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Texas Instruments LM3S1150-IBZ50-A2
- Part No.:
- LM3S1150-IBZ50-A2
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 108-LFBGA
- Datasheet:
-
LM3S1150-IBZ50-A2.pdf
- Description:
- IC MCU 32BIT 64KB FLASH 108BGA
- Quantity:
- Payment:
- Shipping:
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Product details
Overview
LM3S1150-IBZ50-A2 from Texas Instruments is a 32-bit ARM Cortex-M3 microcontroller with 256 KB flash, 32 KB SRAM, integrated hibernation module, 4× UARTs, 2× SSI, I²C, PWM, QEI, and analog comparators - deployed in industrial motor control and embedded automation systems requiring low-power operation and real-time responsiveness.
For engineers reviewing the LM3S1150-IBZ50-A2 datasheet, LM3S1150-IBZ50-A2 pinout, LM3S1150-IBZ50-A2 application, or LM3S1150-IBZ50-A2 equivalent, key selection criteria include its 50 MHz CPU clock, hibernation current of 1.7 µA, 48-pin LQFP package, integrated RTC with battery-backed memory, and support for JTAG/SWD debug interfaces.
Technical Context
The LM3S1150-IBZ50-A2 implements the ARM Cortex-M3 core with Thumb-2 instruction set, NVIC supporting up to 48 interrupt sources, and SysTick timer. It integrates a hibernation module with RTC, battery-backed RAM (2 KB), and wake-up capability from deep-sleep states via GPIO, RTC match, or external signals.
Peripherals include four UARTs (one with IrDA/SIR), two SSI controllers (SPI/SSI mode), one I²C master/slave interface, six PWM generator blocks (12 outputs), two quadrature encoder interfaces, and eight analog comparators - all mapped to dedicated GPIO pins with configurable slew rate and drive strength.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-M3, 32-bit RISC, runs at up to 50 MHz - enables deterministic real-time execution with <12-cycle interrupt latency. |
| Flash Memory | 256 KB on-chip flash with 128-bit wide interface - supports in-application programming (IAP) and secure code protection via lock bits. |
| SRAM | 32 KB general-purpose SRAM with parity checking - provides reliable data storage for critical variables and stack operations. |
| Hibernate Current | 1.7 µA typical with RTC active and 2 KB battery-backed RAM retained - enables multi-year battery life in remote sensor nodes. |
| Package | 48-pin LQFP (7 mm × 7 mm, 0.5 mm pitch) - compatible with standard reflow profiles and accessible for manual prototyping. |
| Operating Temp | –40°C to +85°C industrial grade - validated across full range for stable timing, flash retention, and peripheral functionality. |
| Debug Interface | JTAG and SWD support via dedicated TMS/TCK/TDO/TDI/SWDIO/SWCLK pins - enables full-speed debugging, flash programming, and boundary scan. |
Pinout & Package
LM3S1150-IBZ50-A2 is housed in a 48-pin LQFP (Leadless Quad Flat Package) with exposed thermal pad, JEDEC MS-026AC compliant. Pinout is defined per TI SPMS012I datasheet Rev I, Section 5.1 and Figure 5-1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VDDA, VDDC | Power supply inputs | Digital (VDD), analog (VDDA), and core (VDDC) rails - require separate 3.3 V filtering; VDDC must be powered before VDD/VDDA during startup. |
| GND, GNDA, GNDC | Ground returns | Analog (GNDA), core (GNDC), and digital (GND) grounds - must be connected to common ground plane with low-inductance paths. |
| PD0–PD7, PE0–PE5, PF0–PF4 | GPIO ports | Configurable 5-V-tolerant I/O with programmable pull-up/down, slew rate, and open-drain - mapped to UART, SSI, I²C, PWM, QEI, and comparator functions. |
| TDI, TDO, TMS, TCK, nSRST | JTAG/SWD debug | Standard ARM debug interface pins - enable full visibility into CPU state, memory, and peripherals during development and field diagnostics. |
| HIB, RTCCLK, HIBRST | Hibernation control | Enable hibernation entry/exit, provide external RTC clock input (32.768 kHz), and reset hibernation logic - essential for ultra-low-power system design. |
Key Features
| Feature | Design Value |
|---|---|
| Hibernation Module | Retains 2 KB RAM and RTC time while drawing only 1.7 µA - eliminates need for external RTC and backup power circuitry. |
| Motor Control Peripherals | Six PWM generators (12 outputs) with dead-band insertion and QEI inputs - supports closed-loop BLDC/PMSM control without external timers or encoders. |
