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Texas Instruments LM3290TMX/NOPB
- Part No.:
- LM3290TMX/NOPB
- Manufacturer:
- Texas Instruments
- Category:
- RF Modulators
- Package:
- 30-WFBGA, DSBGA
- Datasheet:
-
LM3290TMX/NOPB.pdf
- Description:
- RF MODULATOR 30WFBGA/DSBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,770
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Product details
Overview
LM3290TMX/NOPB from Texas Instruments is a high-efficiency RF envelope supply modulator with integrated DC-DC boost converter, designed for MIPI RFFE 1.1–controlled envelope tracking (ET) and average power tracking (APT) in 3G/4G RF power amplifier systems. It delivers dynamic output voltage (0.6 V to 4.5 V for ET, 0.4 V to 3.81 V for APT), supports 2.5 V–5 V input, and operates at 2.7 MHz PWM or low-power PFM mode.
For engineers reviewing the LM3290TMX/NOPB datasheet, LM3290TMX/NOPB pinout, LM3290TMX/NOPB application, or LM3290TMX/NOPB equivalent, key selection criteria include its dual-mode ET/APT operation, MIPI RFFE 1.1 digital interface (26-MHz write), integrated synchronous rectification (90% typical boost efficiency), DSBGA-30 package, and compatibility with companion LM3291 for differential envelope control in LTE up to 20-MHz bandwidth.
Technical Context
The LM3290TMX/NOPB implements a dual-path power architecture: a high-bandwidth boost converter for ET mode (0.6–4.5 V output, 2.7-MHz PWM, 90% typical efficiency) and a buck regulator path for APT mode (0.4–3.81 V, 95% typical efficiency). It accepts analog envelope reference via LM3291 and executes real-time voltage modulation synchronized to RF signal envelope.
Control is fully managed through a 1.8-V MIPI RFFE 1.1 interface-supporting 26-MHz write and 13-MHz read-with automatic mode switching between ET, APT, PFM, shutdown, and standby. The device integrates internal synchronous rectifiers and offers boost bypass (150 mΩ typ.) for ultra-low-loss operation at high input voltage.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | 2.5 V to 5 V - enables direct battery connection across Li-ion discharge curve without external regulation |
| ET Output Voltage Range | 0.6 V to 4.5 V - tracks RF envelope with sub-100 ns response for LTE up to 20-MHz bandwidth |
| APT Output Voltage Range | 0.4 V to 3.81 V (or VIN – 200 mV) - provides static PA supply with adaptive headroom reduction |
| Switching Frequency | 2.7 MHz PWM - allows use of <1 µH inductors and compact ceramic capacitors |
| Boost Efficiency | 90% typical - minimizes thermal load in space-constrained mobile front-end modules |
| RFFE Interface | 1.8-V MIPI RFFE 1.1 - supports standardized digital control with 26-MHz write capability |
| Operating Temperature | –30°C to +85°C - qualified for smartphone and mobile hotspot RF front-end environments |
Pinout & Package
LM3290TMX/NOPB is housed in a 2.432 mm × 2.808 mm DSBGA-30 (YFQ) package with 0.4-mm pitch, optimized for ultra-thin mobile PCBs and co-packaged RF modules.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VIN | Boost Converter Input | Primary power input (2.5–5 V); connects directly to battery or system rail |
| VOUT_ET | Envelope Tracking Output | High-dynamic-range output supplying PA collector/drain in ET mode |
| VOUT_APT | Average Power Tracking Output | Stable, programmable output for PA bias in APT mode |
| EN | Enable Input | Active-high logic control for full device power-up/shutdown sequence |
| RFFE_CLK / RFFE_DATA / RFFE_STB | MIPI RFFE 1.1 Interface | 1.8-V digital control bus for mode selection, voltage programming, and status reporting |
| REFP / REFN | Differential Envelope Reference Input | Accepts analog envelope signal from LM3291; defines real-time VOUT_ET trajectory |
Key Features
| Feature | Design Value |
|---|---|
| Dual-mode ET/APT operation | Single IC supports both high-efficiency envelope tracking and static APT, eliminating need for separate modulators or LDOs |
| Integrated synchronous rectification | Eliminates external Schottky diodes; reduces conduction loss and improves boost efficiency to 90% typical |
