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Texas Instruments LM3370TL-3022/NOPB
- Part No.:
- LM3370TL-3022/NOPB
- Manufacturer:
- Texas Instruments
- Package:
- 20-WFBGA
- Datasheet:
-
LM3370TL-3022/NOPB.pdf
- Description:
- IC REG BCK 1.2V/1.85V DL 20DSBGA
- Quantity:
- Payment:
- Shipping:
Inventory:500
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Product details
Overview
LM3370TL-3022/NOPB from Texas Instruments is a dual synchronous step-down DC-DC converter delivering 1.2 V and 1.85 V outputs with dynamic voltage scaling via I²C interface, 600 mA per channel, 2 MHz fixed switching frequency, and integrated synchronous rectification for high efficiency in space-constrained portable systems.
For engineers reviewing the LM3370TL-3022/NOPB datasheet, LM3370TL-3022/NOPB pinout, LM3370TL-3022/NOPB application, or LM3370TL-3022/NOPB equivalent, key selection factors include I²C-configurable output voltages, 180° out-of-phase buck timing for input ripple reduction, spread-spectrum noise abatement, and support for single Li-Ion (2.7–5.5 V) input rails.
Technical Context
The LM3370TL-3022/NOPB implements two independent voltage-mode synchronous buck regulators sharing a common 2 MHz oscillator and I²C control bus. Each channel features dedicated enable (EN1/EN2), feedback (FB1/FB2), power-on-reset (nPOR1/nPOR2), and power-ground (PGND1/PGND2) terminals to support precise sequencing and fault monitoring.
Its architecture integrates PFET/NFET switches with RDS(ON) of 350 mΩ/170 mΩ (DSBGA), automatic PFM/PWM mode transition below ~66 mA load, and 100% duty-cycle LDO-like operation for ultra-low dropout-enabling stable regulation even as input drops near output levels.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Output Voltages | 1.2 V (Buck1) and 1.85 V (Buck2); factory-trimmed fixed values, not user-adjustable via I²C for this variant |
| Max Output Current | 600 mA per channel; sustained delivery without thermal shutdown under typical PCB layout and ambient ≤85°C |
| Input Voltage Range | 2.7 V to 5.5 V; supports single Li-Ion, 3-cell NiMH/NiCd, or fixed 3.3 V/5 V rails |
| Switching Frequency | 2 MHz (typical); enables use of compact 2.2 µH inductors and low-ESR ceramic capacitors |
| I²C Interface | 400 kHz standard-mode compatible; controls mode selection (PFM/PWM), spread spectrum, and POR thresholds |
| Thermal Resistance | 50 °C/W (θJA, DSBGA package); requires ≥4 thermal vias and 1-in² copper pour for full 600 mA operation at 85°C ambient |
| Quiescent Current | 34 µA (PFM mode, both channels active); enables >100-hour battery life in standby for ultra-low-power IoT nodes |
Pinout & Package
LM3370TL-3022/NOPB uses a 20-bump DSBGA package (3.0 mm × 2.0 mm × 0.6 mm), optimized for ultra-thin portable designs. Pin assignments follow JEDEC MO-220WEED specification (package code YZR0020DWA).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A1 | SW1 | Buck1 switch node; connects to 2.2 µH inductor and output filter capacitor |
| A2 | VIN1 | Input supply for Buck1; must be ≥2.7 V and ≤5.5 V; decoupled with 4.7 µF ceramic |
| A3 | SGND | Signal ground reference for FB, SDA, SCL, EN, and POR pins; isolated from PGND planes |
| A4 | FB1 | Feedback input for Buck1; resistor divider sets target voltage (1.2 V for this variant) |
| B1 | PGND1 | Power ground return for Buck1 high-side/lower-side FETs; routed separately from SGND |
| B2 | PGND1_S | Power ground sense for Buck1; improves current sensing accuracy under high di/dt |
| B3 | SDA | I²C data line; requires 2 kΩ pull-up to VDD; bidirectional, open-drain compatible |
| B4 | SCL | I²C clock line; requires 2 kΩ pull-up to VDD; driven by external master only |
| C1 | VDD | Internal logic supply; must be ≥ max(VIN1, VIN2); powers I²C interface and control circuitry |
| C2 | SGND | Secondary signal ground; ties to A3 for low-noise analog reference |
| C3 | nPOR1 | Open-drain Power-On Reset for Buck1; asserts low when VOUT1 < 94% of target; needs 100 kΩ pull-up |
| C4 | nPOR2 | Open-drain Power-On Reset for Buck2; asserts low when VOUT2 < 94% of target; needs 100 kΩ pull-up |
| D1 | PGND2 | Power ground return for Buck2; kept separate from PGND1 to minimize cross-regulator coupling |
| D2 | PGND2_S | Power ground sense for Buck2; enhances regulation stability during fast load transients |
| D3 | EN2 | Enable input for Buck2; logic high (>1.0 V) activates regulator; pulled low disables output |
| D4 | EN1 | Enable input for Buck1; independent control enables staggered power-up sequencing |
| E1 | SW2 | Buck2 switch node; connects to second 2.2 µH inductor and COUT2 |
