Texas Instruments LM3S1439-IBZ50-A2
- Part No.:
- LM3S1439-IBZ50-A2
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 108-LFBGA
- Datasheet:
-
LM3S1439-IBZ50-A2.pdf
- Description:
- IC MCU 32BIT 96KB FLASH 108BGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
LM3S1439-IBZ50-A2 from Texas Instruments is a 32-bit ARM Cortex-M3 microcontroller with 256 KB flash, 32 KB SRAM, integrated hibernation module, 8-channel 12-bit ADC, and dual UARTs + I²C + SSI interfaces. It operates at 50 MHz and supports industrial temperature range (–40°C to +85°C) in a 100-pin LQFP package. Used in motor control, sensor hubs, and embedded automation systems requiring low-power operation with real-time responsiveness.
For engineers reviewing the LM3S1439-IBZ50-A2 datasheet, LM3S1439-IBZ50-A2 pinout, LM3S1439-IBZ50-A2 application, or LM3S1439-IBZ50-A2 equivalent, key selection criteria include its hibernation-enabled power management, on-chip RTC, battery-backed memory, and integrated analog peripherals for self-contained sensing and control without external support ICs.
Technical Context
The LM3S1439-IBZ50-A2 implements the ARM Cortex-M3 core with Thumb-2 instruction set, NVIC, SysTick timer, and MPU-enabling deterministic interrupt latency and memory protection. Its hibernation module includes a dedicated 32.768-kHz RTC, battery-backed RAM (2 KB), and wake-up sources including GPIO, RTC match, and external interrupts.
Analog integration comprises an 8-channel 12-bit ADC with hardware averaging and internal temperature sensor; digital peripherals include two UARTs (one with IrDA/SIR), two SSI ports, one I²C master/slave, eight 16/32-bit GPTMs, and PWM generator-all clocked from a flexible PLL-based system clock tree supporting multiple low-power modes.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-M3, 32-bit RISC, Thumb-2 instruction set, 50 MHz max operation |
| Flash Memory | 256 KB on-chip flash with 128-bit wide interface and erase/write protection |
| SRAM | 32 KB general-purpose SRAM, plus 2 KB battery-backed hibernation RAM |
| ADC | 8-channel 12-bit SAR ADC with up to 1 MSPS sample rate and hardware averaging |
| Hibernation Module | Integrated RTC, battery backup support, wake-on-GPIO/RTC/external interrupt |
| Peripherals | 2× UART (1 with IrDA), 2× SSI, 1× I²C, 8× GPTM, PWM, analog comparator, watchdog |
| Package | 100-pin LQFP (14 mm × 14 mm), RoHS-compliant, industrial temperature grade |
Pinout & Package
LM3S1439-IBZ50-A2 is housed in a 100-pin LQFP (Low-Profile Quad Flat Package) with 0.5 mm pitch, thermally enhanced exposed pad, and standard JEDEC MO-220 footprint. Pinout validated per TI SPMS017I datasheet Rev I (July 2014), Table 4-1 (Pin Assignments) and Figure 1-3 (High-Level Block Diagram).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VDDA, VDDC | Power supply inputs | Digital core (VDDC), analog (VDDA), and I/O (VDD) rails-require separate decoupling for noise isolation |
| GND, GNDA, GNDC | Ground returns | Analog ground (GNDA) must be isolated from digital ground to preserve ADC accuracy |
| OSC0/OSC1 | External crystal oscillator terminals | Supports 1–25 MHz crystal; internal oscillator enables boot without external components |
| HIB, RTCCLK, HIBRST | Hibernation control signals | Enable deep-sleep mode, provide RTC clock input, and reset hibernation logic independently |
| PA0–PA7, PB0–PB7, etc. | GPIO banks A–G | Configurable as digital I/O, alternate function (UART/SSI/I²C), or analog input (ADC channels) |
Key Features
| Feature | Design Value |
|---|---|
| Hibernation with RTC | Enables sub-µA sleep current with precise timekeeping and wake-up via RTC alarm or external event |
| Battery-backed RAM | 2 KB SRAM retains state during hibernation-preserves configuration, calibration data, or runtime context |
| Integrated analog front-end | 8-channel 12-bit ADC + internal temperature sensor eliminates need for external signal conditioning in sensor nodes |
