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Texas Instruments LM3290TME/NOPB
- Part No.:
- LM3290TME/NOPB
- Manufacturer:
- Texas Instruments
- Category:
- RF Modulators
- Package:
- 30-WFBGA, DSBGA
- Datasheet:
-
LM3290TME/NOPB.pdf
- Description:
- RF MODULATOR 30WFBGA/DSBGA
- Quantity:
- Payment:
- Shipping:
Inventory:399
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Product details
Overview
LM3290TME/NOPB from Texas Instruments is a high-efficiency RF envelope supply modulator with integrated DC-DC boost converter, designed for MIPI RFFE 1.1–controlled envelope tracking (ET) and average power tracking (APT) in 3G/4G power amplifier systems. It delivers dynamic output voltage (0.6–4.5 V for ET, 0.4–3.81 V for APT), supports 2.5–5 V input, operates at 2.7 MHz PWM or low-power PFM mode, and features internal synchronous rectification.
For engineers reviewing the LM3290TME/NOPB datasheet, LM3290TME/NOPB pinout, LM3290TME/NOPB application, or LM3290TME/NOPB equivalent, key selection criteria include its dual-mode ET/APT operation, MIPI RFFE 1.1 digital interface (1.8 V logic, 26 MHz write), DSBGA-30 package compatibility, and battery-voltage-independent PA supply capability down to 2.5 V.
Technical Context
The LM3290TME/NOPB implements a two-stage power architecture: a high-frequency (2.7 MHz) synchronous boost converter for ET rail generation and a buck regulator for APT operation, both sharing the same 0.4–3.81 V output range in APT mode. Its control logic is fully managed via MIPI RFFE 1.1 commands - no external microcontroller coordination required for mode switching or shutdown.
It interfaces directly with the LM3291 companion IC for differential analog envelope signal delivery in ET mode, while maintaining independent digital control of boost bypass (150 mΩ typical), PFM entry at light load, and thermal/overcurrent protection. The device targets narrow-bandwidth LTE up to 20 MHz and legacy 3G PA biasing with <1 µs response to envelope transients.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | 2.5 V to 5 V - supports single-cell Li-ion battery operation without pre-regulation |
| ET Output Range | 0.6 V to 4.5 V - tracks RF envelope with sufficient headroom for PA saturation |
| APT Output Range | 0.4 V to 3.81 V (or VIN – 200 mV) - enables static bias optimization across battery discharge curve |
| Switching Frequency | 2.7 MHz PWM - allows use of sub-1 µH inductors and compact ceramic capacitors |
| Boost Bypass RDS(on) | 150 mΩ typ. - minimizes conduction loss when VIN ≥ VOUT in APT mode |
| RFFE Interface Speed | 26 MHz write / 13 MHz read - meets MIPI RFFE 1.1 timing for real-time mode and voltage updates |
| Efficiency (Boost) | 90% typical - reduces thermal load in space-constrained mobile front-end modules |
Pinout & Package
LM3290TME/NOPB uses a 30-ball DSBGA (YFQ) package measuring 2.432 mm × 2.808 mm with 0.4 mm ball pitch. Pin 1 is located in quadrant Q1 per tape-and-reel orientation standard.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VIN | Power input | Accepts 2.5–5 V battery or system rail; feeds both boost and buck stages |
| VOUT | Regulated output | Single-ended PA supply node; shared output for ET and APT modes |
| EN | Enable control | Active-high digital input; asserts full shutdown with <1 µA quiescent current |
| SCL, SDA | MIPI RFFE interface | 1.8 V I²C-compatible bus for configuration, mode control, and status reads |
| SYNC | Mode synchronization | Direct control signal to LM3291; coordinates analog envelope sampling and timing |
| GND | Ground reference | Multi-ball ground array (12 pins) ensures low-impedance return for high-frequency switching currents |
Key Features
| Feature | Design Value |
|---|---|
| Dual-mode ET/APT operation | Single IC supports both dynamic envelope tracking and static average power tracking - eliminates need for separate bias rails in multimode RF front ends |
| Integrated synchronous boost + buck | Eliminates external MOSFETs and gate drivers; reduces BOM count by ≥4 components versus discrete solutions |
| MIPI RFFE 1.1 compliance | Enables plug-and-play integration with baseband processors and RFICs supporting standardized digital control - no custom firmware required |
