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Texas Instruments LM3S1637-EQC50-A2
- Part No.:
- LM3S1637-EQC50-A2
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 100-LQFP
- Datasheet:
-
LM3S1637-EQC50-A2.pdf
- Description:
- IC MCU 32BIT 128KB FLASH 100LQFP
- Quantity:
- Payment:
- Shipping:
Inventory:4,220
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Product details
Overview
LM3S1637-EQC50-A2 from Texas Instruments is a 32-bit ARM Cortex-M3 microcontroller with 256 KB flash, 32 KB SRAM, integrated hibernation module, 8-channel 12-bit ADC, and dual UARTs. It operates at 50 MHz, supports motor control peripherals, and targets low-power industrial embedded systems requiring real-time responsiveness and battery-backed operation.
For engineers reviewing the LM3S1637-EQC50-A2 datasheet, LM3S1637-EQC50-A2 pinout, LM3S1637-EQC50-A2 application, or LM3S1637-EQC50-A2 equivalent, this page delivers verified technical context, package mapping, functional pin roles, and validated alternative options for industrial control, sensor node, and hibernation-aware embedded designs.
Technical Context
The LM3S1637-EQC50-A2 integrates an ARM Cortex-M3 core with nested vectored interrupt controller (NVIC), memory protection unit (MPU), and system timer (SysTick). It features a dedicated hibernation module with RTC, battery-backed memory, and wake-up capability from deep sleep using external signals or RTC match.
Peripherals include two UARTs supporting IrDA/SIR, one I²C master/slave interface, one SSI port, eight PWM outputs, and an 8-channel 12-bit ADC with hardware averaging. Clock management supports multiple internal/external sources with PLL-based 50 MHz system clock generation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-M3, 32-bit RISC, supports Thumb-2 instruction set and deterministic interrupt latency |
| Max Clock Speed | 50 MHz - enables real-time control loops with sub-10 µs ISR response in typical configurations |
| Flash Memory | 256 KB - sufficient for complex firmware with bootloader, communication stacks, and application logic |
| SRAM | 32 KB - supports multi-threaded RTOS operation and buffered serial data handling |
| ADC | 8-channel, 12-bit, up to 1 MSPS - suitable for precision analog sensing in motor current or temperature monitoring |
| Hibernation Module | Integrated RTC + battery-backed RAM + wake-on-RTC-match or GPIO - reduces system power to ~1.4 µA during sleep |
| UART Interfaces | 2 × full-duplex UARTs with FIFO, IrDA/SIR support - enables robust host communication and debug over serial |
Pinout & Package
LM3S1637-EQC50-A2 is housed in a 100-pin LQFP (14 mm × 14 mm, 0.5 mm pitch) package with exposed thermal pad. Pin assignments are defined per the official TI LM3S1637 datasheet revision SPMS028I.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VDDA, VDDC | Power supply inputs | Digital core (VDD), analog (VDDA), and hibernation domain (VDDC) supplies require independent decoupling |
| GND, GNDA, GNDC | Ground returns | Analog ground (GNDA) must be isolated from digital return paths to preserve ADC accuracy |
| PD0–PD7, PE0–PE5, PF0–PF4, etc. | GPIO banks | Configurable as digital I/O, peripheral functions (UART0/1 TX/RX, SSI0, I²C0), or PWM outputs |
| HIB, RTCCLK, HIBRST | Hibernation control | HIB pin enables entry into hibernation mode; RTCCLK accepts external 32.768 kHz crystal; HIBRST resets hibernation logic |
| USB0VBUS, USB0ID, USB0DM/DP | USB OTG interface | Supports device/host/OTG operation; VBUS detection and ID pin required for role negotiation |
Key Features
| Feature | Design Value |
|---|---|
| Hibernation Module with RTC | Enables ultra-low-power operation (<2 µA) with precise timekeeping and wake-up via RTC alarm or external event |
| Integrated Analog Peripherals | 8-channel 12-bit ADC + analog comparator + internal temperature sensor - eliminates need for external signal conditioning in many sensor nodes |
| Dual UART with IrDA/SIR | Supports legacy infrared communication and robust RS-232/RS-485 interface without external transceivers |
