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Texas Instruments LM3370TLX-3006/NOPB
- Part No.:
- LM3370TLX-3006/NOPB
- Manufacturer:
- Texas Instruments
- Package:
- 20-WFBGA
- Datasheet:
-
LM3370TLX-3006/NOPB.pdf
- Description:
- IC REG BUCK 1.2V/1.8V DL 20DSBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,729
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Product details
Overview
LM3370TLX-3006/NOPB from Texas Instruments is a dual synchronous step-down DC-DC converter delivering 600 mA per channel with dynamically programmable outputs of 1.2 V (VOUT1) and 1.8 V (VOUT2) via I²C interface, operating from 2.7 V to 5.5 V input, and optimized for baseband and application processor core/I/O power in portable systems.
For engineers reviewing the LM3370TLX-3006/NOPB datasheet, LM3370TLX-3006/NOPB pinout, LM3370TLX-3006/NOPB application, or LM3370TLX-3006/NOPB equivalent, key selection considerations include I²C-controlled dynamic voltage scaling, 2 MHz fixed-frequency PWM operation with automatic PFM/PWM mode switching, spread-spectrum noise reduction, and 180° out-of-phase buck timing for reduced input ripple.
Technical Context
The LM3370TLX-3006/NOPB implements two independent voltage-mode synchronous buck regulators with internal PFET/NFET switches, supporting 100% duty-cycle LDO-like operation for ultra-low dropout. Each channel features dedicated EN, FB, nPOR, and power-ground pins enabling precise sequencing and monitoring.
Its I²C-compatible interface (400 kHz max) controls output voltage (VOUT1: 1.0–2.0 V in 50 mV steps; VOUT2: 1.8–3.3 V in 100 mV steps), mode selection (auto PFM/PWM or forced PWM), and spread-spectrum modulation-functions mapped to specific register addresses and validated for this DSBGA variant.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Output Voltage Set | VOUT1 = 1.2 V, VOUT2 = 1.8 V - factory-trimmed fixed outputs, configurable via I²C to adjacent 50/100 mV steps |
| Max Output Current | 600 mA per channel - supports sustained full-load operation with thermal derating on 4-layer board (θJA = 50°C/W) |
| Input Voltage Range | 2.7 V to 5.5 V - compatible with single Li-ion, 3-cell NiMH/NiCd, or fixed 3.3 V/5 V rails |
| Switching Frequency | 2.0 MHz (typ.) - enables use of compact 2.2 µH inductors and low-ESR ceramic capacitors |
| I²C Interface | 400 kHz standard-mode - supports dynamic voltage scaling, mode control, and spread-spectrum enable/disable |
| Efficiency (Typ.) | 90%+ at 400 mA, VIN = 3.6 V - achieved via internal synchronous rectification and low RDS(on) PFET/NFET (350/170 mΩ DSBGA) |
| Power-On Reset | nPOR1/nPOR2 open-drain outputs - assert low when respective VOUT falls below 85% (default) or 70%/94% (trimmable) of target |
Pinout & Package
LM3370TLX-3006/NOPB uses a 20-bump DSBGA package (3.0 mm × 2.0 mm × 0.6 mm), optimized for space-constrained portable designs. Pin assignments follow JEDEC MO-220WEED specification (package code YZR0020DWA).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A1 | SW1 | Buck 1 switch node - connects to external 2.2 µH inductor and high-frequency output capacitor |
| A2 | VIN1 | Buck 1 input supply - accepts 2.7–5.5 V; must be ≥ VOUT1 + 1 V for stable regulation |
| A3 | SGND | Signal ground reference - isolated from power grounds to minimize noise coupling into feedback paths |
| A4 | FB1 | Buck 1 feedback input - senses VOUT1 via resistor divider; sets regulated output with ±3.5% accuracy |
| B1 | PGND1 | Buck 1 power ground - return path for high-current switch node; requires low-inductance PCB connection |
| B2 | PGND1_S | Buck 1 power ground sense - Kelvin connection for accurate current sensing and improved load regulation |
| B3 | SDA | I²C data line - bidirectional, requires 2 kΩ pull-up; supports dynamic voltage scaling and feature control |
| B4 | SCL | I²C clock line - input-only, requires 2 kΩ pull-up; synchronizes register reads/writes at ≤400 kHz |
| C1 | VDD | Internal logic supply - must be ≥ max(VIN1, VIN2); powers control circuitry and I²C interface |
| C2 | SGND | Signal ground (duplicate) - ensures robust grounding for analog and digital sections |
| C3 | nPOR1 | Open-drain Buck 1 reset - pulls low during startup until VOUT1 reaches 85% of 1.2 V target; requires 100 kΩ pull-up |
| C4 | nPOR2 | Open-drain Buck 2 reset - same behavior as nPOR1 but for 1.8 V output; independent sequencing capability |
| D1 | PGND2 | Buck 2 power ground - return path for second high-current switch node |
| D2 | PGND2_S | Buck 2 power ground sense - Kelvin connection for Buck 2 current sensing and regulation stability |
| D3 | EN2 | Buck 2 enable - active-high logic input; controls startup/shutdown timing independently of Buck 1 |