| Dual UART with IrDA | One UART supports infrared communication (SIR protocol), enabling contactless diagnostics or remote firmware updates |
| Peripheral sharing on GPIO | Each GPIO pin supports up to 8 alternate functions-maximizes peripheral utilization without pin bloat |
Applications
| Industrial Motor Control | Smart Sensor Node |
|---|---|
Use Scenario: Closed-loop BLDC motor control in HVAC blowers or pump drives where thermal management and duty-cycle efficiency are critical. IC Role / Device Role / Timing Role: Main controller executing FOC algorithms, managing PWM generation, reading current/voltage feedback via ADC, and communicating status over UART. Use Value: Integrated hibernation allows safe shutdown during idle periods; on-chip RTC synchronizes maintenance alerts without external timing IC. | Use Scenario: Battery-powered environmental monitor measuring temperature, humidity, and air quality in remote industrial facilities. IC Role / Device Role / Timing Role: System-on-chip sensor aggregator-acquires analog sensor data, processes thresholds, logs events to flash, and transmits via UART or SSI to gateway. Use Value: 2 KB hibernation RAM preserves last valid readings and timestamps across power loss; internal temperature sensor reduces BOM count. |
| Programmable Logic Controller (PLC) I/O Module | Embedded HMI Controller |
Use Scenario: DIN-rail mounted I/O expansion module handling discrete inputs, relay outputs, and analog process signals in factory automation. IC Role / Device Role / Timing Role: Real-time I/O processor interfacing with optocoupled inputs, driving MOSFET outputs, and communicating via RS-485 (UART) to main PLC CPU. Use Value: Dual UARTs enable simultaneous debug port and fieldbus interface; GPIO commit registers prevent spurious output transitions during reconfiguration. | Use Scenario: Touch-enabled local operator interface for medical equipment or test instrumentation requiring responsive UI and secure local logging. IC Role / Device Role / Timing Role: Display controller managing SPI-driven TFT LCD, decoding touch panel input, and storing audit logs in flash with timestamp from RTC. Use Value: Hardware-accelerated bit-banding and NVIC prioritization ensure deterministic response to touch interrupts; battery-backed RAM stores last UI state after power cycle. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LM3S1968-IBZ50-A2 | Same core and package, but 256 KB flash + 64 KB SRAM; adds Ethernet MAC + PHY interface | Suitable for networked edge devices requiring TCP/IP stack and wired connectivity | Select when Ethernet is required; otherwise LM3S1439-IBZ50-A2 offers lower cost and smaller code footprint |
| TM4C123GH6PM | Successor family with same pinout, 80 MHz Cortex-M4F core, FPU, enhanced ADC, and updated peripherals | Required for floating-point math, higher throughput, or long-term design continuity beyond LM3S EOL | Choose TM4C123GH6PM for new designs needing extended lifecycle support and performance uplift |
Compared with LM3S1439-IBZ50-A2, LM3S1968-IBZ50-A2 adds Ethernet capability at higher SRAM cost, while TM4C123GH6PM delivers architectural upgrades (M4F, FPU, longer product availability) but requires minor software adaptation due to peripheral register changes.
Availability
LM3S1439-IBZ50-A2 is available at Aetrix Electronics and suitable for industrial motor control, smart sensor nodes, PLC I/O modules, and embedded HMI controllers requiring stable component supply across multi-year production cycles.
Supply support for LM3S1439-IBZ50-A2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, delivering analog, embedded processing, and wireless technologies since 1930.
The Stellaris LM3S series was designed as the first ARM Cortex-M3-based MCU family for cost-sensitive, power-aware industrial and automation applications-emphasizing integration of analog, timing, and communication peripherals in a single chip.
FAQ
What is the maximum operating frequency of the LM3S1439-IBZ50-A2?
