My Inquiry
My Account
Texas Instruments LM3561TME/NOPB
- Part No.:
- LM3561TME/NOPB
- Manufacturer:
- Texas Instruments
- Category:
- LED Drivers
- Package:
- 12-WFBGA, DSBGA
- Datasheet:
-
LM3561TME/NOPB.pdf
- Description:
- IC LED DRVR RGLTR I2C 12DSBGA
- Quantity:
- Payment:
- Shipping:
Inventory:500
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
LM3561TME/NOPB from Texas Instruments is a 2-MHz synchronous boost converter LED flash driver with integrated 600-mA high-side current source, I²C-compatible interface, and dual-mode LEDI/NTC pin for thermal sensing or indicator drive. It operates from 2.5V to 5.5V input, delivers regulated LED current across wide VIN–VLED headroom (≥250 mV), and supports camera phone flash, torch, and indicator functions in ultra-compact DSBGA packaging.
For engineers reviewing the LM3561TME/NOPB datasheet, LM3561TME/NOPB pinout, LM3561TME/NOPB application, or LM3561TME/NOPB equivalent, key selection considerations include programmable flash/torch current (18–600 mA), hardware STROBE/TX1/TX2 control, NTC-based thermal scaleback, 400-kHz I²C timing compliance, and pass/boost mode transition behavior at VIN ≈ VLED + 250 mV.
Technical Context
The LM3561TME/NOPB integrates a fixed-frequency 2-MHz current-mode synchronous boost controller with a high-side current sink, enabling grounded-cathode white LED operation. Its regulation architecture maintains ≥250 mV headroom (VOUT − VLED) in boost mode and transitions to pass mode when VIN exceeds VLED + 250 mV, using the internal PMOS as a low-RDS(on) (270 mΩ) linear regulator.
Control is implemented via a 400-kHz I²C interface supporting 16-flash/8-torch brightness levels, programmable timeout (32–1024 ms), VIN monitor threshold (2.90 V), and seven fault flags-including thermal shutdown (150°C), LED open/short, NTC overtemperature, and TX1/TX2 interrupts-readable over the same bus.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input voltage range | 2.5 V to 5.5 V - supports single-cell Li-ion and Li-poly battery systems without external LDO. |
| LED current range | 18 mA to 600 mA - software-programmable in 16 flash steps or 8 torch steps; accuracy ±6% over −40°C to +85°C. |
| Headroom voltage | 250 mV min - ensures current-source regulation stability and enables efficient operation near battery voltage. |
| Switching frequency | 2 MHz fixed - allows use of small 1-µH inductors and minimizes EMI in compact mobile layouts. |
| I²C interface speed | 400 kHz - compatible with standard-mode I²C controllers; supports full register read/write and flag polling. |
| Thermal shutdown | 150°C (typ.) - latches off LED current until Flags register is read; prevents permanent die damage during sustained overload. |
| Package | 12-bump DSBGA (1.215 mm × 1.615 mm × 0.6 mm) - ultra-low profile for space-constrained camera modules. |
Pinout & Package
The LM3561TME/NOPB is housed in a 12-bump wafer-level chip-scale package (DSBGA, package code YFQ0012AAA), measuring 1.215 mm × 1.615 mm × 0.6 mm, with solder bumps on bottom side for PCB mounting.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GND (A1) | Power ground reference | Primary return path for boost switch currents and LED sink; must be low-impedance connection to minimize noise coupling. |
| IN (A2) | Main power input | Connects to battery or DC supply; requires ≥10 µF ceramic bypass capacitor to GND for stability and transient response. |
| HWEN (A3) | Active-low hardware enable | Pull low to force immediate shutdown; high-impedance input with internal 300 kΩ pulldown - used for system-level fault recovery. |
| SW (B1) | Internal switch node | Drain of NMOS and source of PMOS sync switches; connects externally to inductor; critical for EMI layout. |
| STROBE (B2) | Hardware flash trigger | Active-high direct flash activation; internal 300 kΩ pulldown ensures safe default state; overrides I²C commands. |
