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Texas Instruments LM3291TME/NOPB
- Part No.:
- LM3291TME/NOPB
- Manufacturer:
- Texas Instruments
- Category:
- RF Modulators
- Package:
- 12-WFBGA, DSBGA
- Datasheet:
-
LM3291TME/NOPB.pdf
- Description:
- RF MODULATOR 12WFBGA/DSBGA
- Quantity:
- Payment:
- Shipping:
Inventory:400
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Product details
Overview
LM3291TME/NOPB from Texas Instruments is a high-speed linear amplifier designed as the output stage of an envelope modulator in 3G/4G LTE envelope tracking (ET) systems. It delivers dynamic supply voltage to power amplifiers with >75 MHz small-signal bandwidth, extremely low output impedance, and differential analog input compatible with MIPI eTrak 1.0. It operates from 2.5V to 5V and supports up to 20 MHz signal bandwidth in handsets and data cards.
For engineers reviewing the LM3291TME/NOPB datasheet, LM3291TME/NOPB pinout, LM3291TME/NOPB application, or LM3291TME/NOPB equivalent, key selection criteria include its role in ET/APT mode switching, low-noise linear amplification, MIPI RFFE 1.1 interface dependency on LM3290, and DSBGA-12 package constraints for RF front-end integration.
Technical Context
The LM3291TME/NOPB functions exclusively as the high-current linear output amplifier in a two-chip envelope modulator solution with LM3290. It receives a differential envelope reference signal from an RFIC via MIPI RFFE 1.1 and generates a single-ended dynamic PA supply voltage. Its operation is fully controlled by LM3290 - no external configuration pins or registers exist.
In ET mode, LM3291TME/NOPB tracks the RF envelope in real time to maximize EM+PA efficiency; in APT mode at low TX power, it enters shutdown under LM3290 command. Its linearity, bandwidth (>75 MHz), and low output noise are optimized for LTE signals up to 20 MHz bandwidth.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Small-signal bandwidth | >75 MHz typical - enables faithful reproduction of LTE envelope waveforms up to 20 MHz signal bandwidth |
| Output impedance | Extremely low - minimizes voltage droop under fast transient PA current demands |
| Input interface | Differential analog, MIPI eTrak 1.0–compatible - requires companion LM3290 for signal conditioning and control |
| Supply voltage range | 2.5 V to 5 V - matches battery and intermediate rail voltages in mobile RF front ends |
| Operating temperature | –30°C to +85°C - qualified for consumer handheld and mobile broadband applications |
| Package | 12-pin DSBGA (YFQ) - 1.6 mm × 1.6 mm, 0.4 mm pitch, lead-free SNAGCU finish, MSL Level-1 |
Pinout & Package
The LM3291TME/NOPB is housed in a 12-pin lead-free DSBGA (YFQ) package with 0.4 mm pitch and 1.6 mm × 1.6 mm footprint. Ball mapping is defined in TI's official LM3291 datasheet (SNVSA12).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VIN+ | Differential input positive | Accepts envelope reference signal from LM3290; must be routed differentially with matched length and impedance |
| VIN− | Differential input negative | Completes differential pair; common-mode rejection critical for noise immunity in RF environment |
| VOUT | Amplified output | Single-ended dynamic supply rail delivered to PA collector/drain; low-impedance path required to ground plane |
| VCC | Power supply input | 2.5 V to 5 V analog supply; requires local 1-µF ceramic decoupling adjacent to ball |
| GND | Ground reference | Four dedicated ground balls - must be connected to solid internal ground plane for EMI suppression |
| EN | Enable control input | Driven by LM3290; high = active, low = shutdown (APT mode); no pull-up/pull-down required |
Key Features
| Feature | Design Value |
|---|---|
| High linearity over wide bandwidth | Preserves envelope fidelity across 3G/LTE modulation schemes without distortion-induced spectral regrowth |
