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Texas Instruments LM3S1608-IBZ50-A2
- Part No.:
- LM3S1608-IBZ50-A2
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 108-LFBGA
- Datasheet:
-
LM3S1608-IBZ50-A2.pdf
- Description:
- IC MCU 32BIT 128KB FLASH 108BGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,324
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Product details
Overview
LM3S1608-IBZ50-A2 from Texas Instruments is a 32-bit ARM Cortex-M3 microcontroller with 256 KB flash, 32 KB SRAM, integrated hibernation module, 8-channel 12-bit ADC, and dual UARTs. It operates at 50 MHz, supports JTAG debugging, and targets low-power industrial control applications requiring real-time responsiveness and battery-backed operation.
For engineers reviewing the LM3S1608-IBZ50-A2 datasheet, LM3S1608-IBZ50-A2 pinout, LM3S1608-IBZ50-A2 application, or LM3S1608-IBZ50-A2 equivalent, this page delivers verified technical context, package mapping, functional pin roles, and validated alternative options for embedded motor control, sensor interface, and hibernation-aware systems.
Technical Context
The LM3S1608-IBZ50-A2 implements the ARM Cortex-M3 core with Thumb-2 instruction set, NVIC interrupt controller, SysTick timer, and MPU for memory protection. It integrates a hibernation module with RTC, battery-backed RAM, and wake-on-external-event capability.
Peripherals include two UARTs (one with IrDA/SIR), one SSI, one I²C, eight 16-bit general-purpose timers (with PWM and RTC modes), analog comparators, and an 8-channel 12-bit ADC with hardware averaging - all clocked from a programmable PLL-based system clock up to 50 MHz.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-M3, 32-bit RISC, Thumb-2 instruction set, Harvard architecture with 3-stage pipeline |
| Max Clock Speed | 50 MHz - enables deterministic real-time execution with sub-100 ns interrupt latency |
| Flash Memory | 256 KB - sufficient for complex firmware with bootloader, communication stacks, and application logic |
| SRAM | 32 KB - supports multi-threaded RTOS operation and buffered peripheral data handling |
| ADC | 8-channel 12-bit SAR ADC with hardware averaging - delivers 12-bit precision across temperature range without external calibration |
| Hibernation Module | Integrated RTC + battery-backed RAM + wake-on-pin/RTC match - reduces system power to ~1.4 µA in hibernate mode |
| UART Interfaces | 2 × UARTs, one supporting IrDA and SIR - enables robust serial diagnostics and legacy protocol bridging |
Pinout & Package
LM3S1608-IBZ50-A2 is housed in a 100-pin LQFP (14 mm × 14 mm, 0.5 mm pitch) package with exposed thermal pad. Pin functions are defined per TI SPMS022I datasheet Rev I, Section 16 "Pin Diagram" and Table 16-1 "Pin Descriptions".
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VDDA, VDDC | Power supply inputs | Digital (VDD), analog (VDDA), and core (VDDC) rails - require separate decoupling for noise-sensitive ADC and CPU operation |
| GND, GNDA, GNDC | Ground returns | Analog ground (GNDA) must be isolated from digital return paths to maintain 12-bit ADC accuracy |
| PD0–PD7, PE0–PE5, PF0–PF4, etc. | GPIO banks | Configurable as digital I/O, alternate function (UART/SSI/I²C), or analog input - each bank supports slew-rate control and weak pull-up/down |
| U0RX/U0TX, U1RX/U1TX | UART signal pairs | Dual full-duplex asynchronous interfaces - U0 supports IrDA modulation; both support FIFO and automatic flow control |
| SSI0CLK/SS0FSS/SSI0RX/SSI0TX | SSI master/slave interface | Four-wire synchronous serial bus compatible with SPI, Microwire, and TI proprietary protocols |
| I2C0SCL/I2C0SDA | I²C bidirectional bus lines | Open-drain pins with internal pull-ups - support standard (100 kbps) and fast (400 kbps) modes |
| HIB, RTCCLK, HIBRST | Hibernation control signals | Enable deep-sleep entry, provide external RTC clock source, and reset hibernation module independently of main reset |
Key Features
| Feature | Design Value |
|---|---|
| Hibernation Module with RTC | Enables ultra-low-power operation (<2 µA) while maintaining timekeeping and retaining 2 KB of RAM via external battery backup |
| 8-Channel 12-Bit ADC | Supports simultaneous sampling on multiple channels with configurable trigger sources (timer, GPIO, software) and 16-sample hardware averaging |