| SCL (B3) | I²C clock input | Accepts 0–400 kHz clock; VIH ≥ 1.3 V, VOL ≤ 400 mV at 3 mA load - compatible with 1.8 V/3.3 V microcontrollers. |
| OUT (C1) | Boost converter output | Supplies regulated voltage to LED anode; bypass with 10 µF ceramic capacitor to GND for ripple suppression. |
| TX1/TORCH/GPIO (C2) | Multi-function interrupt pin | Configurable as flash interrupt, hardware torch enable, or GPIO; internal 300 kΩ pulldown; supports RF PA pulse coordination. |
| SDA (C3) | I²C bidirectional data | Open-drain I/O with VIH ≥ 1.3 V, VOL ≤ 400 mV; requires external pullup resistor (typically 4.7 kΩ). |
| LED (D1) | High-side LED current sink | Drives LED cathode to GND; sinks up to 600 mA with <±6% accuracy; no external sense resistor required. |
| LEDI/NTC (D2) | Dual-mode analog input | Configurable as 18 mA indicator driver or comparator input (1 V ref) for NTC thermistor - enables closed-loop LED thermal derating. |
| TX2/GPIO2/INT (D3) | Secondary interrupt/GPIO | Supports second RF PA sync event or fault notification output; internal 300 kΩ pulldown; can assert INT on thermal/VIN/LED faults. |
Key Features
| Feature | Design Value |
|---|---|
| High-side current sink | Enables grounded-cathode LED layout - simplifies mechanical integration and improves thermal path to PCB. |
| Pass/boost mode auto-selection | Transitions seamlessly between linear (pass) and switching (boost) operation based on real-time VIN–VLED margin - maximizes efficiency across battery discharge curve. |
| Programmable thermal derating | Uses LEDI/NTC pin to monitor LED temperature via external NTC; automatically scales back flash current above threshold - prevents LED degradation and color shift. |
| Dual TX synchronization inputs | TX1 and TX2 allow hardware coordination with RF power amplifier pulses to avoid simultaneous high-current events - reduces peak battery drain and voltage sag. |
| Seven integrated fault flags | Includes thermal shutdown, LED open/short, VIN under-voltage, NTC overtemp, and TX interrupt flags - all readable over I²C without external monitoring circuitry. |
Applications
| Smartphone Camera Flash | Tablet Torch Lighting |
|---|---|
Use Scenario: High-intensity still-image capture in low-light conditions using single high-power white LED. IC Role / Device Role / Timing Role: Primary flash driver delivering 600 mA for ≤1 s with precise 32-ms granularity timeout control and STROBE-triggered activation. Use Value: Enables consistent luminance across battery voltage range (3.0–4.2 V) via adaptive pass/boost regulation and thermal derating - extends LED lifetime and maintains color rendering index (CRI). | Use Scenario: Continuous illumination for video recording or UI backlighting in portable tablets. IC Role / Device Role / Timing Role: Torch-mode current source providing stable 93.2 mA (or other programmable level) with <±10% accuracy over temperature. Use Value: Eliminates need for external current-setting resistors or DACs; supports smooth brightness ramping (32 µs/step) and hardware torch enable via TX1 pin. |
| Mobile Barcode Scanner | Wearable Health Monitor Indicator |
Use Scenario: Short-duration, high-current LED pulse synchronized with image sensor exposure in handheld scanners. IC Role / Device Role / Timing Role: Flash controller triggered by STROBE or I²C; uses TX2 interrupt to signal successful flash completion to host MCU. Use Value: Guarantees sub-100 µs flash-to-torch settling time and accurate 1.5 s max timeout - ensures reliable decode even under varying ambient light. | Use Scenario: Low-power status indication using integrated 18 mA indicator driver on LEDI/NTC pin. IC Role / Device Role / Timing Role: Dual-mode pin configured as constant-current LED driver (not NTC input); supports 8 brightness levels via I²C. Use Value: Reduces BOM count by eliminating discrete LED driver IC or current-limiting resistor; occupies <16 mm² total solution area including passive components. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar LED flash driver applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LM3554TME/NOPB | Same DSBGA package, but supports dual-flash LED outputs (2 × 600 mA) and includes integrated charge pump; lacks NTC input and TX2 interrupt. | Required for dual-LED flash configurations (e.g., front+rear cameras); not suitable where single-LED thermal monitoring is mandatory. | Select LM3554TME/NOPB only when driving two independent LEDs; LM3561TME/NOPB remains optimal for single-LED + thermal sensing designs. |