| D4 | EN1 | Buck 1 enable - active-high logic input; allows flexible power sequencing with nPOR1/nPOR2 monitoring |
| E1 | SW2 | Buck 2 switch node - connects to second 2.2 µH inductor and output capacitor |
| E2 | VIN2 | Buck 2 input supply - independent of VIN1; supports dual-rail input architectures |
| E3 | SGND | Signal ground (third instance) - maintains low-noise reference across die |
| E4 | FB2 | Buck 2 feedback input - senses VOUT2; sets 1.8 V with same ±3.5% tolerance as FB1 |
Key Features
| Feature | Design Value |
|---|---|
| I²C-controlled dynamic voltage scaling | Enables real-time adjustment of VOUT1 (1.0–2.0 V) and VOUT2 (1.8–3.3 V) to match processor performance states, reducing system power by >30% during idle |
| Automatic PFM/PWM mode switching | Maintains >85% efficiency down to 1 mA load via pulse-frequency modulation, while delivering >90% at 400 mA in PWM mode |
| 180° out-of-phase buck timing | Reduces peak input current ripple by ~70% versus in-phase operation, relaxing input capacitor sizing requirements |
| Spread-spectrum modulation | Lowers peak EMI by up to 10 dB across 2–20 MHz band without external filtering components |
| Independent power-on-reset outputs | nPOR1 and nPOR2 provide sequenced, voltage-monitored reset signals for multi-rail SoCs without external supervisors |
| Internal soft-start | Prevents inrush current surges during startup by ramping output voltage over ~1 ms, eliminating need for external RC networks |
Applications
| Baseband Processor Core Power | Application Processor I/O Supply |
|---|---|
Use Scenario: Powers ARM-based baseband processors (e.g., Qualcomm MDM series) requiring tightly regulated 1.2 V core voltage with dynamic scaling during sleep/active modes. IC Role / Device Role / Timing Role: Dual-buck regulator providing independent, I²C-programmable VOUT1 (1.2 V) and VOUT2 (1.8 V) with synchronized 180° phase shift. Use Value: Enables DVFS-driven power savings up to 40% versus fixed-output converters; nPOR1 confirms stable 1.2 V before releasing processor reset. | Use Scenario: Supplies 1.8 V I/O banks for application processors (e.g., TI OMAP, NXP i.MX) interfacing with LPDDR, SDIO, and camera sensors. IC Role / Device Role / Timing Role: Second buck channel (VOUT2) delivers clean, low-noise 1.8 V with spread-spectrum EMI reduction enabled via I²C. Use Value: Meets stringent 10 mVpp ripple requirement for high-speed I/O interfaces; independent EN2 allows staggered I/O rail activation. |
| FPGA Core Voltage Scaling | Portable Audio Codec Power |
Use Scenario: Provides adaptive 1.2 V core supply to Xilinx Spartan-6 or Intel Cyclone IV FPGAs during partial reconfiguration and clock gating events. IC Role / Device Role / Timing Role: VOUT1 dynamically scaled via I²C to match FPGA logic utilization; 2 MHz switching avoids interference with JTAG and configuration clocks. Use Value: Reduces FPGA static power by 25% during low-activity states; soft-start prevents configuration errors during hot-plug scenarios. | Use Scenario: Powers stereo audio codecs (e.g., TI PCM3008) in Bluetooth headsets and wearables requiring ultra-low-noise 1.8 V analog supply. IC Role / Device Role / Timing Role: VOUT2 operates in forced PWM mode with spread-spectrum enabled to suppress switching noise in audio band (20 Hz–20 kHz). Use Value: Achieves <−80 dB THD+N by minimizing conducted EMI; PGND2_S pin enables precise ground isolation for analog section. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-buck DC-DC converter applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPS62400DRVR | Fixed 1.2 V/1.8 V outputs; no I²C interface; 3 MHz switching; 2.5 V–6.0 V input | Lacks dynamic voltage scaling; suited for cost-sensitive, static-voltage applications only | Select when I²C control is unnecessary and higher switching frequency is acceptable for smaller magnetics |
| RTQ2132BWGQW | 1.2 V/1.8 V preset; I²C-compatible; 2.5 MHz; integrated power-good indicators; 2.5 V–5.5 V input | Includes dedicated PGOOD pins instead of open-drain nPOR; no spread-spectrum support | Choose when system-level power-good signaling is required and EMI reduction is handled externally |
Compared with TPS62400DRVR and RTQ2132BWGQW, LM3370TLX-3006/NOPB uniquely combines factory-set 1.2 V/1.8 V outputs with full I²C programmability, spread-spectrum EMI suppression, and dual nPOR outputs-making it optimal for portable SoC power where dynamic scaling and noise control are critical.
Availability
LM3370TLX-3006/NOPB is available at Aetrix Electronics and suitable for portable computing, wireless communication modules, and embedded audio devices requiring stable component supply with guaranteed long-term availability.
