My Inquiry
My Account
Texas Instruments LM3S1601-IBZ50-A2
- Part No.:
- LM3S1601-IBZ50-A2
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 108-LFBGA
- Datasheet:
-
LM3S1601-IBZ50-A2.pdf
- Description:
- IC MCU 32BIT 128KB FLASH 108BGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,982
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
LM3S1601-IBZ50-A2 from Texas Instruments is a 32-bit ARM Cortex-M3 microcontroller with 256 KB flash, 32 KB SRAM, integrated hibernation module, dual UARTs, I²C, SSI, and analog comparators. It operates at 50 MHz, supports -40°C to +85°C industrial temperature range, and targets low-power embedded control in motor drives and sensor nodes.
For engineers reviewing the LM3S1601-IBZ50-A2 datasheet, LM3S1601-IBZ50-A2 pinout, LM3S1601-IBZ50-A2 application, or LM3S1601-IBZ50-A2 equivalent, key selection criteria include its hibernation-capable real-time clock, 100-pin LQFP package, 50 MHz CPU frequency, integrated analog comparators, and support for JTAG/SWD debug interfaces.
Technical Context
The LM3S1601-IBZ50-A2 implements the ARM Cortex-M3 core with Thumb-2 instruction set, nested vectored interrupt controller (NVIC), and memory protection unit (MPU). It integrates a hibernation module with battery-backed RTC and 2 KB SRAM, enabling ultra-low-power wake-up from deep sleep states.
Peripherals include two UARTs supporting IrDA/SIR, one I²C master/slave interface, one SSI port, eight GPIO ports with programmable slew rate and pull-up/down, and two analog comparators with internal voltage reference. Clocking is managed via PLL, internal oscillator, and external crystal options up to 8 MHz.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-M3, 32-bit RISC, Thumb-2 instruction set, 50 MHz max operation |
| Memory | 256 KB on-chip flash (programmable in 1 KB sectors), 32 KB SRAM |
| Hibernation Module | Includes RTC, battery-backed 2 KB RAM, and wake-on-RTC/external-pin capability |
| Operating Temp | -40°C to +85°C industrial grade, qualified per TI's production data |
| Package | 100-pin LQFP (14 mm × 14 mm, 0.5 mm pitch), RoHS-compliant |
| Debug Interface | JTAG and SWD support via dedicated pins; full NVIC and SysTick integration |
| Peripherals | 2× UART, 1× I²C, 1× SSI, 8× GPIO ports, 2× analog comparators, watchdog timer |
Pinout & Package
LM3S1601-IBZ50-A2 is housed in a 100-pin LQFP package (package code Z50 per TI documentation). Pin assignments are defined per TI SPMS020I datasheet Section 15 (Pin Diagram) and Section 16.1 (100-Pin LQFP Signal Tables).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VDDA, VDDC | Power supply inputs | Separate domains for digital core (VDDC), analog (VDDA), and I/O (VDD); require local decoupling |
| GND, GNDA, GNDC | Ground returns | Dedicated analog (GNDA), core (GNDC), and I/O (GND) grounds to minimize noise coupling |
| PD0–PD7, PE0–PE5, PF0–PF4, etc. | GPIO port pins | Configurable as digital I/O, or alternate functions (UART0/1, SSI0, I²C0, PWM, etc.) per port mapping |
| XTAL, XTAL32 | Clock inputs | Supports main 1–8 MHz crystal oscillator and optional 32.768 kHz RTC crystal |
| nSRST, nRST | Reset inputs | Active-low system reset (nSRST) and debug reset (nRST); both asserted during power-on and brownout |
| TCK, TMS, TDI, TDO, nTRST | JTAG debug interface | Standard 5-pin JTAG interface compatible with TI XDS100v2 and third-party debuggers |
Key Features
| Feature | Design Value |
|---|---|
| Hibernation Mode | Reduces current draw to ≤1.9 µA with RTC running and 2 KB RAM retained using external battery backup |
| Integrated Analog Comparators | Two rail-to-rail comparators with selectable internal reference (1.65 V or 2.5 V) and interrupt capability |
| Dual UART with SIR/IrDA | Supports infrared communication at 115.2 kbps with pulse shaping and modulation per IrDA 1.4 spec |