| PFM mode at light load | Automatically engages during low-TX-power states to cut quiescent current and extend battery life |
| Boost bypass function | 150-mΩ internal switch enables near-lossless pass-through when VIN > VOUT requirement |
| MIPI RFFE 1.1 compliance | Standardized register map and timing allow seamless integration with baseband/RFFE-aware SoCs and RFICs |
Applications
| Smartphone LTE Transmitter | Tablet 4G Front-End Module |
|---|---|
Use Scenario: LTE Band 1/3/7/40 uplink transmission with dynamic power ramping and multi-carrier aggregation. IC Role / Device Role / Timing Role: RF envelope supply modulator generating time-synchronized VCC_PA voltage under MIPI RFFE command. Use Value: Enables >30% improvement in PA system efficiency versus fixed-supply architectures by reducing average PA collector/drain voltage swing. | Use Scenario: High-data-rate TDD-LTE uplink in fan-out wafer-level packaged (FO-WLP) RF front-end modules. IC Role / Device Role / Timing Role: Dual-output power manager delivering independent ET and APT rails to MBMM and SB PA dies on same substrate. Use Value: Reduces thermal density and PCB area vs. discrete boost + LDO solutions while maintaining <100 ns envelope fidelity. |
| Mobile Hotspot Baseband | IoT Cellular Gateway |
Use Scenario: Simultaneous 3G WCDMA and LTE FDD operation requiring fast mode-switching between legacy and modern air interfaces. IC Role / Device Role / Timing Role: Programmable envelope modulator supporting both UMTS HSPA+ and LTE Cat-4 with shared RFFE control bus. Use Value: Eliminates need for dual-PMIC designs; single LM3290TMX/NOPB handles all PA supply requirements across air interface generations. | Use Scenario: Low-duty-cycle NB-IoT or LTE-M uplink bursts in thermally constrained industrial gateways. IC Role / Device Role / Timing Role: APT-only supply controller operating in PFM mode to minimize idle current draw during long receive intervals. Use Value: Achieves <15 µA quiescent current in standby, extending battery life beyond 5 years in sealed deployments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar RF envelope modulator applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LM3290TME/NOPB | Same silicon die and functionality; differs only in tape-and-reel packaging (250-unit reel vs. 3,000-unit reel) | Identical electrical and thermal performance; suitable for identical RF front-end designs | Select based on production volume and assembly line feed requirements |
| MAX2375ETJ+ | Discrete envelope modulator + external boost; no integrated RFFE interface or PFM mode | Requires external microcontroller for envelope generation and SPI configuration; higher BOM count | Consider only when legacy design reuse or non-MIPI control infrastructure exists |
Compared with LM3290TME/NOPB, the LM3290TMX/NOPB offers identical performance in a smaller-volume tape-and-reel format ideal for prototyping and low-volume production; versus MAX2375ETJ+, it delivers full MIPI RFFE integration, lower component count, and automatic PFM/ET/APT mode management without firmware overhead.
Availability
LM3290TMX/NOPB is available at Aetrix Electronics and suitable for smartphone LTE transmitters, tablet 4G front-end modules, and IoT cellular gateways requiring stable component supply, consistent DSBGA-30 packaging, and MIPI RFFE 1.1–compliant envelope modulation.
Supply support for LM3290TMX/NOPB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company specializing in analog, embedded processing, and wireless connectivity technologies, with leadership in power management and RF solutions for mobile and industrial markets.
The LM3290TMX/NOPB belongs to TI's RF power management product line, engineered specifically for envelope tracking and average power tracking in 3G/4G/LTE mobile transmitters to maximize PA efficiency while minimizing thermal and board-area constraints.
FAQ
What is the primary function of the LM3290TMX/NOPB in an RF power amplifier system?