| MAX77691EWL+T | 3.2-mm × 2.3-mm WLP package; integrates flash driver, torch driver, and buck converter; supports 1.5-A flash current but no NTC input or hardware STROBE. | Targeted at multi-rail PMIC applications where flash driver is one function among power management; larger footprint and higher quiescent current (1.1 µA vs. 1.1 µA in standby). | Choose MAX77691EWL+T when consolidating power rails is prioritized over thermal protection; LM3561TME/NOPB offers superior thermal safety and smaller size for dedicated flash use. |
Compared with LM3554TME/NOPB and MAX77691EWL+T, the LM3561TME/NOPB uniquely combines ultra-compact DSBGA packaging, integrated NTC-based thermal derating, and dual hardware synchronization (TX1/TX2) - making it the most suitable choice for space-constrained, thermally sensitive single-LED flash applications in smartphones and wearables.
Availability
LM3561TME/NOPB is available at Aetrix Electronics and suitable for smartphone camera modules, tablet torch lighting, mobile barcode scanners, and wearable health indicator designs requiring stable component supply and long-term production continuity.
Supply support for LM3561TME/NOPB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and digital signal technologies for industrial, automotive, and consumer applications.
The LM3561TME/NOPB belongs to TI's camera LED driver product line, engineered specifically for ultra-compact, thermally aware flash control in mobile imaging systems - balancing high efficiency, precise current regulation, and hardware-software co-design flexibility.
FAQ
What is the maximum continuous LED current supported by the LM3561TME/NOPB?
The LM3561TME/NOPB supports up to 600 mA of continuous LED current in Flash mode, with accuracy of ±6% over −40°C to +85°C ambient temperature. This rating applies when operating within specified input voltage (2.5–5.5 V), thermal limits (TJ ≤ 125°C), and headroom (VOUT − VLED ≥ 250 mV). The device includes thermal shutdown at 150°C to protect against sustained overload, and the LM3561TME/NOPB must be re-enabled via I²C after a thermal fault is cleared.
How does the LM3561TME/NOPB handle low-input-voltage conditions during flash operation?
The LM3561TME/NOPB incorporates a programmable VIN monitor that triggers at 2.90 V (typical) to reduce flash current or shut down the device before battery brownout. When enabled, this feature reads the IN pin voltage and asserts the VIN Monitor flag over I²C; it can be configured to scale back LED current or halt flash operation entirely. This behavior prevents unstable LED output and protects system integrity - a critical capability for maintaining consistent flash performance as the Li-ion battery discharges from 4.2 V to 3.0 V, and directly implemented in the LM3561TME/NOPB's register set.
Can the LEDI/NTC pin on the LM3561TME/NOPB be used simultaneously for indicator LED drive and NTC sensing?
No - the LEDI/NTC pin on the LM3561TME/NOPB is a dual-function terminal that operates in one mode at a time: either as a 18-mA constant-current indicator LED driver (when Configuration Register Bit [4] = 0) or as a comparator input for NTC thermistor voltage monitoring (when Bit [4] = 1, with internal 1-V reference). These modes are mutually exclusive and selected via I²C configuration; the LM3561TME/NOPB does not support concurrent operation. Attempting to drive an LED while reading NTC voltage will corrupt measurements and violate the device's electrical specifications.