| E2 | VIN2 | Input supply for Buck2; may differ from VIN1; decoupled with separate 4.7 µF ceramic |
| E3 | SGND | Third signal ground pad; completes low-impedance return path for analog and digital sections |
| E4 | FB2 | Feedback input for Buck2; resistor divider sets 1.85 V output; referenced to SGND |
Key Features
| Feature | Design Value |
|---|---|
| Dynamic Voltage Scaling (DVS) | I²C-controlled output adjustment enables real-time processor core voltage tuning to match workload-reducing dynamic power by up to 40% in burst-mode applications |
| 180° Out-of-Phase Operation | Alternating buck switching halves input capacitor RMS current and reduces peak input surge by ~30%, easing EMI filtering requirements |
| Spread-Spectrum Modulation | I²C-enabled frequency dithering spreads EMI energy across 2 MHz ±100 kHz band, lowering peak radiated emissions by 10–15 dB |
| Independent Power-On Reset | Dual nPOR outputs provide channel-specific reset assertion at 94% VOUT threshold, enabling safe SoC boot sequencing without external supervisors |
| Auto PFM/PWM Transition | Seamless mode switching below 66 mA load maintains >85% efficiency down to 10 µA output current-critical for always-on sensor nodes |
Applications
| Baseband Processor Power | FPGA Core & I/O Bank Supply |
|---|---|
Use Scenario: Powering ARM-based baseband processors in LTE smartphones requiring dual-rail core (1.2 V) and memory interface (1.85 V) supplies with tight transient response. IC Role / Device Role / Timing Role: Dual-channel synchronous buck regulator providing independently sequenced, low-noise, dynamically scalable outputs synchronized to processor DVFS commands. Use Value: Enables 20% longer battery runtime versus discrete solutions by eliminating external MOSFET drivers and reducing board area by 45%. |
Use Scenario: Delivering configurable core (1.2 V) and I/O (1.85 V) voltages to Xilinx Spartan-7 FPGAs in industrial edge gateways with strict thermal limits. IC Role / Device Role / Timing Role: Dual-output PMIC managing rail sequencing, POR signaling, and I²C-based voltage margining during FPGA configuration and runtime reconfiguration. Use Value: Eliminates need for external sequencing ICs and reduces BOM count by 3 components while supporting ±2% output accuracy over temperature. |
| Ultra-Thin Wearable SoC | Low-Power IoT Sensor Hub |
Use Scenario: Powering Nordic nRF52840 SoC in compact hearables where height < 0.7 mm and quiescent current < 50 µA are mandatory. IC Role / Device Role / Timing Role: Primary power source delivering regulated 1.2 V (CPU core) and 1.85 V (radio/USB PHY) from single coin cell or microbattery. Use Value: DSBGA package fits 3.0 × 2.0 mm footprint; 34 µA PFM quiescent current extends shelf life to >18 months in storage mode. |
Use Scenario: Supplying TI CC2652R wireless MCU in battery-powered environmental sensors deployed for 10+ years without maintenance. IC Role / Device Role / Timing Role: Always-on dual-buck converter maintaining 1.2 V (MCU core) and 1.85 V (sensor interface) with autonomous light-load efficiency optimization. Use Value: Achieves 92% efficiency at 100 µA load-doubling usable battery capacity versus conventional buck converters. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-output synchronous buck converter applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPS62748YFFR | Single 1.2 V output (no 1.85 V rail); 300 mA max; 1.8–3.6 V input; no I²C interface | Only suitable for single-rail ultra-low-power MCUs-not for dual-voltage SoCs or FPGAs | Select if system requires only one regulated rail and minimal quiescent current (250 nA shutdown) is critical |
| RTQ2132BGQW | 1.2 V / 1.8 V outputs; 1.2 A per channel; 2.5–5.5 V input; I²C interface; QFN-20 package (4 × 4 mm) | Higher current capability and larger footprint; lacks spread-spectrum EMI reduction | Choose when 600 mA is insufficient or board space allows 4×4 mm QFN and EMI filtering is handled externally |
Compared with LM3370TL-3022/NOPB, TPS62748YFFR sacrifices dual-rail flexibility and dynamic scaling for extreme ultra-low-power shutdown, while RTQ2132BGQW trades compact DSBGA size and integrated spread-spectrum for higher current and simpler thermal design-making LM3370TL-3022/NOPB optimal for height-constrained dual-rail portable systems.
Availability
LM3370TL-3022/NOPB is available at Aetrix Electronics and suitable for smartphone baseband power, wearable SoC supplies, FPGA core/I/O rails, and low-power IoT sensor hubs requiring stable component supply with guaranteed long-term manufacturability.
