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Texas Instruments LM3S1165-IBZ50-A2
- Part No.:
- LM3S1165-IBZ50-A2
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 108-LFBGA
- Datasheet:
-
LM3S1165-IBZ50-A2.pdf
- Description:
- IC MCU 32BIT 64KB FLASH 108BGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,988
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Product details
Overview
LM3S1165-IBZ50-A2 from Texas Instruments is a 32-bit ARM Cortex-M3 microcontroller with 256 KB flash, 32 KB SRAM, integrated hibernation module, 8-channel 10-bit ADC, and dual UART/SSI/I²C interfaces. It operates at 50 MHz, supports -40°C to +85°C industrial temperature range, and targets motor control and embedded real-time systems requiring low-power hibernation.
For engineers reviewing the LM3S1165-IBZ50-A2 datasheet, LM3S1165-IBZ50-A2 pinout, LM3S1165-IBZ50-A2 application, or LM3S1165-IBZ50-A2 equivalent, key selection criteria include hibernation current (1.7 µA), RTC-backed battery operation, integrated analog comparators, PWM timing resolution, and JTAG/SWD debug support.
Technical Context
The LM3S1165-IBZ50-A2 implements the ARM Cortex-M3 core with Thumb-2 instruction set, NVIC with 48 interrupt lines, and SysTick timer. It integrates a hibernation module with RTC, battery-backed memory, and wake-up on external event or RTC match.
Peripherals include an 8-channel 10-bit ADC with hardware averaging, two UARTs (one with IrDA SIR), two SSI controllers, one I²C master/slave interface, four general-purpose timers (including 32-bit RTC mode), and eight PWM generator blocks with fault protection.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-M3, 32-bit RISC, runs Thumb-2 instructions at up to 50 MHz |
| Flash Memory | 256 KB on-chip flash with 128-bit wide interface and 128-byte erase sectors |
| SRAM | 32 KB single-cycle static RAM with parity checking |
| ADC | 8-channel 10-bit SAR ADC with 1 MSPS sample rate and hardware averaging up to 64 samples |
| Hibernate Current | 1.7 µA typical with RTC running from external battery (VBAT) |
| Operating Temp | -40°C to +85°C industrial grade, qualified per AEC-Q100 Class 2 (not automotive) |
| Debug Interface | JTAG and SWD support via dedicated pins; includes TPIU trace output |
Pinout & Package
LM3S1165-IBZ50-A2 is housed in a 100-pin LQFP (14 mm × 14 mm, 0.5 mm pitch) package with exposed thermal pad. Pin functions are defined per TI SPMS014I datasheet Rev I, Section 5.1 and Table 5-1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VDDA, VDDC | Power supply inputs | Separate digital (VDD), analog (VDDA), and core (VDDC) rails for noise isolation and power domain control |
| VBAT | Hibernate backup supply | Connects to coin cell or supercapacitor to maintain RTC and hibernate RAM during main power loss |
| PD0–PD7 | GPIO Port D | Configurable digital I/O; PD0/PD1 serve as UART0 RX/TX; PD2/PD3 as SSI0 CLK/FRM |
| PA0–PA7 | GPIO Port A | PA0–PA3 support ADC0 inputs; PA4–PA7 support PWM0 outputs |
| nRST | Active-low reset input | Asynchronous reset signal; internal pull-up; compatible with external reset supervisor ICs |
| TCK/TMS/TDI/TDO/nTRST | JTAG debug interface | Standard 5-pin JTAG port supporting boundary scan, flash programming, and real-time debugging |
Key Features
| Feature | Design Value |
|---|---|
| Hibernation Module | Enables ultra-low-power state with RTC, battery-backed RAM (2 KB), and wake-on-RTC-match or GPIO event |
| Integrated Analog Peripherals | 8-channel 10-bit ADC + 2 analog comparators with programmable reference and interrupt capability |
| PWM Generation | 8 PWM outputs across 4 generator blocks with dead-band insertion, fault shutdown, and synchronous update |
| Serial Connectivity | Dual UART (one with IrDA SIR), dual SSI (SPI-compatible), and I²C master/slave - all independently clocked and interrupt-capable |
| Memory Protection | MPU with 8 regions supports privilege-level enforcement and peripheral access control for robust firmware partitioning |
Applications
| Industrial Motor Control | Smart Sensor Node |
|---|---|
