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Texas Instruments LM3S1637-IBZ50-A2
- Part No.:
- LM3S1637-IBZ50-A2
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 108-LFBGA
- Datasheet:
-
LM3S1637-IBZ50-A2.pdf
- Description:
- IC MCU 32BIT 128KB FLASH 108BGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,660
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Product details
Overview
LM3S1637-IBZ50-A2 from Texas Instruments is a 32-bit ARM Cortex-M3 microcontroller with 256 KB flash, 32 KB SRAM, integrated hibernation module, 8-channel 12-bit ADC, dual UARTs, I²C, SSI, PWM, and analog comparator - designed for low-power industrial control and motor drive applications.
For engineers reviewing the LM3S1637-IBZ50-A2 datasheet, LM3S1637-IBZ50-A2 pinout, LM3S1637-IBZ50-A2 application, or LM3S1637-IBZ50-A2 equivalent, key selection criteria include hibernation-capable real-time clock support, 50 MHz operation at industrial temperature range (–40°C to +85°C), and QFP-100 package compatibility with Stellaris LM3S series peripheral register mapping.
Technical Context
The LM3S1637-IBZ50-A2 implements the ARMv7-M architecture with NVIC, SysTick, MPU, and debug interfaces including JTAG and SWD. It integrates a hibernation module with battery-backed RTC and 2 KB SRAM, enabling sub-μA sleep current and wake-on-RTC-match or external GPIO event.
Peripherals include two UARTs supporting IrDA/SIR, one I²C master/slave controller, two SSI modules, eight 16-bit GPTM timers (with PWM and RTC modes), and an 8-channel 12-bit ADC with hardware averaging and internal temperature sensor - all accessible via memory-mapped registers with consistent StellarisWare® driver support.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-M3, 32-bit RISC, runs Thumb-2 instructions at up to 50 MHz |
| Flash Memory | 256 KB on-chip flash with 128-bit wide interface and 128-byte erase blocks |
| SRAM | 32 KB general-purpose SRAM plus 2 KB hibernation-mode battery-backed RAM |
| ADC | 8-channel 12-bit SAR ADC with 1 MSPS sample rate and hardware averaging up to 64 samples |
| Hibernation Module | Supports RTC, battery management, and wake-on-RTC match or external pin with <1 μA typical current |
| Operating Temp | –40°C to +85°C industrial grade, qualified per AEC-Q100 Class 2 (not automotive) |
| Package | 100-pin LQFP (14 mm × 14 mm), 0.5 mm pitch, RoHS-compliant |
Pinout & Package
LM3S1637-IBZ50-A2 is housed in a 100-pin LQFP (Low-Profile Quad Flat Package) with exposed thermal pad, compatible with standard QFP reflow profiles and manual soldering using TI-recommended guidelines.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD, VDDA, VDDC | Power supply inputs | Digital core (VDD), analog (VDDA), and hibernation (VDDC) rails require separate 3.3 V filtering |
| GND, GNDA, GNDC | Ground returns | Analog ground (GNDA) and hibernation ground (GNDC) must be star-connected to minimize noise coupling |
| PD0–PD7, PE0–PE5, PF0–PF4, etc. | GPIO ports | Multi-function pins configurable as digital I/O, UART, SSI, I²C, PWM, or ADC inputs with slew-rate and drive-strength control |
| HIB, RTCCLK, HIBRST | Hibernation control | HIB pin enables hibernation mode; RTCCLK accepts external 32.768 kHz crystal; HIBRST resets hibernation logic |
| JTAG/SWD | Debug interface | TCK, TMS, TDI, TDO, nTRST, SWDIO, SWCLK support full debug access and firmware programming |
Key Features
| Feature | Design Value |
|---|---|
| Hibernation Mode | Enables sub-1 μA system sleep with RTC wake-up, battery-backed RAM retention, and fast resume (<100 μs) |
| Integrated Analog | On-chip 12-bit ADC with internal temperature sensor and hardware averaging reduces BOM cost and layout area |
| Motor Control Peripherals | Eight 16-bit timers with PWM generation, dead-band insertion, and fault input support for BLDC/stepper drive timing |
| Communication Flexibility | Dual UARTs (one with IrDA), I²C, and dual SSI allow concurrent serial protocols without external bridging logic |
| Memory Protection | Configurable MPU supports region-based access control for secure firmware partitioning and RTOS task isolation |