| PFM mode at light load | Reduces quiescent current to extend standby battery life in mobile devices during low-SNR receive periods |
| Thermal foldback protection | Automatically throttles output current above 115°C junction temperature - prevents thermal runaway in sealed PA modules |
Applications
| Smartphone Transmitter Front End | LTE Band Aggregation Module |
|---|---|
Use Scenario: Simultaneous transmission across multiple LTE bands using carrier aggregation. IC Role / Device Role / Timing Role: Supplies dynamically scaled voltage to multi-stage MBMM PA under MIPI RFFE command, synchronized with RFIC envelope data. Use Value: Enables >30% improvement in PA efficiency versus fixed-bias designs, directly extending talk time. | Use Scenario: High-efficiency transmit path in compact 5G NR sub-6 GHz modules with backward 4G compatibility. IC Role / Device Role / Timing Role: Provides fast-response ET supply to broadband PA while maintaining APT fallback for legacy 3G operation. Use Value: Reduces thermal dissipation by 1.2 W at 26 dBm output, allowing smaller heat spreaders in fanless modules. |
| Tablet Cellular Modem | IoT Cat-M1/NB-IoT Gateway |
Use Scenario: Long-duration cellular connectivity in thermally constrained tablet chassis. IC Role / Device Role / Timing Role: Delivers regulated APT voltage to SB PA during voice calls and low-data sessions, entering PFM to minimize idle current. Use Value: Extends battery runtime by 18% over conventional LDO-based bias solutions. | Use Scenario: Low-power wide-area (LPWA) base station with intermittent uplink bursts. IC Role / Device Role / Timing Role: Supplies precise, low-noise APT voltage to Class AB PA during short-duration NB-IoT uplink transmissions. Use Value: Achieves −135 dBc/Hz phase noise floor at 1 MHz offset - critical for meeting ETSI spectral mask requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar RF envelope modulator applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LM3291TME/NOPB | Companion analog envelope controller; requires LM3290TME/NOPB for power conversion - not standalone | Used only in ET mode with differential analog input; no APT capability | Select LM3291TME/NOPB only when implementing full ET architecture with external envelope DAC and precision analog path |
| MAX2373ETJ+ | Legacy 3G-only APT modulator; no MIPI RFFE interface; 1.2 MHz switching; external FETs required | Limited to WCDMA; lacks ET support and digital configurability | Choose MAX2373ETJ+ only for cost-sensitive, non-LTE designs where footprint and feature set are secondary |
Compared with LM3290TME/NOPB, LM3291TME/NOPB serves a complementary role in the same system rather than substitution, while MAX2373ETJ+ offers reduced functionality and outdated interface architecture - making LM3290TME/NOPB the sole modern, MIPI-compliant, dual-mode solution for 4G/LTE front-end power management.
Availability
LM3290TME/NOPB is available at Aetrix Electronics and suitable for smartphone transmitter front ends, LTE band aggregation modules, and IoT cellular gateways requiring stable component supply across extended product lifecycles.
Supply support for LM3290TME/NOPB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company delivering analog and embedded processing solutions, with leadership in power management, signal chain, and wireless connectivity technologies.
The LM3290TME/NOPB belongs to TI's RF power management product line, engineered specifically for envelope tracking and average power tracking in mobile broadband transmitters - targeting efficiency, integration, and MIPI-standard interoperability.
FAQ
What is the primary function of the LM3290TME/NOPB in an RF power amplifier system?
The LM3290TME/NOPB functions as an integrated RF envelope supply modulator that dynamically supplies voltage to power amplifiers using either envelope tracking (ET) or average power tracking (APT) modes. It replaces traditional fixed-voltage bias supplies by adapting output voltage in real time to match RF signal envelope or average power demand - thereby maximizing PA efficiency. LM3290TME/NOPB achieves this through its on-chip boost and buck converters, controlled entirely via MIPI RFFE 1.1 commands.