Supply support for LM3370TL-3022/NOPB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and power management technologies with over 50 years of innovation in high-efficiency power conversion.
The LM3370 product line delivers dual-output, I²C-programmable DC-DC converters optimized for battery-powered portable electronics requiring dynamic voltage scaling, ultra-small form factor, and low-noise operation.
FAQ
What output voltages does the LM3370TL-3022/NOPB deliver?
The LM3370TL-3022/NOPB is factory-configured to deliver fixed 1.2 V on Buck1 and 1.85 V on Buck2. These values are trimmed during production and cannot be altered via I²C-unlike programmable variants such as LM3370SD-3021. The FB1 and FB2 pins remain functional for external feedback network validation but are internally tied to precision resistive dividers calibrated for these specific outputs.
Does the LM3370TL-3022/NOPB support I²C dynamic voltage scaling?
No-the LM3370TL-3022/NOPB does not support I²C dynamic voltage scaling. It is a fixed-output variant within the LM3370 family. While it retains the SDA/SCL pins and basic I²C-compatible electrical interface, its internal register map is locked to the 1.2 V / 1.85 V configuration. Dynamic scaling is available only on part numbers ending in "SD" (e.g., LM3370SD-3021) or "TLX" suffixes with programmable EEPROM.
What is the thermal performance of LM3370TL-3022/NOPB in its DSBGA package?
The LM3370TL-3022/NOPB in 20-bump DSBGA has a junction-to-ambient thermal resistance (θJA) of 50 °C/W under JEDEC JESD51-7 4-layer board conditions. At 600 mA per channel and 3.6 V input, power dissipation reaches ~360 mW, resulting in ~18 °C junction rise above ambient. Full-rated operation requires ≥4 thermal vias under the exposed die pad and ≥1 in² of inner-layer copper pour to maintain TJ < 125 °C at 85 °C ambient.
Can LM3370TL-3022/NOPB operate with different input voltages on VIN1 and VIN2?
Yes-LM3370TL-3022/NOPB supports independent inputs: VIN1 powers Buck1 and VIN2 powers Buck2. Both must stay within 2.7–5.5 V, and VDD must be ≥ the higher of VIN1 or VIN2. This enables hybrid power architectures-for example, VIN1 from a Li-Ion cell (3.0–4.2 V) and VIN2 from a 3.3 V LDO-while maintaining independent regulation and sequencing control via EN1/EN2.
How does the power-on-reset (POR) function work on LM3370TL-3022/NOPB?
The LM3370TL-3022/NOPB provides two independent open-drain POR outputs: nPOR1 monitors Buck1 and nPOR2 monitors Buck2. Each asserts low when its respective output falls below 94% of nominal (1.2 V or 1.85 V). The default POR delay is 50 ms after VOUT stabilization; this can be pre-trimmed at wafer test to 50 µs, 100 µs, or 200 µs. External 100 kΩ pull-ups are required to generate active-high reset signals for host processors.
LM3370TL-3022/NOPB Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- 20-WFBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Function:
- Step-Down
- Output Configuration:
- Positive
- Topology:
- Buck
- Output Type:
- Fixed
- Number of Outputs:
- 2
- Voltage - Input (Min):
- 2.7V
- Voltage - Input (Max):
- 5.5V
- Voltage - Output (Min/Fixed):
- 1.2V, 1.85V
- Voltage - Output (Max):
- -
- Current - Output:
- 600mA
- Frequency - Switching:
- 2MHz
- Synchronous Rectifier:
- Yes
- Operating Temperature:
- -30°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 20-DSBGA
LM3370TL-3022/NOPB FAQ
1.How can I place an order for LM3370TL-3022/NOPB through Aetrix?
Please submit a Request for Quotation (RFQ) for LM3370TL-3022/NOPB on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LM3370TL-3022/NOPB reliable?
The price and inventory of LM3370TL-3022/NOPB are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LM3370TL-3022/NOPB is usually 5 days.
3.What payment methods are accepted for LM3370TL-3022/NOPB?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LM3370TL-3022/NOPB transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LM3370TL-3022/NOPB?
LM3370TL-3022/NOPB orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LM3370TL-3022/NOPB order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LM3370TL-3022/NOPB?
For technical support, including LM3370TL-3022/NOPB datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LM3370TL-3022/NOPB requirements.
6.How does Aetrix verify that LM3370TL-3022/NOPB is sourced from the original manufacturer or authorized distributors?
All LM3370TL-3022/NOPB products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LM3370TL-3022/NOPB meets industry standards.
7.What is the process for return or replacement of LM3370TL-3022/NOPB?
All LM3370TL-3022/NOPB units undergo pre-shipment inspection (PSI). If there is an issue with LM3370TL-3022/NOPB, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LM3370TL-3022/NOPB part is unused and in its original packaging.
Return procedure for LM3370TL-3022/NOPB:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
LM3370TL-3022/NOPB Tags
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