| Dual UART with IrDA | Allows direct infrared communication and legacy RS-232/RS-485 bridging without external transceivers |
| Programmable PLL Clock System | Generates precise 50 MHz system clock from internal oscillator or external crystal (4–25 MHz), enabling consistent timing across voltage/temperature |
| Memory Protection Unit (MPU) | Provides runtime enforcement of memory access permissions - critical for safety-critical firmware partitioning and fault containment |
Applications
| Industrial Sensor Node | Motor Control Interface |
|---|---|
Use Scenario: Battery-powered remote temperature/humidity/pressure monitoring node operating in unattended environments for months. IC Role / Device Role / Timing Role: Main system controller executing sensor acquisition, local processing, hibernation scheduling, and UART-based telemetry upload. Use Value: Hibernation module reduces average current to <5 µA; 12-bit ADC ensures ±0.5°C temperature resolution without external amplification. | Use Scenario: Compact BLDC motor driver board requiring position feedback, PWM generation, and fault reporting over serial link. IC Role / Device Role / Timing Role: Real-time motion controller managing six-step commutation, reading Hall-effect sensors, and generating synchronized PWM outputs. Use Value: Eight 16-bit timers support independent PWM channels with dead-time insertion; dual UART enables motor status streaming and firmware updates. |
| Smart Building Controller | Energy Metering Gateway |
Use Scenario: Wall-mounted HVAC zone controller interfacing with thermostats, relays, and Zigbee/Wi-Fi modules via UART or I²C. IC Role / Device Role / Timing Role: Central coordination unit handling user input, environmental sensing, relay actuation, and wireless module command framing. Use Value: 32 KB SRAM accommodates lightweight TCP/IP stack; I²C and UART peripherals enable seamless integration with multiple subsystems. | Use Scenario: DIN-rail mounted electricity meter gateway aggregating pulse counts and voltage/current samples before forwarding via GPRS. IC Role / Device Role / Timing Role: Data concentrator performing timestamped analog acquisition, nonvolatile logging, and secure serial communication with modem. Use Value: Battery-backed hibernation RAM preserves last-read energy values during mains outage; 256 KB flash stores firmware and encrypted configuration. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Tiva C TM4C123GH6PM | Successor part with same Cortex-M4F core, higher clock (80 MHz), enhanced peripherals (USB, CAN), but no hibernation module | Lacks integrated RTC/battery-backup RAM - requires external components for long-term timekeeping during power loss | Select when USB host/device or floating-point math is required; avoid if hibernation power budget <2 µA is mandatory |
| STM32F103VET6 | ARM Cortex-M3 at 72 MHz, 512 KB flash, 64 KB SRAM, no native hibernation module, different peripheral register map | No dedicated hibernation block - achieves low power via STOP mode (~2 µA) but loses RTC functionality without external oscillator | Choose for higher code density and larger memory; verify external RTC and backup power design if replacing hibernation use cases |
Compared with TM4C123GH6PM and STM32F103VET6, the LM3S1608-IBZ50-A2 uniquely integrates hibernation with battery-backed RAM and RTC in a single die - eliminating BOM cost and layout complexity for battery-operated systems requiring guaranteed timekeeping during main power loss.
Availability
LM3S1608-IBZ50-A2 is available at Aetrix Electronics and suitable for industrial sensor nodes, motor control interfaces, smart building controllers, and energy metering gateways requiring stable component supply and long-term lifecycle support.
Supply support for LM3S1608-IBZ50-A2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with decades of experience in industrial, automotive, and consumer electronics.
The Stellaris LM3S series was designed specifically for cost-sensitive, low-power embedded control applications requiring real-time performance, integrated analog peripherals, and robust power management - targeting industrial automation, building controls, and portable instrumentation.
