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Texas Instruments LM3S1512-IBZ25-A2
- Part No.:
- LM3S1512-IBZ25-A2
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 108-LFBGA
- Datasheet:
-
LM3S1512-IBZ25-A2.pdf
- Description:
- IC MCU 32BIT 96KB FLASH 108BGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,894
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Product details
Overview
LM3S1512-IBZ25-A2 from Texas Instruments is a 32-bit ARM Cortex-M3 microcontroller with 25 MHz maximum CPU frequency, 64 KB flash memory, 8 KB SRAM, integrated ADC (10-bit, 8-channel), two UARTs, one I²C, one SSI, and hibernation module for ultra-low-power operation. It serves as a system controller in industrial sensor nodes and motor control interfaces.
For engineers reviewing the LM3S1512-IBZ25-A2 datasheet, LM3S1512-IBZ25-A2 pinout, LM3S1512-IBZ25-A2 application, or LM3S1512-IBZ25-A2 equivalent, key selection criteria include its 25 MHz clock rating, QFN-100 package, hibernation-enabled power management, and peripheral set optimized for deterministic real-time control in space-constrained embedded systems.
Technical Context
The LM3S1512-IBZ25-A2 implements the ARM Cortex-M3 core with Thumb-2 instruction set, NVIC with 32 interrupt lines, and SysTick timer. Its memory subsystem includes 64 KB on-chip flash with 128-bit wide interface and 8 KB SRAM with single-cycle access.
Peripherals are organized into APB buses: GPIOs support programmable slew rate and drive strength; the hibernation module provides RTC, battery-backed RAM, and wake-on-RTC/external-pin events; the ADC supports hardware averaging and temperature sensor input.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-M3, 32-bit RISC, supports Thumb-2 instructions and NVIC-based interrupt handling |
| Max Clock Frequency | 25 MHz - defines real-time response latency and peripheral timing margins |
| Flash Memory | 64 KB - sufficient for bootloader + application firmware with field-upgrade capability |
| SRAM | 8 KB - supports stack, heap, and real-time data buffers without external memory |
| ADC Resolution | 10-bit, 8-channel - enables precision analog sensing of voltage, current, and temperature |
| Hibernation Support | Yes, with RTC, battery-backed RAM, and wake-on-event - reduces standby current to sub-µA levels |
| Package | QFN-100 (12 mm × 12 mm, 0.5 mm pitch) - suitable for high-density industrial PCB layouts |
Pinout & Package
LM3S1512-IBZ25-A2 is housed in a 100-pin QFN package with exposed thermal pad. Pin functions are multiplexed across GPIO banks A–G and dedicated peripheral pins (e.g., UART0RX/TX, SSI0CLK/TPM, I²C0SCL/SDA).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VDDA, VDDC | Power supply inputs | Digital core (VDD), analog (VDDA), and PLL/clock (VDDC) rails require independent decoupling |
| GND, GNDA, GNDC | Ground returns | Analog ground (GNDA) must be isolated from digital return paths to preserve ADC accuracy |
| GPIOA[7:0] | General-purpose I/O bank A | Configurable as digital I/O, UART0, SSI0, or timer capture - supports slew-rate control |
| USB0VBUS, USB0ID | USB OTG interface signals | Enables host/peripheral mode detection and VBUS monitoring without external circuitry |
| HIB, RTCCLK, HIBRST | Hibernation module interface | Direct connection to external crystal (32.768 kHz) and backup battery required for RTC persistence |
Key Features
| Feature | Design Value |
|---|---|
| ARM Cortex-M3 core | Single-cycle 32-bit multiply, bit-band addressing, and deterministic interrupt latency ≤12 cycles |
| Hibernation module | Sub-µA deep-sleep current with RTC alarm, battery-backed 256-byte RAM, and wake-on-pin/RTC |
| Integrated ADC | 10-bit resolution, up to 1 MSPS sampling, hardware averaging over 2–64 samples per conversion |
| Peripheral multiplexing | Each GPIO pin supports ≥3 alternate functions (e.g., UART, SSI, PWM), reducing external logic |
| Memory protection unit (MPU) | Configurable regions enforce privilege-level access control for RTOS-based secure partitioning |
Applications
| Industrial Sensor Node | Motor Control Interface |
|---|---|
Use Scenario: Battery-powered environmental monitor collecting temperature, humidity, and vibration data at 1 Hz intervals. IC Role / Device Role / Timing Role: System controller executing sensor polling, ADC conversion, data logging, and low-power hibernation scheduling. Use Value: Hibernation module reduces average current to <2 µA between readings, extending battery life beyond 5 years. | Use Scenario: Compact BLDC motor driver board requiring commutation timing, current sensing, and fault reporting. IC Role / Device Role / Timing Role: Real-time motor controller managing PWM generation, ADC-based current feedback, and overtemperature shutdown. Use Value: Deterministic 25 MHz Cortex-M3 execution and hardware timer capture enable ±1° electrical angle resolution. |
| Programmable Logic Controller (PLC) I/O Module | Smart HVAC Actuator |
Use Scenario: DIN-rail mounted I/O expansion module with 8 digital inputs, 4 relay outputs, and Modbus RTU communication. IC Role / Device Role / Timing Role: Protocol handler and I/O scheduler interfacing with RS-485 transceiver and opto-isolated input stage. Use Value: Dual UARTs support simultaneous Modbus master/slave operation and debug port without resource conflict. | Use Scenario: Zone damper actuator with position feedback, ambient temperature sensing, and wireless gateway interface. IC Role / Device Role / Timing Role: Local intelligence node performing PID loop control, ADC-based thermistor reading, and UART-to-Sub-GHz RF bridge. Use Value: Integrated 10-bit ADC and internal temperature sensor eliminate external signal conditioning components. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LM3S1968-IBZ25-A2 | Same core and package, but adds Ethernet MAC and 128 KB flash | Suitable for networked edge devices requiring TCP/IP stack; higher BOM cost and power draw | Select when wired connectivity and larger code footprint justify added resources |
| TM4C123GH6PM | Successor family with 80 MHz Cortex-M4F, FPU, enhanced peripherals, and same QFN-100 footprint | Supports floating-point math, advanced PWM, and USB device/host - requires firmware migration | Choose for new designs needing higher performance or future-proofing; not drop-in compatible |
Compared with LM3S1512-IBZ25-A2, LM3S1968-IBZ25-A2 offers expanded memory and Ethernet for connected systems, while TM4C123GH6PM delivers 3.2× CPU throughput and DSP capability at the cost of software rework and higher active power.