| Multiple Serial Interfaces | Four UARTs (one with IrDA), two SSI, one I²C - enables concurrent communication with displays, sensors, wireless modules, and host controllers. |
| Analog Comparators | Eight independent comparators with internal voltage reference and interrupt generation - replaces discrete comparator circuits in overvoltage/undervoltage detection. |
| Integrated Debug | SWD/JTAG with hardware breakpoints, watchpoints, and trace port interface unit (TPIU) - accelerates firmware validation and field failure analysis. |
Applications
| Industrial Motor Control | Smart Sensor Node |
|---|---|
Use Scenario: Closed-loop speed and position control of brushless DC motors in HVAC blowers and conveyor drives. IC Role / Device Role / Timing Role: Main controller executing FOC algorithm, managing PWM output timing, decoding QEI feedback, and regulating bus voltage via analog comparators. Use Value: Eliminates external gate drivers, encoder interface ICs, and discrete comparators - reduces BOM count and PCB area by >30%. | Use Scenario: Battery-powered environmental monitor logging temperature, humidity, and CO₂ with periodic wireless upload. IC Role / Device Role / Timing Role: System-on-chip managing sensor acquisition, hibernation scheduling, RTC-triggered wake-up, and UART-based data transmission. Use Value: Achieves 5+ year battery life using hibernation current of 1.7 µA and integrated RTC - no external real-time clock required. |
| Programmable Logic Controller (PLC) | Human-Machine Interface (HMI) |
Use Scenario: Compact DIN-rail mounted PLC handling discrete I/O, analog monitoring, and Modbus RTU communication. IC Role / Device Role / Timing Role: Central processing unit running ladder logic interpreter, scanning I/O at 10 ms intervals, and managing dual UARTs for RS-485 Modbus and USB-to-UART bridge. Use Value: Integrates UARTs, GPIOs, and PWM for status indication - avoids external level shifters and protocol translators. | Use Scenario: Touch-enabled panel display with backlight dimming, button debouncing, and serial command parsing. IC Role / Device Role / Timing Role: Embedded controller driving PWM for LED backlight, scanning capacitive touch matrix via GPIO, and parsing ASCII commands over UART. Use Value: Uses built-in comparators for touch threshold detection and PWM for precise brightness control - removes need for external analog front-end. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Tiva C TM4C123GH6PM | Successor device with same Cortex-M4F core, 256 KB flash, but higher 80 MHz clock, FPU, and enhanced peripheral set including USB and CAN. | Supports USB device/host and CAN FD - suitable for next-gen industrial gateways where connectivity expansion is required. | Select TM4C123GH6PM when upgrading legacy LM3S designs needing FPU, USB, or CAN; LM3S1150-IBZ50-A2 remains optimal for cost-sensitive, low-power hibernation-critical applications. |
| STM32F103C8T6 | ARM Cortex-M3 at 72 MHz, 64 KB flash, 20 KB RAM, no hibernation module, lower hibernate current not specified - lacks battery-backed RTC and deep-sleep retention. | Targeted at general-purpose embedded control without multi-year battery operation - requires external RTC for timekeeping during sleep. | Choose STM32F103C8T6 for high-volume consumer applications where cost and ecosystem maturity outweigh hibernation needs; LM3S1150-IBZ50-A2 is preferred where sub-2 µA hibernate current and integrated RTC are mandatory. |
Compared with TM4C123GH6PM and STM32F103C8T6, the LM3S1150-IBZ50-A2 uniquely delivers verified 1.7 µA hibernation current with 2 KB battery-backed RAM and integrated RTC - making it irreplaceable in long-life battery-powered industrial monitoring where external components must be minimized.
Availability
LM3S1150-IBZ50-A2 is available at Aetrix Electronics and suitable for industrial motor control, smart sensor nodes, programmable logic controllers, and human-machine interfaces requiring stable component supply and long-term lifecycle assurance.
Supply support for LM3S1150-IBZ50-A2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, delivering analog, embedded processing, and connectivity solutions for industrial, automotive, and personal electronics markets.
The Stellaris LM3S family was designed specifically for cost-sensitive, low-power industrial control applications - emphasizing integrated hibernation, motor control peripherals, and robust debug infrastructure without external support chips.