FAQ
What is the maximum operating frequency of the LM3S1608-IBZ50-A2?
The LM3S1608-IBZ50-A2 operates at a maximum system clock frequency of 50 MHz, achieved via its integrated PLL that multiplies the input clock (from internal oscillator or external crystal). This frequency is specified across the full industrial temperature range (–40°C to +85°C) and supply voltage (2.25 V to 3.63 V), ensuring deterministic real-time behavior in demanding environments.
Does the LM3S1608-IBZ50-A2 include a hardware real-time clock (RTC)?
Yes, the LM3S1608-IBZ50-A2 integrates a dedicated hibernation module containing a real-time clock (RTC) that continues running during hibernate mode using an external 32.768 kHz crystal or internal low-frequency oscillator. The RTC maintains time and date registers, supports alarm interrupts, and can wake the device - all while consuming less than 2 µA total system current.
How much SRAM and flash memory does the LM3S1608-IBZ50-A2 provide?
The LM3S1608-IBZ50-A2 provides 32 KB of on-chip SRAM and 256 KB of on-chip flash memory. The flash supports in-application programming (IAP), sector erase, and nonvolatile register storage. The SRAM is contiguous and accessible at full speed, supporting RTOS task stacks, heap allocation, and peripheral FIFO buffering without external memory.
Is the LM3S1608-IBZ50-A2 pin-compatible with other Stellaris LM3S devices?
No, the LM3S1608-IBZ50-A2 is not pin-compatible with other LM3S family members such as the LM3S811 or LM3S3748. Its 100-pin LQFP package and specific peripheral mapping (e.g., hibernation pins HIB, RTCCLK) differ. Migration requires PCB redesign and firmware adaptation - TI recommends evaluating the Tiva C series for newer designs requiring compatibility.
What debug interface does the LM3S1608-IBZ50-A2 support?
The LM3S1608-IBZ50-A2 supports IEEE 1149.1 JTAG debugging via dedicated TCK, TMS, TDI, TDO, and nTRST pins. It includes full SWD (Serial Wire Debug) capability through the same physical interface, enabling breakpoints, watchpoints, register inspection, and flash programming using standard tools like TI's Code Composer Studio or third-party OpenOCD-based debuggers.
LM3S1608-IBZ50-A2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 108-LFBGA
- Series:
- Stellaris® ARM® Cortex®-M3S 1000
- Packaging:
- Tray
- Product Status:
- Not For New Designs
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M3
- Core Size:
- 32-Bit Single-Core
- Speed:
- 50MHz
- Connectivity:
- I2C, IrDA, Microwire, SPI, SSI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, POR, PWM, WDT
- Number of I/O:
- 52
- Program Memory Size:
- 128KB (128K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 32K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.25V ~ 2.75V
- Data Converters:
- A/D 8x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
LM3S1608-IBZ50-A2 FAQ
1.How can I place an order for LM3S1608-IBZ50-A2 through Aetrix?
Please submit a Request for Quotation (RFQ) for LM3S1608-IBZ50-A2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LM3S1608-IBZ50-A2 reliable?
The price and inventory of LM3S1608-IBZ50-A2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LM3S1608-IBZ50-A2 is usually 5 days.
3.What payment methods are accepted for LM3S1608-IBZ50-A2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LM3S1608-IBZ50-A2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LM3S1608-IBZ50-A2?
LM3S1608-IBZ50-A2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LM3S1608-IBZ50-A2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LM3S1608-IBZ50-A2?
For technical support, including LM3S1608-IBZ50-A2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LM3S1608-IBZ50-A2 requirements.
6.How does Aetrix verify that LM3S1608-IBZ50-A2 is sourced from the original manufacturer or authorized distributors?
All LM3S1608-IBZ50-A2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LM3S1608-IBZ50-A2 meets industry standards.
7.What is the process for return or replacement of LM3S1608-IBZ50-A2?
All LM3S1608-IBZ50-A2 units undergo pre-shipment inspection (PSI). If there is an issue with LM3S1608-IBZ50-A2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LM3S1608-IBZ50-A2 part is unused and in its original packaging.
Return procedure for LM3S1608-IBZ50-A2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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