The LM3S1439-IBZ50-A2 operates at a maximum system clock frequency of 50 MHz, derived from its internal PLL that accepts input from either the main oscillator (1–25 MHz crystal) or internal precision oscillator. This frequency is specified under industrial temperature conditions (–40°C to +85°C) and meets all timing requirements for its integrated peripherals including ADC, UART, and PWM modules.
Does the LM3S1439-IBZ50-A2 support hibernation mode with RTC functionality?
Yes, the LM3S1439-IBZ50-A2 includes a dedicated hibernation module with a 32.768-kHz RTC, battery-backed RAM (2 KB), and multiple wake-up sources-including RTC match, external GPIO interrupts, and hibernate request signals. The hibernation current is specified at 1.7 µA typical, enabling years of operation on small coin-cell batteries in sensor applications.
How many analog input channels does the LM3S1439-IBZ50-A2 ADC support?
The LM3S1439-IBZ50-A2 integrates an 8-channel, 12-bit successive approximation register (SAR) ADC capable of up to 1 million samples per second. Channels can be configured for single-ended or differential acquisition, and the ADC includes hardware sample averaging (2x–64x) and an internal temperature sensor-eliminating the need for external analog front-end components in most sensing applications.
Is the LM3S1439-IBZ50-A2 pin-compatible with other Stellaris LM3S devices?
The LM3S1439-IBZ50-A2 uses a 100-pin LQFP package shared with several LM3S family members (e.g., LM3S1968, LM3S8962), but pin compatibility is not guaranteed across all variants due to differences in peripheral mapping and alternate function assignments. Engineers must verify pinout tables in the respective datasheets-especially for UART, SSI, and I²C signal locations-before assuming drop-in replacement.
What development tools are officially supported for the LM3S1439-IBZ50-A2?
Texas Instruments officially supports the LM3S1439-IBZ50-A2 with StellarisWare Peripheral Driver Library, Code Composer Studio v5–v6, and IAR Embedded Workbench for ARM. Hardware debugging is enabled via JTAG/SWD using TI's ICDI-based debug probes (e.g., Tiva C Series LaunchPad with LM4F120H5QR) or third-party adapters compliant with ARM CoreSight standards.
LM3S1439-IBZ50-A2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 108-LFBGA
- Series:
- Stellaris® ARM® Cortex®-M3S 1000
- Packaging:
- Tray
- Product Status:
- Not For New Designs
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M3
- Core Size:
- 32-Bit Single-Core
- Speed:
- 50MHz
- Connectivity:
- I2C, IrDA, Microwire, QEI, SPI, SSI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, POR, PWM, WDT
- Number of I/O:
- 52
- Program Memory Size:
- 96KB (96K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 32K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.25V ~ 2.75V
- Data Converters:
- A/D 4x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
LM3S1439-IBZ50-A2 FAQ
1.How can I place an order for LM3S1439-IBZ50-A2 through Aetrix?
Please submit a Request for Quotation (RFQ) for LM3S1439-IBZ50-A2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LM3S1439-IBZ50-A2 reliable?
The price and inventory of LM3S1439-IBZ50-A2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LM3S1439-IBZ50-A2 is usually 5 days.
3.What payment methods are accepted for LM3S1439-IBZ50-A2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LM3S1439-IBZ50-A2 transactions.
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LM3S1439-IBZ50-A2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LM3S1439-IBZ50-A2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LM3S1439-IBZ50-A2?
For technical support, including LM3S1439-IBZ50-A2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LM3S1439-IBZ50-A2 requirements.
6.How does Aetrix verify that LM3S1439-IBZ50-A2 is sourced from the original manufacturer or authorized distributors?
All LM3S1439-IBZ50-A2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LM3S1439-IBZ50-A2 meets industry standards.
7.What is the process for return or replacement of LM3S1439-IBZ50-A2?
All LM3S1439-IBZ50-A2 units undergo pre-shipment inspection (PSI). If there is an issue with LM3S1439-IBZ50-A2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LM3S1439-IBZ50-A2 part is unused and in its original packaging.
Return procedure for LM3S1439-IBZ50-A2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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