| Low output noise | Minimizes noise coupling into PA supply rail, preventing degradation of adjacent-channel leakage ratio (ACLR) |
| Automated mode control via LM3290 | Eliminates need for external GPIO or firmware logic to switch between ET and APT operating modes |
| Differential input compatibility | Enables robust envelope signal reception in noisy RF sections using standard PCB-level differential routing practices |
Applications
| Smartphone Transmitter Chain | Tablet LTE Front End |
|---|---|
Use Scenario: LTE Band 1/3/7/40 uplink transmission in compact smartphone PCB with tight thermal and space constraints. IC Role / Device Role / Timing Role: LM3291TME/NOPB serves as the final-stage envelope-tracking power supply amplifier, dynamically biasing the MBMM PA under control of LM3290 and RFIC. Use Value: Enables >25% improvement in average PA efficiency versus fixed-supply operation, extending battery life per transmit cycle. | Use Scenario: High-data-rate LTE-A Cat.6/7 uplink in dual-SIM tablet with coexistence-sensitive RF layout. IC Role / Device Role / Timing Role: LM3291TME/NOPB provides low-noise, fast-response envelope supply to SB PA while rejecting digital noise from application processor via differential input. Use Value: Maintains ACLR < –50 dBc under 20-MHz LTE signals, meeting 3GPP conformance requirements without additional filtering. |
| Mobile Hotspot Modem | Wireless CPE Uplink |
Use Scenario: 4G LTE data card operating in high-temperature ambient (60°C+) with continuous uplink traffic. IC Role / Device Role / Timing Role: LM3291TME/NOPB operates in ET mode during peak transmit, then transitions to shutdown (APT) during low-power idle bursts under LM3290 coordination. Use Value: Reduces average system power consumption by 30–40% compared to always-on linear regulator solutions. | Use Scenario: Outdoor customer premises equipment with extended-range LTE uplink requiring stable PA supply under voltage sag. IC Role / Device Role / Timing Role: LM3291TME/NOPB delivers regulated, low-impedance envelope supply to high-efficiency GaAs PA despite 10% input rail variation. Use Value: Sustains PA linearity and output power stability across full battery discharge curve (4.2 V → 3.4 V). |
Equivalent & Alternatives
The following parts are listed as comparable options for similar envelope modulator amplifier applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LM3291TME | Same die, non-lead-free SnPb ball finish, obsolete status, not RoHS compliant | Restricted to legacy industrial or non-RoHS-compliant designs; incompatible with modern assembly processes | Select LM3291TME/NOPB for new designs requiring RoHS compliance and lead-free reflow |
| LM3290TME/NOPB | Companion IC - digital controller with RFFE interface; not functionally substitutable for LM3291TME/NOPB | Must be used together with LM3291TME/NOPB; cannot replace its analog output stage function | LM3290TME/NOPB is mandatory for system-level envelope modulation but does not replace LM3291TME/NOPB |
Compared with LM3291TME and LM3290TME/NOPB, the LM3291TME/NOPB uniquely provides RoHS-compliant, high-bandwidth linear amplification in a miniature DSBGA package - essential for next-generation mobile RF power management where both regulatory compliance and envelope fidelity are non-negotiable.
Availability
LM3291TME/NOPB is available at Aetrix Electronics and suitable for 3G/LTE handsets, mobile data cards, and wireless modems requiring stable component supply with full traceability and lifecycle support.
Supply support for LM3291TME/NOPB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, delivering analog and embedded processing solutions for industrial, automotive, and personal electronics markets.
The LM3291TME/NOPB belongs to TI's RF power management product line, engineered specifically to improve efficiency in envelope tracking architectures for 3G/LTE mobile transmitters.
FAQ
What is the primary function of the LM3291TME/NOPB in an RF transmitter?