Use Scenario: Closed-loop BLDC motor drive with position feedback, current sensing, and thermal monitoring in factory automation. IC Role / Device Role / Timing Role: Real-time controller executing FOC algorithm, managing PWM gate timing, sampling ADC channels at 100 kHz, and communicating status via UART. Use Value: Integrated hibernation enables rapid wake-from-sleep on fault detection; 50 MHz CPU ensures <5 µs interrupt latency for critical overcurrent response. | Use Scenario: Battery-powered environmental sensor node measuring temperature, humidity, and ambient light with periodic wireless upload. IC Role / Device Role / Timing Role: System-on-chip host managing sensor interfaces (I²C, ADC), RTC-triggered wake-up, and low-power UART transmission. Use Value: 1.7 µA hibernate current extends 10-year battery life; internal temperature sensor eliminates external component cost. |
| Programmable Logic Controller (PLC) I/O Module | Medical Diagnostic Equipment |
Use Scenario: DIN-rail mounted I/O expansion module with isolated digital inputs, relay outputs, and Modbus RTU communication. IC Role / Device Role / Timing Role: Central controller handling discrete I/O scanning, protocol stack execution, and watchdog supervision of fieldbus interface. Use Value: Dual UARTs enable simultaneous Modbus RTU (RS-485) and local debug (TTL) without multiplexing; GPIO commit registers prevent spurious output transitions during configuration. | Use Scenario: Portable ultrasound front-end with time-of-flight calculations, analog beamforming control, and safety-critical self-test routines. IC Role / Device Role / Timing Role: Safety monitor co-processor validating ADC integrity, verifying PWM timing margins, and logging fault events to nonvolatile memory. Use Value: MPU-enforced memory regions isolate diagnostic firmware from main application; parity-checked SRAM ensures data reliability during critical measurements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LM3S1968-IBZ50-A2 | Same package and core; adds Ethernet MAC, USB device, and 12-bit ADC (but reduces hibernate RAM to 1 KB) | Better suited for networked HMI or gateway nodes; less optimal for ultra-low-power hibernation-only use cases | Select when Ethernet or USB connectivity is required; verify hibernate RAM size suffices for retention needs |
| TM4C123GH6PM | Successor family; 80 MHz Cortex-M4F, 256 KB flash, 32 KB SRAM, same pinout but different hibernate register map and higher active current | Supports floating-point math and DSP extensions; requires firmware migration due to peripheral register changes | Choose for new designs needing higher performance or FPU; not drop-in replaceable due to hibernate and ADC register differences |
Compared with LM3S1165-IBZ50-A2, LM3S1968-IBZ50-A2 trades hibernate depth for connectivity, while TM4C123GH6PM offers higher compute throughput at the cost of firmware porting effort and increased active power - making LM3S1165-IBZ50-A2 optimal for cost-sensitive, battery-retentive industrial control where legacy code stability matters.
Availability
LM3S1165-IBZ50-A2 is available at Aetrix Electronics and suitable for industrial motor drives, smart sensor nodes, PLC I/O modules, and medical diagnostic equipment requiring stable component supply and long-term lifecycle support.
Supply support for LM3S1165-IBZ50-A2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, specializing in analog, embedded processing, and connectivity solutions for industrial, automotive, and consumer markets.
The Stellaris LM3S series was designed as the first ARM Cortex-M3-based microcontroller family for deterministic real-time control, emphasizing low-power hibernation, integrated analog peripherals, and industrial-grade reliability - with LM3S1165-IBZ50-A2 targeting cost-optimized motor and sensor edge nodes.
FAQ
What is the maximum operating frequency of the LM3S1165-IBZ50-A2?
The LM3S1165-IBZ50-A2 operates at a maximum system clock frequency of 50 MHz, derived from its internal PLL or external crystal oscillator. This frequency is fully supported across its entire industrial temperature range (-40°C to +85°C) and enables sub-microsecond interrupt response times essential for motor control loops. The LM3S1165-IBZ50-A2 achieves this speed while maintaining full peripheral functionality including ADC sampling, PWM generation, and serial communication.
