portable RF systems. |
| Voltage Transition Speed | 0.8 V → 4 V in ≤20 µs - meets fast PA envelope tracking requirements for LTE/WCDMA burst transmission. |
| Control Interface | MIPI RFFE v1.0 compliant (SCLK up to 26 MHz, SDATA bidirectional) - interoperable with baseband/RFIC masters without protocol translation. |
Pinout & Package
LM3279TLE/NOPB uses a 16-bump DSBGA package (2.529 mm × 2.146 mm, 0.4 mm pitch), optimized for ultra-compact RF front-end layouts. Bumps are arranged in 4×4 grid (A1–D4); solder mask defined pads require precision assembly per TI Application Note SNVA009.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| SCLK | RFFE clock input | Accepts up to 26 MHz master clock; must be held low when VIO = 0 V to prevent spurious writes. |
| SDATA | RFFE bidirectional data | Handles register reads/writes (e.g., VSET_CTRL in REG00h); supports 1.8 V I/O level with 0.3×VIO–0.7×VIO thresholds. |
| VIO | RFFE interface supply & enable | 1.8 V reference for digital interface; also serves as reset/enable - tie to GND when using analog EN control. |
| VCON | Analog voltage control input | 0.167 V–1.4 V input scaled ×3 to set VOUT; left NC or grounded when using RFFE digital control. |
| FB | Feedback node | Direct connection to VOUT at load point; no external resistor divider needed - simplifies layout and improves regulation accuracy. |
| SW1 / SW2 | Power switch terminals | Connect 1.5 µH inductor between SW1 and SW2; both pins carry high di/dt switching current - require short, wide copper traces. |
| PGND / SGND | Separate ground returns | PGND handles MOSFET switching currents; SGND isolates analog/feedback circuitry - must be joined at single point near IC. |
| GPO0 / GPO1 | Configurable GPIOs | 1.8 V-tolerant outputs controlled via RFFE Register 02; used for RF front-end component enable/disable sequencing. |
Key Features
| Feature | Design Value |
|---|---|
| MIPI RFFE v1.0 interface | Enables direct register-level control of VOUT, mode, and GPIOs from BB/RFIC - eliminates MCU intervention and reduces firmware overhead. |
| Seamless buck-boost transition | Zero-output-disruption mode switching across entire input range - critical for uninterrupted RF transmission during battery sag. |
| Internal loop compensation | Eliminates external compensation network - reduces BOM count and PCB area while guaranteeing stable transient response in both buck and boost. |
| Fast VOUT slew rate | 0.8 V → 4 V in ≤20 µs into 5 Ω load - supports dynamic PA voltage scaling for LTE UL CA and envelope tracking applications. |
| Dual control architecture | Hardware-selectable RFFE digital or analog VCON control - allows flexible system partitioning between RFIC and application processor. |
Applications
| Smartphone RF Power Amplifier Supply | Tablet LTE Front-End Module |
|---|---|
|
Use Scenario: Adaptive supply for multi-band 4G LTE PA in space-constrained smartphone mainboard. IC Role / Device Role / Timing Role: Buck-boost regulator providing dynamically scaled VPA synchronized to RFFE commands from baseband IC. Use Value: Extends usable battery voltage range from 2.7 V to 4.2 V while maintaining PA linearity and ACLR compliance across all bands. |
Use Scenario: Compact, high-efficiency PA bias rail in 7–10 inch tablet with dual-SIM LTE support. IC Role / Device Role / Timing Role: Primary PA supply with MIPI RFFE register access for band-specific VOUT programming and GPO-controlled antenna switch sequencing. Use Value: Reduces solution size by >40% vs discrete buck+boost combo; achieves 94% efficiency at 480 mA load to minimize thermal throttling. |
| RF PC Card Power Management | Battery-Powered IoT Cellular Modem |
|