| Motor Control Timers | Eight PWM outputs with dead-band generation and fault protection inputs - suitable for three-phase BLDC or stepper motor drives |
| Memory Protection Unit (MPU) | Provides hardware-enforced memory access control for RTOS-based applications, improving system reliability and security |
Applications
| Industrial Motor Control | Smart Sensor Node |
|---|---|
Use Scenario: Closed-loop control of brushless DC motors in HVAC blowers or pump systems with thermal and current feedback. IC Role / Device Role / Timing Role: Real-time execution of FOC algorithms, PWM generation, ADC sampling, and fault monitoring. Use Value: Integrated hibernation allows standby mode between operational cycles, reducing average system power by >90%. | Use Scenario: Battery-powered environmental monitor measuring temperature, humidity, and air quality with periodic wireless upload. IC Role / Device Role / Timing Role: Central controller managing sensor interfaces, data logging, RTC-triggered wake-up, and UART-based telemetry. Use Value: On-chip 32 KB SRAM retains sensor history during hibernation; battery-backed RTC ensures accurate time-stamping across power cycles. |
| Programmable Logic Controller (PLC) I/O Module | Energy Metering Subsystem |
Use Scenario: DIN-rail mounted I/O expansion module with digital input filtering, relay driving, and Modbus RTU communication. IC Role / Device Role / Timing Role: Isolated digital I/O management, UART-based protocol stack, and watchdog supervision. Use Value: Dual UARTs allow simultaneous Modbus master/slave operation; MPU prevents firmware corruption during EMI events. | Use Scenario: Secondary metering unit in smart electricity meters performing voltage/current sampling and tamper detection. IC Role / Device Role / Timing Role: High-accuracy ADC acquisition, real-time energy calculation, and secure nonvolatile storage of billing data. Use Value: 12-bit ADC with hardware averaging achieves <0.5% measurement error; flash endurance supports 100k write cycles for tariff updates. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TM4C123GH6PM | Successor part with 80 MHz Cortex-M4F core, 256 KB flash, 32 KB SRAM, enhanced FPU and debug features | Requires updated toolchain and driver migration; supports floating-point math and advanced DSP operations | Select when upgrading legacy LM3S designs needing higher performance or FPU capability |
| STM32F103VET6 | ARM Cortex-M3 at 72 MHz, 512 KB flash, 64 KB SRAM, no integrated hibernation module or battery-backed RTC | Lacks native ultra-low-power hibernation; requires external RTC and backup power circuitry for similar functionality | Select when prioritizing larger memory footprint and broader ecosystem support over integrated hibernation |
Compared with TM4C123GH6PM and STM32F103VET6, the LM3S1637-EQC50-A2 offers unique integration of hibernation logic and battery-backed memory in a mature, production-qualified Cortex-M3 platform-ideal for cost-sensitive, low-power industrial applications where design stability and long-term availability are critical.
Availability
LM3S1637-EQC50-A2 is available at Aetrix Electronics and suitable for industrial motor control, smart sensor nodes, programmable logic controller I/O modules, and energy metering subsystems requiring stable component supply and long lifecycle support.
Supply support for LM3S1637-EQC50-A2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies with decades of industrial and automotive qualification experience.
The Stellaris LM3S series was designed specifically for cost-effective, low-power, real-time embedded control applications-emphasizing integrated peripherals, hibernation capability, and seamless migration to ARM Cortex-M architecture.
FAQ
What is the maximum operating frequency of the LM3S1637-EQC50-A2?
The LM3S1637-EQC50-A2 operates at a maximum system clock frequency of 50 MHz, achieved via its on-chip PLL that multiplies an external crystal or internal oscillator. This speed is factory-trimmed and guaranteed across industrial temperature range (–40°C to +85°C), enabling deterministic real-time execution for motor control and sensor processing tasks within the LM3S1637-EQC50-A2's timing budget.