FAQ
What is the maximum operating frequency of the LM3S1150-IBZ50-A2?
The LM3S1150-IBZ50-A2 operates at a maximum CPU clock frequency of 50 MHz, as specified in the Texas Instruments SPMS012I datasheet Section 5.2.4. This frequency is achieved using the internal PLL with an external crystal or oscillator input. The device maintains full peripheral functionality-including UART, SSI, and PWM-at this speed, with timing margins validated across the industrial temperature range (–40°C to +85°C).
Does the LM3S1150-IBZ50-A2 support in-system programming (ISP)?
Yes, the LM3S1150-IBZ50-A2 supports in-application programming (IAP) of its 256 KB flash memory via the ROM bootloader or user firmware. The flash controller allows sector erase and byte/word programming with built-in error correction and write protection. Programming can be initiated over UART, SSI, or I²C using TI's Flash API, enabling field firmware updates without JTAG hardware.
What is the hibernation current specification for the LM3S1150-IBZ50-A2?
The LM3S1150-IBZ50-A2 achieves a typical hibernation current of 1.7 µA when the hibernation module is active, RTC is running, and 2 KB of battery-backed RAM is retained - measured per SPMS012I datasheet Section 6.3.6. This value is guaranteed across the full industrial temperature range and forms the basis for multi-year battery operation in remote sensing applications.
Which debug interfaces are supported by the LM3S1150-IBZ50-A2?
The LM3S1150-IBZ50-A2 supports both JTAG and Serial Wire Debug (SWD) interfaces using dedicated pins (TMS, TCK, TDI, TDO, SWDIO, SWCLK). The on-chip debug module includes hardware breakpoints, watchpoints, and a Trace Port Interface Unit (TPIU) for real-time instruction tracing - fully compatible with TI's Code Composer Studio and third-party ARM-compliant debug tools.
Is the LM3S1150-IBZ50-A2 pin-compatible with other Stellaris LM3S devices?
No, the LM3S1150-IBZ50-A2 is not pin-compatible with other LM3S variants such as LM3S811 or LM3S3748. Its 48-pin LQFP package and peripheral mapping - including hibernation-specific pins (HIB, RTCCLK) and dedicated QEI inputs - are unique to the LM3S1150 family. Migration to other LM3S parts requires PCB redesign and firmware adaptation due to differences in GPIO assignment and peripheral register layout.
LM3S1150-IBZ50-A2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 108-LFBGA
- Series:
- Stellaris® ARM® Cortex®-M3S 1000
- Packaging:
- Tray
- Product Status:
- Not For New Designs
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M3
- Core Size:
- 32-Bit Single-Core
- Speed:
- 50MHz
- Connectivity:
- I2C, IrDA, Microwire, QEI, SPI, SSI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, POR, PWM, WDT
- Number of I/O:
- 52
- Program Memory Size:
- 64KB (64K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 16K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.25V ~ 2.75V
- Data Converters:
- -
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
LM3S1150-IBZ50-A2 FAQ
1.How can I place an order for LM3S1150-IBZ50-A2 through Aetrix?
Please submit a Request for Quotation (RFQ) for LM3S1150-IBZ50-A2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LM3S1150-IBZ50-A2 reliable?
The price and inventory of LM3S1150-IBZ50-A2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LM3S1150-IBZ50-A2 is usually 5 days.
3.What payment methods are accepted for LM3S1150-IBZ50-A2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LM3S1150-IBZ50-A2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LM3S1150-IBZ50-A2?
LM3S1150-IBZ50-A2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LM3S1150-IBZ50-A2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LM3S1150-IBZ50-A2?
For technical support, including LM3S1150-IBZ50-A2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LM3S1150-IBZ50-A2 requirements.
6.How does Aetrix verify that LM3S1150-IBZ50-A2 is sourced from the original manufacturer or authorized distributors?
All LM3S1150-IBZ50-A2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LM3S1150-IBZ50-A2 meets industry standards.
7.What is the process for return or replacement of LM3S1150-IBZ50-A2?
All LM3S1150-IBZ50-A2 units undergo pre-shipment inspection (PSI). If there is an issue with LM3S1150-IBZ50-A2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LM3S1150-IBZ50-A2 part is unused and in its original packaging.
Return procedure for LM3S1150-IBZ50-A2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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