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Texas Instruments LM3370TLX-3022/NOPB

Part No.:
LM3370TLX-3022/NOPB
Manufacturer:
Texas Instruments
Category:
Voltage Regulators - DC DC Switching Regulators
Package:
20-WFBGA
Datasheet:
AetrixLM3370TLX-3022/NOPB.pdf
Description:
IC REG BCK 1.2V/1.85V DL 20DSBGA
Quantity:
Payment:
Payment
Shipping:
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Inventory:4,803

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Product details

Overview

LM3370TLX-3022/NOPB from Texas Instruments is a dual synchronous step-down DC-DC converter optimized for powering ultra-low-voltage circuits from a single Li-Ion cell (2.7V–5.5V input). It delivers 600mA per channel with dynamically programmable outputs: VOUT1 = 1.2V and VOUT2 = 1.85V, controlled via I²C interface, and features 2MHz fixed-frequency PWM operation with automatic PFM/PWM mode switching. It is used in baseband and application processors requiring dynamic voltage scaling.

For engineers reviewing the LM3370TLX-3022/NOPB datasheet, LM3370TLX-3022/NOPB pinout, LM3370TLX-3022/NOPB application, or LM3370TLX-3022/NOPB equivalent, key selection criteria include I²C-controlled dual-output DVS capability, 2.2µH inductor compatibility, spread-spectrum noise reduction, and support for 180° out-of-phase buck timing to reduce input ripple.

Technical Context

The LM3370TLX-3022/NOPB implements two independent voltage-mode synchronous buck regulators with internal PFET/NFET switches, operating at 2MHz typical switching frequency. Each channel supports 100% duty-cycle LDO-like operation and features dedicated enable (EN1/EN2), power-on-reset (nPOR1/nPOR2), and analog feedback (FB1/FB2) pins.

Its I²C-compatible interface (400kHz max) enables real-time control of output voltages (VOUT1: 1V–2V in 50mV steps; VOUT2: 1.8V–3.3V in 100mV steps), forced PWM mode, auto PFM/PWM transition, and spread-spectrum modulation - all without external resistors due to factory-trimmed default settings for this variant.

Key Specifications

ParameterValue and Actual Design Meaning
Output Voltage SetVOUT1 = 1.2V, VOUT2 = 1.85V - factory-configured fixed outputs enabling immediate use without I²C programming
Input Voltage Range2.7V to 5.5V - supports single-cell Li-Ion, 3-cell NiMH/NiCd, and fixed 3.3V/5V rails
Max Output Current600mA per channel - sufficient for core logic and I/O power in portable processors
Switching Frequency2MHz (typ.) - allows compact 2.2µH inductors and low-profile 4.7µF/10µF ceramic capacitors
I²C Interface400kHz standard-mode - enables dynamic voltage scaling, mode control, and spread-spectrum activation
Thermal ProtectionInternal thermal shutdown at TJ ≈ 150°C - prevents damage during sustained overload or poor PCB thermal design
Efficiency Peak≥90% at ≥70mA load (PWM mode) - achieved via internal synchronous rectification eliminating external Schottky losses

Pinout & Package

LM3370TLX-3022/NOPB is packaged in a 20-bump DSBGA (3.0 mm × 2.0 mm × 0.6 mm), optimized for space-constrained portable designs. Pin assignments are validated per TI SNVS406N Rev. May 2013, Figure 2.

Pin/TerminalCircuit RoleDesign Meaning
A1SW1Buck 1 switch node - connects to 2.2µH inductor; requires low-inductance layout to minimize EMI
A2VIN1Buck 1 input supply - must be decoupled with 4.7µF ceramic capacitor near package
A3SGNDSignal ground reference - isolated from power grounds to reduce noise coupling into FB/SDA/SCL
A4FB1Buck 1 feedback input - senses VOUT1 at resistor divider; high-impedance node sensitive to routing parasitics
B1PGND1Buck 1 power ground - return path for high di/dt switch current; must connect directly to thermal pad
B2PGND1_SBuck 1 power ground sense - Kelvin connection for accurate current sensing and regulation stability
B3SDAI²C data line - requires 2kΩ pull-up to VDD; bidirectional, open-drain compatible
B4SCLI²C clock line - requires 2kΩ pull-up to VDD; master-driven, edge-sensitive timing
C1VDDSignal supply - must be ≥ VIN1 and VIN2; powers internal logic, POR, and I²C interface
C2SGNDSignal ground - second SGND pin improves noise immunity for analog and digital sections
C3nPOR1Open-drain Buck 1 reset - asserts low when VOUT1 falls below 94% of target; requires 100kΩ pull-up
C4nPOR2Open-drain Buck 2 reset - asserts low when VOUT2 falls below 94% of target; requires 100kΩ pull-up
D1PGND2Buck 2 power ground - return path for Buck 2 switch current; separate from PGND1 to avoid cross-talk
D2PGND2_SBuck 2 power ground sense - Kelvin connection for precise regulation under load transients
D3EN2Buck 2 enable - active-high logic; controls startup sequencing and standby current (IQ_SD = 0.2–3µA)
D4EN1Buck 1 enable - active-high logic; enables independent power rail control for processor core/I/O sequencing
E1SW2Buck 2 switch node - connects to second 2.2µH inductor; 180° phase shift reduces input capacitor RMS current
E2VIN2Buck 2 input supply - may share VIN1 rail or use independent source; decoupling required
E3SGNDSignal ground - third SGND pin enhances layout flexibility and noise rejection
E4FB2Buck 2 feedback input - senses VOUT2; independent loop ensures stable dual-rail operation