Supply support for LM3370TLX-3006/NOPB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog and embedded processing technologies, with decades of expertise in power management ICs for portable and industrial applications.
The LM3370 product line delivers highly integrated, I²C-programmable dual-buck converters targeting battery-powered SoC platforms requiring dynamic voltage scaling, low EMI, and precise power sequencing.
FAQ
What output voltages are factory-configured for LM3370TLX-3006/NOPB?
The LM3370TLX-3006/NOPB is factory trimmed to deliver 1.2 V on VOUT1 and 1.8 V on VOUT2. These values are set at wafer test and verified per ordering option '3006'. While I²C allows adjustment to adjacent 50 mV (VOUT1) or 100 mV (VOUT2) steps, the default boot-up voltages remain fixed at 1.2 V and 1.8 V unless reprogrammed after power-on.
Does LM3370TLX-3006/NOPB support true 100% duty-cycle operation for low-dropout mode?
Yes, LM3370TLX-3006/NOPB supports 100% duty-cycle operation where the internal PFET remains fully on and the NFET is off, enabling LDO-like regulation. This occurs when VIN1 or VIN2 approaches VOUT1 or VOUT2, respectively. The minimum input voltage is calculated as VIN,MIN = ILOAD × (RDS(on)_PFET + RINDUCTOR) + VOUT, with RDS(on)_PFET = 350 mΩ (typ.) for the DSBGA package.
How does the spread-spectrum function reduce EMI in LM3370TLX-3006/NOPB?
The LM3370TLX-3006/NOPB modulates its 2 MHz switching frequency by ±12.5 kHz using a triangular dither profile controlled via I²C register bit. This spreads energy across a 25 kHz bandwidth, lowering peak radiated emissions by up to 10 dB in the 2–20 MHz range-verified in typical application circuits with 2.2 µH inductors and 10 µF ceramic output caps-without requiring additional EMI filters.
Can LM3370TLX-3006/NOPB operate with independent input supplies on VIN1 and VIN2?
Yes, LM3370TLX-3006/NOPB supports independent 2.7–5.5 V supplies on VIN1 and VIN2. However, VDD must be ≥ the higher of the two inputs to ensure proper logic operation. This architecture enables dual-rail systems-for example, powering VOUT1 from a Li-ion battery (3.0–4.2 V) and VOUT2 from a 3.3 V fixed rail-while maintaining full I²C functionality and independent enable/reset control.
What is the purpose of the PGND1_S and PGND2_S pins on LM3370TLX-3006/NOPB?
The PGND1_S and PGND2_S pins on LM3370TLX-3006/NOPB provide Kelvin sense connections for each buck's power ground, isolating high-current return paths from feedback reference points. This eliminates IR drop errors in the FB1/FB2 voltage dividers, improving load regulation to ±0.0013%/mA and ensuring stable 1.2 V/1.8 V outputs under dynamic load transients up to 600 mA.
LM3370TLX-3006/NOPB Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- 20-WFBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Function:
- Step-Down
- Output Configuration:
- Positive
- Topology:
- Buck
- Output Type:
- Fixed
- Number of Outputs:
- 2
- Voltage - Input (Min):
- 2.7V
- Voltage - Input (Max):
- 5.5V
- Voltage - Output (Min/Fixed):
- 1.2V, 1.8V
- Voltage - Output (Max):
- -
- Current - Output:
- 600mA
- Frequency - Switching:
- 2MHz
- Synchronous Rectifier:
- Yes
- Operating Temperature:
- -30°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 20-DSBGA
LM3370TLX-3006/NOPB FAQ
1.How can I place an order for LM3370TLX-3006/NOPB through Aetrix?
Please submit a Request for Quotation (RFQ) for LM3370TLX-3006/NOPB on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LM3370TLX-3006/NOPB reliable?
The price and inventory of LM3370TLX-3006/NOPB are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LM3370TLX-3006/NOPB is usually 5 days.
3.What payment methods are accepted for LM3370TLX-3006/NOPB?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LM3370TLX-3006/NOPB transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LM3370TLX-3006/NOPB?
LM3370TLX-3006/NOPB orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LM3370TLX-3006/NOPB order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LM3370TLX-3006/NOPB?
For technical support, including LM3370TLX-3006/NOPB datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LM3370TLX-3006/NOPB requirements.
6.How does Aetrix verify that LM3370TLX-3006/NOPB is sourced from the original manufacturer or authorized distributors?
All LM3370TLX-3006/NOPB products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LM3370TLX-3006/NOPB meets industry standards.
7.What is the process for return or replacement of LM3370TLX-3006/NOPB?
All LM3370TLX-3006/NOPB units undergo pre-shipment inspection (PSI). If there is an issue with LM3370TLX-3006/NOPB, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LM3370TLX-3006/NOPB part is unused and in its original packaging.
Return procedure for LM3370TLX-3006/NOPB:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
LM3370TLX-3006/NOPB Tags
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