Does the LM3S1165-IBZ50-A2 support hardware debug and trace?
Yes, the LM3S1165-IBZ50-A2 includes full JTAG and SWD debug interfaces plus a Trace Port Interface Unit (TPIU) that outputs instruction and data trace streams. This allows real-time code profiling, instruction-level stepping, and non-intrusive variable inspection using standard ARM-compliant tools. The LM3S1165-IBZ50-A2's debug architecture supports breakpoints, watchpoints, and memory access tracing without halting CPU execution in most modes.
What power modes does the LM3S1165-IBZ50-A2 support, and what is its lowest hibernate current?
The LM3S1165-IBZ50-A2 supports Sleep, Deep-Sleep, and Hibernate modes. In Hibernate mode with RTC enabled and powered by VBAT, its typical current draw is 1.7 µA - verified per TI SPMS014I datasheet Section 6.3.6. This mode retains 2 KB of RAM and maintains RTC operation, enabling wake-up on alarm or external pin assertion. The LM3S1165-IBZ50-A2 achieves this ultra-low power state without external circuitry beyond a VBAT source.
Can the LM3S1165-IBZ50-A2 perform simultaneous ADC sampling and PWM generation?
Yes, the LM3S1165-IBZ50-A2 supports concurrent ADC conversion and PWM output updates via hardware synchronization. Its ADC can be triggered by PWM timer events (e.g., center-aligned PWM period start), and PWM generators can be updated synchronously with ADC end-of-conversion interrupts. This coordination is implemented in hardware without CPU intervention, ensuring deterministic timing for motor current sensing and commutation - a core capability confirmed in the LM3S1165-IBZ50-A2 datasheet Sections 11.3 and 9.3.
Is the LM3S1165-IBZ50-A2 pin-compatible with other Stellaris LM3S devices?
No, the LM3S1165-IBZ50-A2 is not universally pin-compatible across the Stellaris LM3S family. While it shares the 100-pin LQFP footprint with several variants (e.g., LM3S1968), pin functions differ significantly - particularly for hibernate signals (VBAT, HIB), USB, Ethernet, and enhanced analog features. The LM3S1165-IBZ50-A2 has unique assignments for its hibernation module and lacks pins reserved for USB or MII interfaces present in larger variants. Board-level compatibility must be verified per TI's pin multiplexing tables.
LM3S1165-IBZ50-A2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 108-LFBGA
- Series:
- Stellaris® ARM® Cortex®-M3S 1000
- Packaging:
- Tray
- Product Status:
- Not For New Designs
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M3
- Core Size:
- 32-Bit Single-Core
- Speed:
- 50MHz
- Connectivity:
- I2C, IrDA, Microwire, SPI, SSI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, POR, PWM, WDT
- Number of I/O:
- 43
- Program Memory Size:
- 64KB (64K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 16K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.25V ~ 2.75V
- Data Converters:
- A/D 4x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
LM3S1165-IBZ50-A2 FAQ
1.How can I place an order for LM3S1165-IBZ50-A2 through Aetrix?
Please submit a Request for Quotation (RFQ) for LM3S1165-IBZ50-A2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LM3S1165-IBZ50-A2 reliable?
The price and inventory of LM3S1165-IBZ50-A2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LM3S1165-IBZ50-A2 is usually 5 days.
3.What payment methods are accepted for LM3S1165-IBZ50-A2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LM3S1165-IBZ50-A2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LM3S1165-IBZ50-A2?
LM3S1165-IBZ50-A2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LM3S1165-IBZ50-A2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LM3S1165-IBZ50-A2?
For technical support, including LM3S1165-IBZ50-A2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LM3S1165-IBZ50-A2 requirements.
6.How does Aetrix verify that LM3S1165-IBZ50-A2 is sourced from the original manufacturer or authorized distributors?
All LM3S1165-IBZ50-A2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LM3S1165-IBZ50-A2 meets industry standards.
7.What is the process for return or replacement of LM3S1165-IBZ50-A2?
All LM3S1165-IBZ50-A2 units undergo pre-shipment inspection (PSI). If there is an issue with LM3S1165-IBZ50-A2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LM3S1165-IBZ50-A2 part is unused and in its original packaging.
Return procedure for LM3S1165-IBZ50-A2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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