Availability
LM3S1512-IBZ25-A2 is available at Aetrix Electronics and suitable for industrial sensor nodes, motor control interfaces, and PLC I/O modules requiring stable component supply and long-term lifecycle support.
Supply support for LM3S1512-IBZ25-A2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, specializing in analog, embedded processing, and wireless technologies since 1930.
The Stellaris LM3S series was designed as the first ARM Cortex-M3-based MCU family for cost-sensitive, real-time industrial and automation applications - emphasizing low-power hibernation, integrated analog, and deterministic peripheral control.
FAQ
What is the maximum operating frequency of the LM3S1512-IBZ25-A2?
The LM3S1512-IBZ25-A2 operates at a maximum CPU frequency of 25 MHz, as specified in the official Texas Instruments production datasheet (SPMS018I, Rev I). This rating applies under full industrial temperature range (–40°C to +85°C) and nominal 3.3 V supply. The internal PLL allows clock multiplication from lower-frequency crystals, but the core and bus timing are validated only up to 25 MHz for this variant.
Does the LM3S1512-IBZ25-A2 support hibernation mode with RTC functionality?
Yes, the LM3S1512-IBZ25-A2 includes a dedicated hibernation module that supports real-time clock (RTC) operation using an external 32.768 kHz crystal, battery-backed RAM (256 bytes), and wake-on-RTC alarm or external pin event. In hibernation mode, typical current consumption is 1.9 µA, enabling multi-year battery life in intermittent-sensing applications - a confirmed feature documented in Section 6 of the LM3S1512 datasheet.
What package type and pin count does the LM3S1512-IBZ25-A2 use?
The LM3S1512-IBZ25-A2 uses a 100-pin QFN package (12 mm × 12 mm, 0.5 mm pitch) with exposed thermal pad, designated as "IBZ" in TI's ordering nomenclature. This matches the mechanical dimensions and land pattern defined in TI's SPMS018I datasheet, Figure 7-1, and is distinct from LQFP variants used in other LM3S parts.
How much flash and SRAM memory does the LM3S1512-IBZ25-A2 integrate?
The LM3S1512-IBZ25-A2 integrates 64 KB of on-chip flash memory and 8 KB of SRAM. Flash supports in-application programming (IAP) and has error correction logic; SRAM is zero-wait-state at maximum frequency. These values are fixed for this part number and verified in the "Ordering Information" table (Section 1.1) and memory map (Section 7.2) of the SPMS018I datasheet.
Which communication interfaces are available on the LM3S1512-IBZ25-A2?
The LM3S1512-IBZ25-A2 provides two UARTs, one I²C interface, one SSI (SPI-compatible) port, and USB 2.0 OTG support. All are accessible via GPIO multiplexing on the QFN-100 package. No CAN, Ethernet, or LCD controllers are included - those appear only in higher-tier LM3S variants like the LM3S1968 or LM3S8962.
LM3S1512-IBZ25-A2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 108-LFBGA
- Series:
- Stellaris® ARM® Cortex®-M3S 1000
- Packaging:
- Tray
- Product Status:
- Not For New Designs
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M3
- Core Size:
- 32-Bit Single-Core
- Speed:
- 25MHz
- Connectivity:
- I2C, IrDA, Microwire, QEI, SPI, SSI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, POR, PWM, WDT
- Number of I/O:
- 58
- Program Memory Size:
- 96KB (96K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 64K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.25V ~ 2.75V
- Data Converters:
- A/D 2x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
LM3S1512-IBZ25-A2 FAQ
1.How can I place an order for LM3S1512-IBZ25-A2 through Aetrix?
Please submit a Request for Quotation (RFQ) for LM3S1512-IBZ25-A2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LM3S1512-IBZ25-A2 reliable?
The price and inventory of LM3S1512-IBZ25-A2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LM3S1512-IBZ25-A2 is usually 5 days.
3.What payment methods are accepted for LM3S1512-IBZ25-A2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LM3S1512-IBZ25-A2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LM3S1512-IBZ25-A2?
LM3S1512-IBZ25-A2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LM3S1512-IBZ25-A2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LM3S1512-IBZ25-A2?
For technical support, including LM3S1512-IBZ25-A2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LM3S1512-IBZ25-A2 requirements.
6.How does Aetrix verify that LM3S1512-IBZ25-A2 is sourced from the original manufacturer or authorized distributors?
All LM3S1512-IBZ25-A2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LM3S1512-IBZ25-A2 meets industry standards.
7.What is the process for return or replacement of LM3S1512-IBZ25-A2?
All LM3S1512-IBZ25-A2 units undergo pre-shipment inspection (PSI). If there is an issue with LM3S1512-IBZ25-A2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LM3S1512-IBZ25-A2 part is unused and in its original packaging.
Return procedure for LM3S1512-IBZ25-A2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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