The LM3291TME/NOPB serves as the high-current linear output amplifier in a two-chip envelope modulator system. It converts a differential envelope reference signal from the LM3290 into a single-ended dynamic supply voltage for 3G/4G power amplifiers. Its design enables real-time tracking of RF envelope waveforms to maximize PA efficiency in envelope tracking (ET) mode, and it shuts down under LM3290 control during low-power APT operation. The LM3291TME/NOPB itself contains no programmable registers or standalone control logic.
Does the LM3291TME/NOPB require external configuration or firmware support?
No, the LM3291TME/NOPB requires no external configuration, firmware, or register programming. All operational parameters-including ET/APT mode switching, gain, and enable timing-are fully controlled by the companion LM3290 via dedicated analog and control signals. The LM3291TME/NOPB has no I²C, SPI, or digital interface; its only inputs are VIN+, VIN−, VCC, GND, and EN. System integration relies entirely on correct interconnection with LM3290 and adherence to TI's layout guidelines.
Can the LM3291TME/NOPB be used without the LM3290?
No, the LM3291TME/NOPB cannot operate independently of the LM3290. It lacks internal envelope generation, digital interface, or control logic. The LM3290 provides the differential envelope reference signal, enables/disables LM3291TME/NOPB, and manages mode transitions between ET and APT. TI documentation explicitly states the two devices constitute a complete envelope modulator solution - LM3291TME/NOPB is not specified or characterized for standalone use.
What package type and mounting considerations apply to the LM3291TME/NOPB?
The LM3291TME/NOPB uses a 12-pin DSBGA (YFQ) package measuring 1.6 mm × 1.6 mm with 0.4 mm pitch and SNAGCU ball finish. It carries MSL Level-1 rating (unlimited floor life), permitting standard SMT assembly without dry-pack or baking. Critical layout requirements include symmetric differential routing for VIN+/VIN−, solid ground plane connection to all four GND balls, and localized 1-µF ceramic decoupling at VCC. Thermal vias under the exposed die pad are recommended for sustained high-current operation.
Is the LM3291TME/NOPB suitable for 5G NR or sub-6 GHz applications?
No, the LM3291TME/NOPB is not characterized or specified for 5G NR applications. Its datasheet confirms support only for 3G and LTE signals up to 20 MHz bandwidth and cites MIPI eTrak 1.0 and RFFE 1.1 standards - both predate 5G NR requirements. TI's product brief and application notes exclusively reference 3G/LTE handset, tablet, and modem use cases. For 5G envelope tracking, newer solutions such as the LMX2594-based or integrated RFPMUs should be evaluated instead of LM3291TME/NOPB.
LM3291TME/NOPB Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- 12-WFBGA, DSBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Not For New Designs
- Function:
- Modulator
- LO Frequency:
- -
- RF Frequency:
- -
- P1dB:
- -
- Noise Floor:
- -
- Output Power:
- -
- Current - Supply:
- -
- Voltage - Supply:
- -
- Test Frequency:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 12-DSBGA (1.64x1.24)
LM3291TME/NOPB FAQ
1.How can I place an order for LM3291TME/NOPB through Aetrix?
Please submit a Request for Quotation (RFQ) for LM3291TME/NOPB on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LM3291TME/NOPB reliable?
The price and inventory of LM3291TME/NOPB are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LM3291TME/NOPB is usually 5 days.
3.What payment methods are accepted for LM3291TME/NOPB?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LM3291TME/NOPB transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LM3291TME/NOPB?
LM3291TME/NOPB orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LM3291TME/NOPB order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LM3291TME/NOPB?
For technical support, including LM3291TME/NOPB datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LM3291TME/NOPB requirements.
6.How does Aetrix verify that LM3291TME/NOPB is sourced from the original manufacturer or authorized distributors?
All LM3291TME/NOPB products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LM3291TME/NOPB meets industry standards.
7.What is the process for return or replacement of LM3291TME/NOPB?
All LM3291TME/NOPB units undergo pre-shipment inspection (PSI). If there is an issue with LM3291TME/NOPB, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LM3291TME/NOPB part is unused and in its original packaging.
Return procedure for LM3291TME/NOPB:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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