What is the purpose of the TX1 and TX2 pins on the LM3561TME/NOPB, and how do they differ?
The TX1 and TX2 pins on the LM3561TME/NOPB provide hardware-level synchronization with RF power amplifier (PA) events to prevent simultaneous high-current draw. TX1 is configurable as Flash Interrupt Input, Hardware Torch Enable, or GPIO; TX2 serves as GPIO2 or interrupt output (INT) for fault notification. Both feature internal 300-kΩ pulldowns and respond within microseconds - TX1 forces immediate torch-mode current reduction upon assertion, while TX2 can signal thermal, VIN, or LED faults to the host processor. Their distinct roles enable coordinated power management in LTE/5G mobile platforms, and both are integral to the LM3561TME/NOPB's system-level robustness.
Does the LM3561TME/NOPB require external current-sense resistors for LED regulation?
No - the LM3561TME/NOPB integrates a precision high-side current sink with internal current sensing and regulation, eliminating the need for external sense resistors. LED current is set digitally via I²C registers (Flash Brightness or Torch Brightness) and maintained with ±6% accuracy over temperature and input voltage. The device regulates by controlling the voltage headroom (VOUT − VLED) to ≥250 mV and dynamically adjusting boost duty cycle or PMOS conduction - all implemented internally. This architecture reduces BOM cost, PCB area, and thermal dissipation compared to resistor-based solutions, and is a core functional attribute of the LM3561TME/NOPB.
LM3561TME/NOPB Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- 12-WFBGA, DSBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- DC DC Regulator
- Topology:
- Step-Up (Boost)
- Internal Switch(s):
- Yes
- Number of Outputs:
- 1
- Voltage - Supply (Min):
- 2.5V
- Voltage - Supply (Max):
- 5.5V
- Voltage - Output:
- -
- Current - Output / Channel:
- 600mA (Flash)
- Frequency:
- 2MHz
- Dimming:
- I2C
- Applications:
- Camera Flash
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 12-DSBGA
LM3561TME/NOPB FAQ
1.How can I place an order for LM3561TME/NOPB through Aetrix?
Please submit a Request for Quotation (RFQ) for LM3561TME/NOPB on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LM3561TME/NOPB reliable?
The price and inventory of LM3561TME/NOPB are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LM3561TME/NOPB is usually 5 days.
3.What payment methods are accepted for LM3561TME/NOPB?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LM3561TME/NOPB transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LM3561TME/NOPB?
LM3561TME/NOPB orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LM3561TME/NOPB order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LM3561TME/NOPB?
For technical support, including LM3561TME/NOPB datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LM3561TME/NOPB requirements.
6.How does Aetrix verify that LM3561TME/NOPB is sourced from the original manufacturer or authorized distributors?
All LM3561TME/NOPB products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LM3561TME/NOPB meets industry standards.
7.What is the process for return or replacement of LM3561TME/NOPB?
All LM3561TME/NOPB units undergo pre-shipment inspection (PSI). If there is an issue with LM3561TME/NOPB, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LM3561TME/NOPB part is unused and in its original packaging.
Return procedure for LM3561TME/NOPB:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
LM3561TME/NOPB Tags
-
BCR402RE6327HTSA1
Infineon Technologies
-
BCR430UXTSA2
Infineon Technologies
-
BCR420UE6433HTMA1
Infineon Technologies
-
BCR420UE6327HTSA1
Infineon Technologies
-
BCR421UE6327HTSA1
Infineon Technologies
-
LYT1604D-TL
Power Integrations
-
HV9910CLG-G
Microchip Technology
-
CL2N8-G
Microchip Technology
-
BCR420UW6-7
Diodes Incorporated
-
BCR421UW6-7
Diodes Incorporated
-
BCR420UFD-7
Diodes Incorporated
-
BCR421UFD-7
Diodes Incorporated
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