The LM3290TMX/NOPB serves as an integrated RF envelope supply modulator that dynamically adjusts the PA supply voltage in real time to match the RF signal envelope-enabling envelope tracking (ET) mode-or delivers a programmable static voltage for average power tracking (APT) mode. Its dual-path architecture, MIPI RFFE 1.1 interface, and internal synchronous boost converter make LM3290TMX/NOPB essential for maximizing efficiency in 3G/4G/LTE transmitter stages without external controllers or discrete power stages.
Does the LM3290TMX/NOPB require an external companion IC to operate in envelope tracking mode?
Yes-the LM3290TMX/NOPB requires the LM3291 companion IC to operate in full envelope tracking mode. The LM3291 conditions and delivers the differential analog envelope reference signal (REFP/REFN) to LM3290TMX/NOPB, which then generates the high-bandwidth VOUT_ET supply. While LM3290TMX/NOPB can operate standalone in APT mode, ET functionality depends on this paired architecture per TI's reference design and datasheet specification.
What package type and dimensions does the LM3290TMX/NOPB use, and is it compatible with standard DSBGA assembly processes?
The LM3290TMX/NOPB uses a DSBGA-30 (YFQ) package measuring 2.432 mm × 2.808 mm with 0.4-mm ball pitch. It is fully compatible with standard DSBGA reflow profiles, including MSL Level-1 handling and peak reflow up to 260°C. The part marking "3290" appears on the top surface, and the pin-1 quadrant is Q1 per TI's tape-and-reel specification-ensuring reliable automated placement and soldering in high-volume mobile PCB assembly lines.
Can the LM3290TMX/NOPB operate from a 2.5-V input supply, and what is its minimum functional input voltage?
Yes-the LM3290TMX/NOPB is explicitly rated for 2.5 V to 5 V input operation, making it suitable for direct connection to partially discharged Li-ion batteries. Its minimum functional input voltage is 2.5 V across the full temperature range (–30°C to +85°C), and it maintains regulated ET output down to 0.6 V and APT output down to 0.4 V even at this rail. This ensures uninterrupted PA supply during deep battery discharge in smartphones and portable hotspots.
How does the LM3290TMX/NOPB manage power efficiency during low-transmit-power conditions?
The LM3290TMX/NOPB automatically enters Pulse Frequency Modulation (PFM) mode during light-load APT operation, reducing switching frequency and quiescent current to extend battery life. In PFM mode, LM3290TMX/NOPB maintains regulation while drawing <15 µA typical supply current-critical for IoT and standby scenarios. This behavior is fully autonomous and requires no host intervention or register writes, unlike many competing modulators that demand firmware-controlled sleep entry.
LM3290TMX/NOPB Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- 30-WFBGA, DSBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Function:
- -
- LO Frequency:
- -
- RF Frequency:
- -
- P1dB:
- -
- Noise Floor:
- -
- Output Power:
- -
- Current - Supply:
- -
- Voltage - Supply:
- -
- Test Frequency:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 30-DSBGA
LM3290TMX/NOPB FAQ
1.How can I place an order for LM3290TMX/NOPB through Aetrix?
Please submit a Request for Quotation (RFQ) for LM3290TMX/NOPB on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LM3290TMX/NOPB reliable?
The price and inventory of LM3290TMX/NOPB are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LM3290TMX/NOPB is usually 5 days.
3.What payment methods are accepted for LM3290TMX/NOPB?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LM3290TMX/NOPB transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LM3290TMX/NOPB?
LM3290TMX/NOPB orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LM3290TMX/NOPB order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LM3290TMX/NOPB?
For technical support, including LM3290TMX/NOPB datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LM3290TMX/NOPB requirements.
6.How does Aetrix verify that LM3290TMX/NOPB is sourced from the original manufacturer or authorized distributors?
All LM3290TMX/NOPB products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LM3290TMX/NOPB meets industry standards.
7.What is the process for return or replacement of LM3290TMX/NOPB?
All LM3290TMX/NOPB units undergo pre-shipment inspection (PSI). If there is an issue with LM3290TMX/NOPB, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LM3290TMX/NOPB part is unused and in its original packaging.
Return procedure for LM3290TMX/NOPB:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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