Key Features

FeatureDesign Value
I²C-controlled dynamic voltage scalingEnables real-time adjustment of VOUT1 (1.0–2.0V in 50mV steps) and VOUT2 (1.8–3.3V in 100mV steps) to match processor performance states
Automatic PFM/PWM mode switchingMaintains >90% efficiency above 70mA while dropping IQ to <20µA per channel in PFM - critical for battery runtime in standby
180° out-of-phase buck timingReduces input capacitor RMS current by ~30% and lowers peak input surge, easing input filter design
Spread-spectrum modulationLowers EMI peak amplitude by spreading switching energy across 2MHz ±100kHz band - simplifies FCC/CE compliance
Integrated soft-start and PORPrevents inrush current and ensures deterministic power-up sequence; nPOR1/nPOR2 provide system-level reset signaling

Applications

Mobile Baseband Processor PowerApplication Processor Core/I/O Rails

Use Scenario: Powering ARM-based baseband ICs (e.g., Qualcomm MDM series) requiring separate 1.2V core and 1.85V I/O supplies with tight sequencing and low-noise operation.

IC Role / Device Role / Timing Role: Dual-channel synchronous buck regulator providing independently enabled, I²C-adjustable rails with 180° phase shift to minimize input ripple.

Use Value: Eliminates need for discrete PMIC or multiple single-channel converters; factory-set 1.2V/1.85V outputs reduce BOM count and layout area.

Use Scenario: Supplying voltage-scaled cores and peripherals in application processors (e.g., TI OMAP, NXP i.MX) where DVFS is used to balance performance and battery life.

IC Role / Device Role / Timing Role: Dynamic voltage scaling controller with real-time I²C interface, enabling software-defined voltage transitions during CPU frequency changes.

Use Value: Reduces average system power by up to 40% during light-load operation via PFM mode and intelligent load-dependent mode switching.

FPGA/CPLD Core & I/O BanksPortable Audio/Video SoC Power

Use Scenario: Delivering clean, sequenced 1.2V core and 1.85V I/O voltages to Xilinx Spartan or Intel MAX 10 FPGA devices in handheld test equipment or edge AI modules.

IC Role / Device Role / Timing Role: Dual-output DC-DC with independent EN1/EN2 and nPOR1/nPOR2 for safe power-up/down sequencing and fault monitoring.

Use Value: Ensures reliable configuration and operation by meeting FPGA vendor's strict voltage ramp rate and monotonicity requirements.

Use Scenario: Powering multimedia SoCs (e.g., Allwinner H-series, Rockchip RK33xx) with separate core, GPU, and video I/O domains requiring low-noise, dynamically scalable supplies.

IC Role / Device Role / Timing Role: Low-EMI dual buck with spread-spectrum and 2MHz switching - avoids interference with audio ADC/DAC and RF front-end circuits.

Use Value: Achieves <10mVpp output ripple without additional LC filtering, preserving signal integrity in analog audio paths.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-output synchronous buck converter applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
TPS62231RGTRSingle-output, 600mA, 2.25V–6V input, I²C-programmable (1.0–3.6V), no spread spectrumRequires two units for dual-rail; lacks independent POR and 180° phase shiftChoose if only one rail is needed or board space allows dual placement
RTQ2132BGQWDual-output, 600mA/channel, 2.5V–5.5V input, I²C interface, but fixed 1.2V/1.8V outputs (no DVS)Factory-set outputs match closely but lack runtime voltage adjustment capabilityChoose if dynamic scaling is unnecessary and lower cost is prioritized

Compared with TPS62231RGTR and RTQ2132BGQW, LM3370TLX-3022/NOPB uniquely combines factory-configured 1.2V/1.85V outputs with full I²C DVS, spread-spectrum EMI reduction, and 180° interleaving - making it optimal for space- and noise-sensitive portable processors where firmware-controlled voltage agility is required.

Availability

LM3370TLX-3022/NOPB is available at Aetrix Electronics and suitable for mobile baseband processors, application processor DVFS systems, FPGA power management, and portable multimedia SoC designs requiring stable component supply and long-term production continuity.

Supply support for LM3370TLX-3022/NOPB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader delivering analog, embedded processing, and connectivity solutions for industrial, automotive, and personal electronics markets.

The LM3370 belongs to TI's portable power management IC portfolio, designed specifically for ultra-low-voltage, high-efficiency dual-rail conversion in battery-powered processors with dynamic voltage scaling requirements.