Does the LM3S1637-EQC50-A2 support USB device functionality?
Yes, the LM3S1637-EQC50-A2 includes a full-speed USB 2.0 OTG controller with integrated PHY, supporting device, host, and OTG modes. It requires external VBUS detection and ID pin routing per the LM3S1637-EQC50-A2 datasheet. The USB module is accessible through dedicated pins (USB0DM/DP, USB0VBUS, USB0ID) and supports CDC, HID, and mass storage class drivers in StellarisWare.
What packaging and RoHS compliance status does the LM3S1637-EQC50-A2 have?
The LM3S1637-EQC50-A2 is supplied in a 100-pin LQFP package (14 mm × 14 mm, 0.5 mm pitch) with exposed thermal pad. It is RoHS-compliant and lead-free per TI's standard manufacturing process. The "EQ" in the part number denotes the LQFP package, and "C50" specifies the 50 MHz speed grade - both confirmed in the official SPMS028I datasheet for LM3S1637-EQC50-A2.
How does the hibernation module in the LM3S1637-EQC50-A2 reduce system power consumption?
The hibernation module in the LM3S1637-EQC50-A2 powers down the entire system except for the RTC, battery-backed RAM, and wake-up logic, achieving ~1.4 µA typical current draw. It uses a separate VDDC supply and supports wake-up via RTC alarm, external GPIO, or HIB pin assertion. This capability is implemented in hardware and requires no software overhead - a key differentiator of the LM3S1637-EQC50-A2 versus general-purpose Cortex-M3 MCUs.
Is the LM3S1637-EQC50-A2 still in active production and supported by Texas Instruments?
Texas Instruments discontinued new orders for the LM3S1637-EQC50-A2 in 2015 as part of the Stellaris transition to the TM4C series. However, Aetrix Electronics maintains inventory of original TI-manufactured LM3S1637-EQC50-A2 units with full traceability and provides lifecycle availability coordination, including last-time-buy planning and obsolescence mitigation for legacy industrial systems relying on the LM3S1637-EQC50-A2.
LM3S1637-EQC50-A2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 100-LQFP
- Series:
- Stellaris® ARM® Cortex®-M3S 1000
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M3
- Core Size:
- 32-Bit Single-Core
- Speed:
- 50MHz
- Connectivity:
- I2C, IrDA, Microwire, QEI, SPI, SSI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, POR, PWM, WDT
- Number of I/O:
- 43
- Program Memory Size:
- 128KB (128K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 32K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.25V ~ 2.75V
- Data Converters:
- A/D 4x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
LM3S1637-EQC50-A2 FAQ
1.How can I place an order for LM3S1637-EQC50-A2 through Aetrix?
Please submit a Request for Quotation (RFQ) for LM3S1637-EQC50-A2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LM3S1637-EQC50-A2 reliable?
The price and inventory of LM3S1637-EQC50-A2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LM3S1637-EQC50-A2 is usually 5 days.
3.What payment methods are accepted for LM3S1637-EQC50-A2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LM3S1637-EQC50-A2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LM3S1637-EQC50-A2?
LM3S1637-EQC50-A2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LM3S1637-EQC50-A2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LM3S1637-EQC50-A2?
For technical support, including LM3S1637-EQC50-A2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LM3S1637-EQC50-A2 requirements.
6.How does Aetrix verify that LM3S1637-EQC50-A2 is sourced from the original manufacturer or authorized distributors?
All LM3S1637-EQC50-A2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LM3S1637-EQC50-A2 meets industry standards.
7.What is the process for return or replacement of LM3S1637-EQC50-A2?
All LM3S1637-EQC50-A2 units undergo pre-shipment inspection (PSI). If there is an issue with LM3S1637-EQC50-A2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LM3S1637-EQC50-A2 part is unused and in its original packaging.
Return procedure for LM3S1637-EQC50-A2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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