Applications
| Industrial Motor Control | Smart Sensor Node |
|---|---|
Use Scenario: Closed-loop control of brushless DC motors in HVAC blowers and pump drives requiring precise timing and fault response. IC Role / Device Role / Timing Role: Central controller executing FOC algorithms, managing PWM outputs, reading current/voltage feedback via ADC, and monitoring thermal sensors. Use Value: Integrated hibernation allows standby power reduction during idle periods while maintaining RTC-triggered maintenance cycles. | Use Scenario: Battery-powered environmental monitor collecting temperature, humidity, and pressure data at 1-minute intervals. IC Role / Device Role / Timing Role: System-on-chip host managing sensor I²C reads, ADC sampling, data logging to flash, and low-power wireless transmission scheduling. Use Value: Sub-μA hibernation current extends battery life beyond 5 years using coin-cell power with RTC wake-up precision ±10 ppm. |
| Programmable Logic Controller (PLC) I/O Module | Energy Metering Interface |
Use Scenario: DIN-rail mounted remote I/O terminal converting fieldbus signals (Modbus RTU over RS-485) to Ethernet backhaul. IC Role / Device Role / Timing Role: Protocol gateway handling UART-to-TCP translation, digital input debouncing, and isolated output PWM control. Use Value: Dual UARTs with hardware FIFOs and IrDA support enable robust serial protocol handling without CPU overhead. | Use Scenario: Residential smart meter interfacing with shunt-based current sensing and optical pulse output for utility billing. IC Role / Device Role / Timing Role: Precision measurement controller performing synchronized voltage/current sampling, RMS calculation, and tamper detection. Use Value: 12-bit ADC with hardware averaging and internal reference ensures ±0.5% energy measurement accuracy across temperature. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Tiva C TM4C123GH6PM | Successor part with same pinout, 80 MHz Cortex-M4F, FPU, enhanced peripherals, and updated StellarisWare → TivaWare migration path | Requires firmware update for FPU use and peripheral register changes; supports USB host/device and CAN | Recommended for new designs needing higher performance, floating-point math, or USB connectivity |
| LM3S811-IQN50-A2 | Legacy sibling with 64 KB flash, 256-byte hibernation RAM, no SSI, single UART, and reduced timer count | Limited peripheral set restricts use to simpler control tasks; lacks hibernation RTC match capability | Suitable only for cost-sensitive legacy replacements where full LM3S1637 feature set is unused |
Compared with LM3S1637-IBZ50-A2, TM4C123GH6PM delivers 60% higher CPU throughput and added cryptographic acceleration but requires PCB redesign for USB routing; LM3S811-IQN50-A2 retains identical footprint but sacrifices hibernation depth and communication flexibility.
Availability
LM3S1637-IBZ50-A2 is available at Aetrix Electronics and suitable for industrial motor control, smart sensor nodes, PLC I/O modules, and energy metering interfaces requiring stable component supply and long-term lifecycle support.
Supply support for LM3S1637-IBZ50-A2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader headquartered in Dallas, Texas, delivering analog, embedded processing, and connectivity solutions since 1930.
The Stellaris LM3S family was engineered for deterministic real-time control in resource-constrained industrial environments, emphasizing low-power hibernation, integrated analog, and robust peripheral sets for standalone MCU applications.
FAQ
What is the maximum operating frequency of the LM3S1637-IBZ50-A2?
The LM3S1637-IBZ50-A2 operates at a maximum system clock frequency of 50 MHz, derived from its internal PLL or external crystal oscillator. This speed is guaranteed across the full industrial temperature range (–40°C to +85°C) and under specified supply voltage conditions (3.0 V to 3.6 V). The LM3S1637-IBZ50-A2 achieves this performance using the ARM Cortex-M3 core with zero-wait-state flash execution at rated frequency.
Does the LM3S1637-IBZ50-A2 support hibernation mode with RTC wake-up?