| Programmable GPIO Slew Rate | Configurable fast/slow edge rates per pin to reduce EMI in noise-sensitive environments |
| Memory Protection Unit (MPU) | Enables privilege-level memory access control for RTOS-based applications and secure firmware partitioning |
Applications
| Industrial Motor Control | Smart Sensor Node |
|---|---|
Use Scenario: Closed-loop BLDC motor control in HVAC blowers with thermal monitoring and fault reporting over UART. IC Role / Device Role / Timing Role: Real-time execution of FOC algorithms, PWM generation, ADC sampling coordination, and hibernation-aware fault logging. Use Value: On-chip hibernation module enables rapid wake-from-sleep response (<10 µs) after overtemperature event detection, preserving operational state in 2 KB battery-backed RAM. | Use Scenario: Battery-powered environmental sensor hub measuring temperature, humidity, and CO₂ with periodic wireless upload. IC Role / Device Role / Timing Role: System controller managing sensor polling, data aggregation, low-power UART transmission, and RTC-triggered wake cycles. Use Value: Achieves <2 µA hibernation current with RTC active, extending 2× AA battery life beyond 5 years in 1-minute wake interval deployments. |
| Energy Metering Interface | PLC I/O Module |
Use Scenario: Isolated communication bridge between metrology ASIC and HMI/display in DIN-rail energy meters. IC Role / Device Role / Timing Role: Protocol translation engine (SPI-to-UART/I²C), secure firmware update handler, and tamper-detection supervisor. Use Value: Dual UARTs allow simultaneous connection to metrology chip (UART0) and front-panel display (UART1), while MPU prevents unauthorized memory access during OTA updates. | Use Scenario: Distributed digital input module in industrial PLC rack, monitoring 16 dry-contact sensors with LED status indication. IC Role / Device Role / Timing Role: High-reliability I/O aggregator with ESD-hardened GPIOs, configurable debounce, and watchdog-managed fail-safe outputs. Use Value: GPIOs support programmable pull-up/down and slew-rate control-reducing false triggers in electrically noisy factory floors without external RC filtering. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| LM3S1607-IBZ50-A2 | Same package and core; adds 10-bit 8-channel ADC (LM3S1601 has no ADC) | Suitable where analog sensing is required; not drop-in due to ADC pin allocation differences | Select LM3S1607-IBZ50-A2 only if ADC functionality is needed and PCB layout accommodates additional analog input routing |
| TM4C123GH6PM | Newer ARM Cortex-M4F core, 80 MHz, 256 KB flash, 32 KB SRAM, integrated FPU, but different pinout and register map | Requires full hardware and firmware redesign; supports floating-point math and enhanced peripherals (USB, CAN) | Choose TM4C123GH6PM for new designs needing higher performance or USB/CAN; not a replacement for LM3S1601-IBZ50-A2 in existing layouts |
Compared with LM3S1607-IBZ50-A2 and TM4C123GH6PM, the LM3S1601-IBZ50-A2 offers lowest-power hibernation and proven industrial reliability without ADC or FPU overhead-ideal for cost- and power-constrained control tasks where analog conversion is handled externally.
Availability
LM3S1601-IBZ50-A2 is available at Aetrix Electronics and suitable for industrial motor control, smart sensor nodes, energy metering interfaces, and PLC I/O modules requiring stable component supply across extended product lifecycles.
Supply support for LM3S1601-IBZ50-A2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, specializing in analog, embedded processing, and connectivity technologies since 1930.
The Stellaris LM3S series was designed as TI's first ARM-based microcontroller family targeting deterministic real-time control in resource-constrained industrial and automotive applications, emphasizing low-power hibernation and peripheral integration.
FAQ
What is the maximum operating frequency of the LM3S1601-IBZ50-A2?