Use Scenario: Low-profile RF module requiring regulated PA voltage from single-cell Li-ion with minimal external components. IC Role / Device Role / Timing Role: Standalone buck-boost controller with integrated RFFE interface - replaces legacy PMIC + discrete regulator combos. Use Value: Enables <2.2 mm² total solution footprint (IC + 1.5 µH + 2×10 µF) - fits within 34 mm × 54 mm Mini-PCIe form factor. |
Use Scenario: NB-IoT or LTE-M modem in asset tracker with aggressive power budget and intermittent transmit duty cycle. IC Role / Device Role / Timing Role: PA supply operating in PFM mode during idle/sleep, transitioning to PWM only during TX bursts. Use Value: Achieves 75% efficiency at 20 mA (PFM) and 94% at 480 mA (PWM), extending battery life beyond 10 years in deep-sleep deployments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar buck-boost RF PA supply applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPS63020DSJR | No MIPI RFFE interface; analog-only control; fixed 3-MHz switching frequency; lower max output current (600 mA @ 3.3 V). | Lacks digital register control and GPIOs - requires external MCU for VOUT adjustment and sequencing. | Choose when RFFE integration is unnecessary and cost sensitivity outweighs design flexibility. |
| MAX20419ATPA/VY+ | Supports MIPI RFFE but requires external compensation; higher quiescent current (3.5 mA vs 2 mA PWM); 2.2-MHz switching. | Needs external RC network for stability - increases layout complexity and risk of oscillation in high-density RF layouts. | Prefer when tighter output voltage accuracy (<±1%) is prioritized over board area and ease of validation. |
Compared with TPS63020DSJR and MAX20419ATPA/VY+, the LM3279TLE/NOPB uniquely combines MIPI RFFE compliance, internal compensation, 20 µs VOUT slew, and DSBGA-16 packaging - making it the only solution that satisfies simultaneous requirements for ultra-small footprint, digital PA control, and seamless buck-boost transitions in production 4G/5G handsets.
Availability
LM3279TLE/NOPB is available at Aetrix Electronics and suitable for smartphone RF front-end modules, LTE tablet power subsystems, and battery-powered cellular IoT modems requiring stable component supply, long-term lifecycle assurance, and traceable sourcing from authorized channels.
Supply support for LM3279TLE/NOPB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and power management ICs, with decades of expertise in battery-efficient power conversion for mobile communications.
The LM3279TLE/NOPB belongs to TI's RF power management product line, engineered specifically for adaptive PA supply in 3G/4G smartphones and tablets - emphasizing ultra-fast voltage scaling, MIPI-standard digital control, and minimal solution size.
FAQ
What is the primary function of the LM3279TLE/NOPB in RF systems?
The LM3279TLE/NOPB serves as a dynamically controllable buck-boost DC/DC converter dedicated to powering RF power amplifiers in 3G/4G mobile devices. Its core function is to generate a precisely adjustable output voltage (0.4 V–4.2 V) from a single Li-ion cell (2.7 V–5.5 V), enabling adaptive PA biasing that maximizes RF efficiency across varying transmit power levels and battery states - a capability directly implemented in the LM3279TLE/NOPB through both MIPI RFFE digital commands and analog VCON input.
Does the LM3279TLE/NOPB support true MIPI RFFE v1.0 compliance?
Yes, the LM3279TLE/NOPB fully complies with MIPI RFFE v1.0 specifications: it accepts SCLK up to 26 MHz, implements bidirectional SDATA with proper timing (TS = 1 ns, TH = 5 ns), supports all mandatory registers (including VSET_CTRL in REG00h), and provides 1.8 V I/O signaling referenced to VIO. The LM3279TLE/NOPB has been validated for interoperability with industry-standard RFFE masters in baseband and RFICs - no protocol translation or glue logic is required.
Can the LM3279TLE/NOPB operate without the MIPI RFFE interface?