FAQ

What output voltages are factory-configured for LM3370TLX-3022/NOPB?

The LM3370TLX-3022/NOPB is factory-trimmed to deliver VOUT1 = 1.2V and VOUT2 = 1.85V. These values are fixed at wafer test and do not require I²C initialization, enabling immediate operation upon power-up. The I²C interface remains fully functional to adjust either output within its specified range (VOUT1: 1.0–2.0V; VOUT2: 1.8–3.3V) if system firmware requires runtime scaling. This dual capability supports both plug-and-play deployment and flexible DVFS architectures.

Does LM3370TLX-3022/NOPB support independent power sequencing between its two outputs?

Yes, LM3370TLX-3022/NOPB supports fully independent power sequencing via dedicated EN1 and EN2 pins. Each enable input controls its respective buck channel without affecting the other, allowing staggered startup or shutdown - for example, powering VOUT2 (I/O) before VOUT1 (core) to meet processor boot requirements. Additionally, nPOR1 and nPOR2 provide open-drain reset signals that assert low when their corresponding output falls below 94% of target, enabling system-level sequencing validation and fault detection.

What package type and thermal characteristics apply to LM3370TLX-3022/NOPB?

LM3370TLX-3022/NOPB uses the 20-bump DSBGA package (3.0 mm × 2.0 mm × 0.6 mm), with a junction-to-ambient thermal resistance (θJA) of 50°C/W on a standard 4-layer board. Its small footprint suits ultra-compact portable designs, while the exposed thermal pad (connected to PGND1_S/PGND2_S) enables effective heat dissipation. For continuous 600mA operation per channel, ambient temperature must be limited to ≤60°C per the dissipation rating table - de-rating is required above that point to maintain TJ < 125°C.

How does the I²C interface of LM3370TLX-3022/NOPB differ from standard I²C implementations?

The LM3370TLX-3022/NOPB implements a standard-mode I²C interface compliant with 400kHz clock frequency and TI's defined timing parameters (e.g., tCLKLP = 1.3µs, tDATAHLD = 200ns). It requires external 2kΩ pull-up resistors on SDA and SCL, and supports all register-based functions: output voltage setting, PFM/PWM mode forcing, spread-spectrum enable/disable, and POR threshold trimming. Unlike general-purpose I²C slaves, it has no address select pins - its fixed 7-bit slave address (0x48) is hardwired, simplifying firmware integration in resource-constrained microcontrollers.

Can LM3370TLX-3022/NOPB operate with only one output enabled?

Yes, LM3370TLX-3022/NOPB supports single-output operation: driving EN1 low disables Buck 1 while Buck 2 remains fully functional (and vice versa), with quiescent current dropping to ≤3µA for the disabled channel. Both bucks retain independent feedback loops, so the active channel maintains regulation accuracy and transient response unaffected by the inactive channel's state. This capability enables flexible power domain partitioning - for instance, powering I/O (VOUT2) while keeping core (VOUT1) in deep sleep - without compromising efficiency or stability.

LM3370TLX-3022/NOPB Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Series:
-
Package/Case:
20-WFBGA
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Function:
Step-Down
Output Configuration:
Positive
Topology:
Buck
Output Type:
Fixed
Number of Outputs:
2
Voltage - Input (Min):
2.7V
Voltage - Input (Max):
5.5V
Voltage - Output (Min/Fixed):
1.2V, 1.85V
Voltage - Output (Max):
-
Current - Output:
600mA
Frequency - Switching:
2MHz
Synchronous Rectifier:
Yes
Operating Temperature:
-30°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
20-DSBGA

LM3370TLX-3022/NOPB FAQ

1.How can I place an order for LM3370TLX-3022/NOPB through Aetrix?

Please submit a Request for Quotation (RFQ) for LM3370TLX-3022/NOPB on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for LM3370TLX-3022/NOPB reliable?

The price and inventory of LM3370TLX-3022/NOPB are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LM3370TLX-3022/NOPB is usually 5 days.

3.What payment methods are accepted for LM3370TLX-3022/NOPB?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LM3370TLX-3022/NOPB transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for LM3370TLX-3022/NOPB?

LM3370TLX-3022/NOPB orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your LM3370TLX-3022/NOPB order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for LM3370TLX-3022/NOPB?

For technical support, including LM3370TLX-3022/NOPB datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LM3370TLX-3022/NOPB requirements.

6.How does Aetrix verify that LM3370TLX-3022/NOPB is sourced from the original manufacturer or authorized distributors?

All LM3370TLX-3022/NOPB products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LM3370TLX-3022/NOPB meets industry standards.

7.What is the process for return or replacement of LM3370TLX-3022/NOPB?

All LM3370TLX-3022/NOPB units undergo pre-shipment inspection (PSI). If there is an issue with LM3370TLX-3022/NOPB, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The LM3370TLX-3022/NOPB part is unused and in its original packaging.

Return procedure for LM3370TLX-3022/NOPB:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

LM3370TLX-3022/NOPB Tags

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