Yes, the LM3S1637-IBZ50-A2 includes a dedicated hibernation module that supports deep-sleep mode with real-time clock (RTC) wake-up capability. It retains 2 KB of SRAM and maintains RTC timekeeping using a 32.768 kHz crystal or external clock source. Wake events include RTC match, external GPIO assertion, or HIB pin transition. The LM3S1637-IBZ50-A2 achieves typical hibernation current below 1 μA when configured per TI design guidelines.
What communication interfaces are integrated into the LM3S1637-IBZ50-A2?
The LM3S1637-IBZ50-A2 integrates dual UARTs (one supporting IrDA), one I²C master/slave controller, two SSI modules (SPI-compatible), and a programmable watchdog timer with interrupt capability. These interfaces share common GPIO pins via peripheral multiplexing and are fully supported by TI's StellarisWare Peripheral Driver Library. The LM3S1637-IBZ50-A2 does not include USB or CAN controllers.
Is the LM3S1637-IBZ50-A2 pin-compatible with other Stellaris LM3S devices?
The LM3S1637-IBZ50-A2 uses a 100-pin LQFP package shared with several LM3S variants, including LM3S811-IQN50-A2 and LM3S9B92-IQC50-A2, but pin functions differ significantly across models due to peripheral count and routing constraints. While physical footprint matches, signal mapping and power/ground pin assignments are not interchangeable. The LM3S1637-IBZ50-A2 requires its specific pinout table and cannot be substituted without schematic and layout review.
What development tools support the LM3S1637-IBZ50-A2?
The LM3S1637-IBZ50-A2 is supported by TI's Code Composer Studio v5.x and earlier, Keil MDK-ARM v4.7x, and IAR Embedded Workbench for ARM v6.5x. TI provides StellarisWare Peripheral Driver Library and example projects targeting the LM3S1637-IBZ50-A2 specifically. Debugging is enabled via JTAG or SWD using XDS100v2 or ICDI-based debug probes. The LM3S1637-IBZ50-A2 does not support newer TI Cloud tools or SysConfig configuration utilities.
LM3S1637-IBZ50-A2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 108-LFBGA
- Series:
- Stellaris® ARM® Cortex®-M3S 1000
- Packaging:
- Tray
- Product Status:
- Not For New Designs
- Programmable:
- Not Verified
- Core Processor:
- ARM® Cortex®-M3
- Core Size:
- 32-Bit Single-Core
- Speed:
- 50MHz
- Connectivity:
- I2C, IrDA, Microwire, QEI, SPI, SSI, UART/USART
- Peripherals:
- Brown-out Detect/Reset, POR, PWM, WDT
- Number of I/O:
- 43
- Program Memory Size:
- 128KB (128K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 32K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.25V ~ 2.75V
- Data Converters:
- A/D 4x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
LM3S1637-IBZ50-A2 FAQ
1.How can I place an order for LM3S1637-IBZ50-A2 through Aetrix?
Please submit a Request for Quotation (RFQ) for LM3S1637-IBZ50-A2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for LM3S1637-IBZ50-A2 reliable?
The price and inventory of LM3S1637-IBZ50-A2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for LM3S1637-IBZ50-A2 is usually 5 days.
3.What payment methods are accepted for LM3S1637-IBZ50-A2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for LM3S1637-IBZ50-A2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for LM3S1637-IBZ50-A2?
LM3S1637-IBZ50-A2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your LM3S1637-IBZ50-A2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for LM3S1637-IBZ50-A2?
For technical support, including LM3S1637-IBZ50-A2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your LM3S1637-IBZ50-A2 requirements.
6.How does Aetrix verify that LM3S1637-IBZ50-A2 is sourced from the original manufacturer or authorized distributors?
All LM3S1637-IBZ50-A2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that LM3S1637-IBZ50-A2 meets industry standards.
7.What is the process for return or replacement of LM3S1637-IBZ50-A2?
All LM3S1637-IBZ50-A2 units undergo pre-shipment inspection (PSI). If there is an issue with LM3S1637-IBZ50-A2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The LM3S1637-IBZ50-A2 part is unused and in its original packaging.
Return procedure for LM3S1637-IBZ50-A2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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