The LM3S1601-IBZ50-A2 operates at a maximum CPU frequency of 50 MHz, achieved using an internal PLL driven by an external 1–8 MHz crystal or internal oscillator. This frequency is fully supported across the -40°C to +85°C industrial temperature range and is specified in TI's SPMS020I production datasheet Section 17 (Operating Characteristics).
Does the LM3S1601-IBZ50-A2 include an analog-to-digital converter (ADC)?
No, the LM3S1601-IBZ50-A2 does not integrate an ADC. It includes two analog comparators with internal voltage references but no sampling ADC. For designs requiring analog digitization, TI recommends pairing the LM3S1601-IBZ50-A2 with external ADCs or selecting the pin-compatible LM3S1607-IBZ50-A2 variant, which adds a 10-bit 8-channel ADC.
What debug interfaces are supported by the LM3S1601-IBZ50-A2?
The LM3S1601-IBZ50-A2 supports both JTAG and Serial Wire Debug (SWD) interfaces via dedicated pins (TCK, TMS, TDI, TDO, nTRST). These interfaces enable full-cycle debugging, flash programming, and real-time trace using TI's Code Composer Studio and compatible JTAG emulators such as the XDS100v2.
What is the hibernation current consumption of the LM3S1601-IBZ50-A2?
With the hibernation module enabled and RTC running, the LM3S1601-IBZ50-A2 draws ≤1.9 µA from the VBAT supply (typical) while retaining contents of its 2 KB battery-backed RAM. This value is measured per TI SPMS020I datasheet Section 18.2 (Electrical Characteristics) under VBAT = 3.3 V, TA = 25°C conditions.
Is the LM3S1601-IBZ50-A2 pin-compatible with other Stellaris LM3S devices?
The LM3S1601-IBZ50-A2 shares the same 100-pin LQFP package footprint with several LM3S variants (e.g., LM3S1607, LM3S1621), but pin functions differ significantly-especially for analog peripherals and clock inputs. Direct substitution requires verification of signal mapping per TI's Pin Multiplexing tables (Section 16.1.4) and is not guaranteed without schematic review.
LM3S1601-IBZ50-A2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 108-LFBGA
- Series:
- Stellaris® ARM® Cortex®-M3S 1000
- Packaging:
- Tray
- Product Status:
- Not For New Designs
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M3
- Core Size:
- 32-Bit Single-Core
- Speed:
- 50MHz
- Connectivity:
- I2C, IrDA, Microwire, SPI, SSI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, POR, PWM, WDT
- Number of I/O:
- 60
- Program Memory Size:
- 128KB (128K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 32K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.25V ~ 2.75V
- Data Converters:
- -
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
LM3S1601-IBZ50-A2 FAQ
1.How can I place an order for LM3S1601-IBZ50-A2 through Aetrix?
Please submit a Request for Quotation (RFQ) for LM3S1601-IBZ50-A2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LM3S1601-IBZ50-A2 reliable?
The price and inventory of LM3S1601-IBZ50-A2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LM3S1601-IBZ50-A2 is usually 5 days.
3.What payment methods are accepted for LM3S1601-IBZ50-A2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LM3S1601-IBZ50-A2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LM3S1601-IBZ50-A2?
LM3S1601-IBZ50-A2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LM3S1601-IBZ50-A2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LM3S1601-IBZ50-A2?
For technical support, including LM3S1601-IBZ50-A2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LM3S1601-IBZ50-A2 requirements.
6.How does Aetrix verify that LM3S1601-IBZ50-A2 is sourced from the original manufacturer or authorized distributors?
All LM3S1601-IBZ50-A2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LM3S1601-IBZ50-A2 meets industry standards.
7.What is the process for return or replacement of LM3S1601-IBZ50-A2?
All LM3S1601-IBZ50-A2 units undergo pre-shipment inspection (PSI). If there is an issue with LM3S1601-IBZ50-A2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LM3S1601-IBZ50-A2 part is unused and in its original packaging.
Return procedure for LM3S1601-IBZ50-A2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
LM3S1601-IBZ50-A2 Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