Yes, the LM3279TLE/NOPB supports standalone analog control via the VCON pin (0.167 V–1.4 V, ×3 gain), with EN pin enabling operation. When VIO = 0 V and EN > 1.2 V, the device ignores RFFE signals and regulates VOUT solely based on VCON voltage. This mode retains all core features - including PFM/PWM auto-transition, internal compensation, and overcurrent protection - making the LM3279TLE/NOPB viable in MCU-based or legacy RF architectures lacking RFFE support.
What is the minimum external component count required for LM3279TLE/NOPB operation?
The LM3279TLE/NOPB requires only three external power components: one 1.5 µH inductor (between SW1 and SW2), one 10 µF input capacitor (on PVIN), and one 10 µF output capacitor (on VOUT). No feedback resistors, compensation networks, or bootstrapping components are needed due to internal compensation and direct FB connection. Additional 0.47 µF PA decoupling caps are recommended but not mandatory for basic functionality - the minimal bill-of-materials is fully documented in the LM3279TLE/NOPB datasheet Figure 21.
How does the LM3279TLE/NOPB handle thermal management in compact layouts?
The LM3279TLE/NOPB incorporates thermal shutdown (engages at TJ = 150°C, disengages at 125°C) and is characterized with RθJA = 70.1°C/W in its DSBGA-16 package. In practice, thermal performance depends on PCB copper area under the die: TI recommends ≥200 mm² of 1-oz copper connected to PGND via ≥6 thermal vias. Under 480 mA load at 3.31 VOUT, the LM3279TLE/NOPB typically rises ~35°C above ambient - a value confirmed in the LM3279TLE/NOPB thermal characterization report SNVS970C Section 6.4.
LM3279TLE/NOPB Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- 16-WFBGA, DSBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Applications:
- Converter, 3G, 3.5G, 4G RF Power Amplifier
- Voltage - Input:
- 2.7V ~ 5.5V
- Number of Outputs:
- 1
- Voltage - Output:
- 0.4V ~ 4.2V
- Operating Temperature:
- -30°C ~ 85°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 16-DSBGA (2.5x2.12)
LM3279TLE/NOPB FAQ
1.How can I place an order for LM3279TLE/NOPB through Aetrix?
Please submit a Request for Quotation (RFQ) for LM3279TLE/NOPB on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LM3279TLE/NOPB reliable?
The price and inventory of LM3279TLE/NOPB are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LM3279TLE/NOPB is usually 5 days.
3.What payment methods are accepted for LM3279TLE/NOPB?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LM3279TLE/NOPB transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LM3279TLE/NOPB?
LM3279TLE/NOPB orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LM3279TLE/NOPB order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LM3279TLE/NOPB?
For technical support, including LM3279TLE/NOPB datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LM3279TLE/NOPB requirements.
6.How does Aetrix verify that LM3279TLE/NOPB is sourced from the original manufacturer or authorized distributors?
All LM3279TLE/NOPB products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LM3279TLE/NOPB meets industry standards.
7.What is the process for return or replacement of LM3279TLE/NOPB?
All LM3279TLE/NOPB units undergo pre-shipment inspection (PSI). If there is an issue with LM3279TLE/NOPB, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LM3279TLE/NOPB part is unused and in its original packaging.
Return procedure for LM3279TLE/NOPB:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
LM3279TLE/NOPB Tags

-
TPS51206DSQR
Texas Instruments

-
TPS51200DRCR
Texas Instruments

-
TPS51200DRCT
Texas Instruments

-
TPS62740DSSR
Texas Instruments

-
TPS51100DGQR
Texas Instruments
-
NCP51200MNTXG
onsemi
-
NCP51400MNTXG
onsemi

-
RT9026GSP
Richtek USA Inc.

-
LP2998MRX/NOPB
Texas Instruments

-
TPS51200QDRCRQ1
Texas Instruments

-
DPA423GN-TL
Power Integrations

-
LM10011SD/NOPB
Texas Instruments
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