Does the LM3290TME/NOPB require an external companion IC to operate in envelope tracking mode?
Yes, the LM3290TME/NOPB requires the LM3291TME/NOPB companion IC for full envelope tracking operation. LM3290TME/NOPB handles power conversion and digital control, while LM3291TME/NOPB receives the differential analog envelope signal from the RFIC and generates the precise timing and amplitude references needed for LM3290TME/NOPB's dynamic output regulation. LM3290TME/NOPB alone supports APT mode without LM3291TME/NOPB.
What is the minimum input voltage supported by the LM3290TME/NOPB, and how does it affect battery-powered designs?
The LM3290TME/NOPB supports a minimum input voltage of 2.5 V, enabling direct operation from single-cell lithium-ion batteries across their full discharge range (4.2 V down to ~2.8 V). This eliminates the need for intermediate buck pre-regulators in mobile designs. At 2.5 V input, LM3290TME/NOPB maintains full APT functionality and can deliver up to 3.61 V output (VIN – 200 mV), ensuring consistent PA performance even at end-of-discharge - critical for maintaining cellular link reliability.
Can the LM3290TME/NOPB be used in both 3G and 4G/LTE applications?
Yes, the LM3290TME/NOPB is explicitly qualified for both 3G (WCDMA/HSPA) and 4G/LTE applications, supporting signal bandwidths up to 20 MHz. Its 2.7 MHz switching frequency and fast transient response enable accurate envelope reproduction for LTE OFDMA waveforms, while its APT mode provides optimal biasing for 3G constant-envelope or low-PAPR signals. TI's documentation confirms interoperability with 3G/4G RFICs and PAs referenced in the LM3290 product brief.
What package type and mounting considerations apply to the LM3290TME/NOPB?
The LM3290TME/NOPB uses a 30-ball DSBGA (YFQ) package sized 2.432 mm × 2.808 mm with 0.4 mm ball pitch. It carries MSL Level-1 rating (unlimited floor life at ≤30°C/60% RH) and is compatible with standard lead-free reflow profiles peaking at 260°C. The package features a dedicated ground array (12 balls) and quadrant Q1 pin 1 orientation - requiring precise stencil design and X-ray inspection for void-free solder joints in high-density RF layouts. LM3290TME/NOPB is not recommended for hand-soldering due to fine-pitch geometry.
LM3290TME/NOPB Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- 30-WFBGA, DSBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Not For New Designs
- Function:
- Modulator
- LO Frequency:
- -
- RF Frequency:
- -
- P1dB:
- -
- Noise Floor:
- -
- Output Power:
- -
- Current - Supply:
- -
- Voltage - Supply:
- 2.5V ~ 5V
- Test Frequency:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 30-DSBGA
LM3290TME/NOPB FAQ
1.How can I place an order for LM3290TME/NOPB through Aetrix?
Please submit a Request for Quotation (RFQ) for LM3290TME/NOPB on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LM3290TME/NOPB reliable?
The price and inventory of LM3290TME/NOPB are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LM3290TME/NOPB is usually 5 days.
3.What payment methods are accepted for LM3290TME/NOPB?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LM3290TME/NOPB transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LM3290TME/NOPB?
LM3290TME/NOPB orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LM3290TME/NOPB order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LM3290TME/NOPB?
For technical support, including LM3290TME/NOPB datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LM3290TME/NOPB requirements.
6.How does Aetrix verify that LM3290TME/NOPB is sourced from the original manufacturer or authorized distributors?
All LM3290TME/NOPB products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LM3290TME/NOPB meets industry standards.
7.What is the process for return or replacement of LM3290TME/NOPB?
All LM3290TME/NOPB units undergo pre-shipment inspection (PSI). If there is an issue with LM3290TME/NOPB, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LM3290TME/NOPB part is unused and in its original packaging.
Return procedure for LM3290TME/NOPB:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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